Specifications
| Type | Description |
|---|---|
| Part Number | XL-1608UYC-04 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 1608 SMD LED, 1.6 x 0.8 x 0.4 mm |
| Outline Dimensions | 1.6 x 0.8 x 0.4 mm; L/W/H |
| Luminous Color | Yellow; transparent/water colloid |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Complied with RoHS Directive |
| Maximum Power Dissipation | 50 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Withstand Voltage | 2000 V; Ta=25°C |
| Operating Temperature Range | -40 to +85°C; Ta=25°C rating table |
| Storage Temperature Range | -40 to +85°C; Ta=25°C rating table |
| Lead Soldering Temperature/Time | 260°C <=6 s; absolute maximum rating |
| Luminous Intensity | 80-200 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 585-595 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 590 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 1.8-2.4 V; IF=20 mA, Ta=25°C |
| Half Wave Width | 20 nm typ; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; VR=5 V, Ta=25°C |
| Brightness Bin D2 | 80-120 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D3 | 120-150 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D4 | 150-180 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D5 | 180-210 mcd; IF=20 mA, brightness error ±10% |
| Voltage Bin M17-9 | 1.8-1.9 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-1 | 1.9-2.0 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-2 | 2.0-2.1 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-3 | 2.1-2.2 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-4 | 2.2-2.3 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-5 | 2.3-2.4 V; IF=20 mA, voltage error ±0.1 V |
| Wavelength Bin HY03 | 585-587.5 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HY04 | 587.5-590 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HY05 | 590-592.5 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HY06 | 592.5-595 nm; IF=20 mA, wavelength error ±1 nm |
| Manual Soldering Iron Power | <30 W recommended; hand soldering for repair/rework |
| Manual Soldering Temperature | <300°C; each terminal once, less than 3 seconds |
| Recommended Maximum Reflow Temperature | 240±5°C for 6 s |
| Reflow Soldering Cycles | Maximum 2 times |
| Unopened Storage Condition | <=30°C, <60% RH, within 1 year |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours |
| Baking Condition | 60±5°C for 24 hours |
| Datasheet Status | request_only |
Product Overview
Electrical ratings at Ta=25°C include 50 mW maximum power dissipation, 20 mA maximum continuous forward current, 80 mA peak forward current for pulse width <=0.1 ms and duty <=1/10, 5 V maximum reverse voltage, and 2000 V ESD withstand voltage. Operating and storage temperature ranges are both -40 to +85°C.
Optical characteristics at IF=20 mA and Ta=25°C include 80-200 mcd luminous intensity, 585-595 nm dominant wavelength, 590 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle. Forward voltage is specified from 1.8-2.4 V, while reverse current is <=1 µA at VR=5 V.
Assembly guidance includes MSL 3 handling, RoHS compliance, lead soldering at 260°C for <=6 s, recommended reflow maximum of 240±5°C for 6 s, and a maximum of two reflow cycles.
Key Features
- Yellow SMD chip LED in 1608 package
- 1.6 x 0.8 x 0.4 mm outline dimensions
- 80-200 mcd luminous intensity at 20 mA
- 585-595 nm dominant wavelength range
- 590 nm typical peak wavelength
- 1.8-2.4 V forward voltage at 20 mA
- 120° typical viewing angle
- 20 mA maximum continuous forward current
- 5 V maximum reverse voltage rating
- 2000 V ESD withstand voltage
- MSL 3 moisture sensitivity level
- RoHS Directive compliance stated
Typical Applications
- Compact yellow status indicators
- Front-panel indicator lights
- Small display marking
- PCB-mounted signal indication
- Portable equipment indicators
- Backlighting for small controls
- Color-binned yellow LED assemblies
Procurement Notes
When requesting a quote for XL-1608UYC-04, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Alternatives
LITEON
LTST-C193KSKT-5A
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
LITEON
19-217/Y5C-AP1Q2/3T
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
Application Verification Recommended
Related Technical Articles
FAQ
What package is used for XL-1608UYC-04?
XL-1608UYC-04 uses a 1608 SMD LED package with 1.6 x 0.8 x 0.4 mm outline dimensions. The product type is listed as a yellow SMD chip LED.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 80-200 mcd luminous intensity, 585-595 nm dominant wavelength, 590 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle.
What forward voltage range does this LED specify?
The forward voltage for XL-1608UYC-04 is specified as 1.8-2.4 V at IF=20 mA and Ta=25°C. The datasheet also lists voltage bins from 1.8-1.9 V through 2.3-2.4 V.
What handling and soldering limits are stated?
The datasheet states MSL 3, lead soldering at 260°C for <=6 s, manual soldering below 300°C for less than 3 seconds per terminal, recommended reflow maximum of 240±5°C for 6 s, and maximum two reflow cycles.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.