Specifications
| Type | Description |
|---|---|
| Part Number | XL-5050SURC-FJ |
| Manufacturer | XINGLIGHT |
| Product Type | High brightness red SMD LED |
| Category | LED |
| Package/Case | 5050 SMD LED, 5.0 x 5.0 x 1.6 mm |
| Package Dimensions | 5.0 x 5.0 x 1.6 mm |
| Emitted Color | High brightness red |
| Lens / Colloid | Water clear / transparent colloid |
| RoHS Compliance | Complies with RoHS Directive |
| Moisture Sensitivity Level | MSL 3 |
| Maximum Power Dissipation | 200 mW, Ta=25°C |
| Maximum Continuous Forward Current | 60 mA, Ta=25°C |
| Peak Forward Current | 120 mA, pulse width ≤0.1 ms, duty ≤1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V, Ta=25°C |
| ESD Rating | 2000 V antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85°C |
| Storage Temperature Range | -40 to +85°C |
| Lead Soldering Temperature / Time | 260°C, ≤6 s |
| Luminous Intensity | 1600 min, 2000 typ, 2400 max mcd, IF=60 mA, Ta=25°C |
| Dominant Wavelength | 615 min, 625 typ, 630 max nm, IF=60 mA, Ta=25°C |
| Peak Wavelength | 625 nm typ, IF=60 mA, Ta=25°C |
| Forward Voltage | 1.8 min, 2.4 max V, IF=60 mA, Ta=25°C |
| Viewing Angle | 120° typ, 2θ1/2, IF=60 mA, Ta=25°C |
| Half Wave Width | 20 nm typ, IF=60 mA, Ta=25°C |
| Reverse Current | ≤5 µA, VR=5 V, Ta=25°C |
| Brightness Bin F5 | 1600 to 1800 mcd, IF=60 mA |
| Brightness Bin F6 | 1800 to 2000 mcd, IF=60 mA |
| Brightness Bin F7 | 2000 to 2200 mcd, IF=60 mA |
| Brightness Bin F8 | 2200 to 2400 mcd, IF=60 mA |
| Voltage Bin N12-7 | 1.8 to 2.0 V, IF=60 mA |
| Voltage Bin N12-8 | 2.0 to 2.2 V, IF=60 mA |
| Voltage Bin N12-9 | 2.2 to 2.4 V, IF=60 mA |
| Wavelength Bin HR01 | 615 to 620 nm, IF=60 mA |
| Wavelength Bin HR02 | 620 to 625 nm, IF=60 mA |
| Wavelength Bin HR03 | 625 to 630 nm, IF=60 mA |
| Default Test Ambient Temperature | 25±5°C unless otherwise indicated |
| Reflow Cycle Limit | Maximum 2 times |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s |
| Hand Soldering Iron Power | <30 W, manual welding only for repair/rework |
| Hand Soldering Temperature | <300°C, each terminal less than 3 s, one time only |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C, keep 5-10 s, above 217°C for 60-120 s, heat-up max 3°C/s, cooling max 6°C/s |
| Leaded Reflow Peak Temperature | 235°C +5/-0°C, keep 10-15 s, above 183°C for 60-150 s, heat-up max 3°C/s |
| Storage Before Opening | ≤30°C, ≤60% RH, use within 1 year |
| Storage After Opening | ≤30°C, ≤40% RH, solder within 168 hours / 7 days |
| Baking Condition | 60±5°C for 24 hours if desiccant fades or storage time exceeded |
| Dimensional Tolerance | ±0.25 mm unless otherwise noted |
| Tape/Reel Dimensional Tolerance | ±0.1 mm for belt and disk dimensions |
| Datasheet Source | Manufacturer technical datasheet |
| Datasheet Status | request_only |
Product Overview
XL-5050SURC-FJ is a XINGLIGHT high brightness red SMD LED supplied in a 5050 surface-mount package. The package dimensions are 5.0 x 5.0 x 1.6 mm, with a water clear / transparent colloid lens structure and dimensional tolerance of ±0.25 mm unless otherwise noted.
At IF=60 mA and Ta=25°C, the device provides 1600 to 2400 mcd luminous intensity, 615 to 630 nm dominant wavelength, 625 nm typical peak wavelength, and 120° typical viewing angle. Electrical ratings include 60 mA maximum continuous forward current, 120 mA peak forward current under the specified pulse condition, 200 mW maximum power dissipation, 5 V maximum reverse voltage, and 2000 V ESD rating.
Assembly handling is defined for SMT production, with RoHS compliance and MSL 3 moisture sensitivity. Reflow is limited to a maximum of 2 cycles, with lead-free and leaded peak temperature profiles specified. Storage, opening, and baking conditions are also defined for moisture control before soldering.
Key Features
- High brightness red emission in 5050 SMD package
- 5.0 x 5.0 x 1.6 mm outline dimensions
- Water clear / transparent colloid lens construction
- 1600 to 2400 mcd luminous intensity at 60 mA
- 615 to 630 nm dominant wavelength range
- 1.8 to 2.4 V forward voltage at 60 mA
- 120° typical viewing angle at 60 mA
- 60 mA maximum continuous forward current
- 2000 V ESD rating at Ta=25°C
- RoHS compliant and MSL 3 rated
- Lead-free reflow peak temperature 255°C +0/-5°C
- Storage after opening limited to 168 hours
Typical Applications
- SMT automatic production assemblies
- Red indicator lighting
- Surface-mount LED displays
- Wide-angle red status signals
- RoHS-compliant electronic assemblies
- Moisture-controlled reflow production
- Repair or rework hand soldering
Procurement Notes
When requesting a quote for XL-5050SURC-FJ, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of LED is XL-5050SURC-FJ?
XL-5050SURC-FJ is a XINGLIGHT high brightness red SMD LED in a 5050 package. The datasheet lists a 5.0 x 5.0 x 1.6 mm outline and suitability for SMT automatic production.
What optical output does XL-5050SURC-FJ specify?
At IF=60 mA and Ta=25°C, the part specifies 1600 to 2400 mcd luminous intensity, 615 to 630 nm dominant wavelength, 625 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle.
What current and voltage ratings apply to this LED?
The datasheet lists 60 mA maximum continuous forward current, 120 mA peak forward current under pulse width ≤0.1 ms and duty ≤1/10, 1.8 to 2.4 V forward voltage at 60 mA, and 5 V maximum reverse voltage.
What handling and soldering limits are specified?
XL-5050SURC-FJ is MSL 3. Reflow soldering is limited to a maximum of 2 times. The recommended maximum welding temperature is 240±5°C for 6 s, with separate lead-free and leaded reflow peak profiles specified.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.
