Specifications
| Type | Description |
|---|---|
| Part Number | XL-5050UBC |
| Manufacturer | XINGLIGHT |
| Product Type | High brightness blue SMD LED |
| Category | LED |
| Package/Case | 5050 SMD LED, 5.0 x 5.0 x 1.6 mm |
| Package Dimensions | 5.0 x 5.0 x 1.6 mm |
| Emitted Color | High brightness blue |
| Lens / Colloid | Water clear colloid / transparent colloid |
| RoHS Compliance | Complies with RoHS Directive |
| Moisture Sensitivity Level | MSL 3 |
| SMT Compatibility | Suitable for SMT automatic production |
| Reflow Process Compatibility | Suitable for infrared reflow soldering process |
| Maximum Power Dissipation | 200 mW at Ta=25°C |
| Maximum Continuous Forward Current | 20*3 = 60 mA at Ta=25°C |
| Peak Forward Current | 120 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V at Ta=25°C |
| ESD Rating | 2000 V antistatic ability; test model not specified |
| Operating Temperature Range | -40 to +85°C |
| Storage Temperature Range | -40 to +85°C |
| Lead Soldering Temperature / Time | 260°C <=6 s |
| Luminous Intensity | 1400 min, 1800 typ, 2200 max mcd at IF=60 mA, Ta=25°C |
| Dominant Wavelength | 455 min, 470 max nm at IF=60 mA, Ta=25°C |
| Peak Wavelength | 460 typ nm at IF=60 mA, Ta=25°C |
| Forward Voltage | 2.8 min, 3.4 max V at IF=60 mA, Ta=25°C |
| Viewing Angle | 120° typ, 2θ1/2, IF=60 mA, Ta=25°C |
| Half Wave Width | 25 typ nm at IF=60 mA, Ta=25°C |
| Reverse Current | <=5 µA at VR=5 V, Ta=25°C |
| Optical Measurement Tolerance | Luminous intensity error ±10%; wavelength error ±1 nm |
| Voltage Measurement Tolerance | Forward voltage drop error ±0.1 V |
| Chromaticity Coordinate Tolerance | X,Y coordinate deviation ±0.01 |
| Brightness Bin F4 | 1450 to 1600 mcd at IF=60 mA |
| Brightness Bin F5 | 1600 to 1800 mcd at IF=60 mA |
| Brightness Bin F6 | 1800 to 2000 mcd at IF=60 mA |
| Brightness Bin F7 | 2000 to 2200 mcd at IF=60 mA |
| Voltage Bin N13-3 | 2.8 to 3.0 V at IF=60 mA |
| Voltage Bin N13-4 | 3.0 to 3.2 V at IF=60 mA |
| Voltage Bin N13-5 | 3.2 to 3.4 V at IF=60 mA |
| Dominant Wavelength Bin HB03 | 455 to 460 nm at IF=60 mA |
| Dominant Wavelength Bin HB04 | 460 to 465 nm at IF=60 mA |
| Dominant Wavelength Bin HB05 | 465 to 470 nm at IF=60 mA |
| Test Environment Temperature | 25±5°C unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours; Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours at Ta=85±5°C |
| Low Temperature Storage Test | Ta=-40±5°C; test duration unclear in extracted text |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100±5°C for 20 min to -40±5°C for 20 min |
| Anti-Tin Test | 260±5°C, 10±1 s, 2 times |
| Lead Reflow Profile | Peak 235°C +5/-0°C, time at peak 10-15 s; ramp max 3°C/s from 183°C to peak; 125±25°C <=120 s; above 183°C for 60-150 s |
| Lead-Free Reflow Profile | Peak 255°C +0/-5°C, time at peak 5-10 s; ramp max 3°C/s from 217°C to peak; 175±25°C <=180 s; above 217°C for 60-120 s; cooling max 6°C/s |
| Weldability Test | Tin loading rate >=95% pad area; 235±5°C, 25±2.5 mm/s immersion speed, 2±0.5 s immersion time |
| Mechanical Dimension Tolerance | ±0.25 mm unless otherwise noted |
| Tape/Reel Dimensional Tolerance | ±0.1 mm; belt and disk dimensions in mm |
| Hand Soldering Limit | Soldering iron <30 W, temperature <300°C, <3 s per terminal, one time only |
| Maximum Reflow Cycles | No more than 2 times |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s |
| Cleaning Conditions | Alcohol cleaning under 30°C for 3 min or under 50°C for 30 s after soldering |
| Ultrasonic Cleaning Power | <=300 W recommended maximum; pretest required to confirm no LED damage |
| Unopened Storage Conditions | <=30°C, <=60% RH, use within 1 year |
| Opened Storage Conditions | <=30°C, <=40% RH, solder within 168 hours / 7 days |
| Recommended Workshop Conditions | <=30°C and <=60% RH |
| Baking Condition | 60±5°C for 24 hours if desiccant/package fails or storage time exceeded |
| Design Current Limit | Current through each LED must not exceed absolute maximum rating; use protective resistors; constant-current regulation recommended |
| Datasheet Status | request_only |
Product Overview
XL-5050UBC is a XINGLIGHT high brightness blue SMD LED built in a 5050 surface-mount package. The outline dimensions are 5.0 x 5.0 x 1.6 mm, with a water clear or transparent colloid. The emitted color is high brightness blue, with dominant wavelength specified from 455 to 470 nm and typical peak wavelength of 460 nm at IF=60 mA and Ta=25°C.
Electrical ratings include 200 mW maximum power dissipation, 60 mA maximum continuous forward current, 120 mA peak forward current under pulse conditions, and 5 V maximum reverse voltage. Optical performance is specified as 1400 mcd minimum, 1800 mcd typical, and 2200 mcd maximum luminous intensity, with a 120 degree typical viewing angle and 25 nm typical half wave width.
The device is suitable for SMT automatic production and infrared reflow soldering. Process data includes lead and lead-free reflow profiles, no more than two reflow cycles, MSL 3 handling, defined storage limits, and baking at 60±5°C for 24 hours when required.
Key Features
- 5050 SMD package, 5.0 x 5.0 x 1.6 mm
- High brightness blue emission with transparent colloid
- 455 to 470 nm dominant wavelength range
- 1400 to 2200 mcd luminous intensity at 60 mA
- 2.8 to 3.4 V forward voltage at 60 mA
- 120 degree typical viewing angle
- RoHS compliant with MSL 3 moisture sensitivity
- Suitable for SMT automatic production
- Suitable for infrared reflow soldering
- Operating temperature range from -40 to +85°C
Typical Applications
- SMT automatic production
- Infrared reflow soldered assemblies
- Blue SMD LED board placement
- RoHS-compliant LED assemblies
- 5050 package LED designs
- Constant-current regulated LED circuits
Procurement Notes
When requesting a quote for XL-5050UBC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Alternatives
TOGIALED
TJ-S5050UG2W5TLC6B-A5
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
Application Verification Recommended
Related Technical Articles
FAQ
What package is used for XL-5050UBC?
XL-5050UBC uses a 5050 SMD LED package with outline dimensions of 5.0 x 5.0 x 1.6 mm. The mechanical dimension tolerance is ±0.25 mm unless otherwise noted.
What are the main optical ratings of XL-5050UBC?
At IF=60 mA and Ta=25°C, XL-5050UBC is specified for 1400 to 2200 mcd luminous intensity, 455 to 470 nm dominant wavelength, 460 nm typical peak wavelength, and 120 degree typical viewing angle.
What forward voltage and current limits apply?
The forward voltage is specified from 2.8 to 3.4 V at IF=60 mA and Ta=25°C. The maximum continuous forward current is 20*3 = 60 mA, and the peak forward current is 120 mA under the stated pulse condition.
How should XL-5050UBC be stored after opening?
After opening the moisture-proof anti-electrostatic package, storage should be <=30°C and <=40% RH, and soldering should be completed within 168 hours or 7 days. Baking is specified at 60±5°C for 24 hours when required.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.