Specifications
| Type | Description |
|---|---|
| Part Number | XL-5050UGC-A |
| Manufacturer | XINGLIGHT |
| Product Type | High brightness green SMD LED |
| Category | LED |
| Package/Case | 5050 SMD LED, 5.0 x 5.0 x 1.6 mm |
| Package Dimensions | 5.0 x 5.0 x 1.6 mm, L/W/H |
| Emitted Color | High brightness green |
| Lens / Colloid | Water clear colloid / transparent colloid |
| RoHS Compliance | Complied with RoHS Directive; environmental protection process |
| Moisture Sensitivity Level | MSL 3 |
| Packaging Standard | EIA standard packaging |
| SMT Compatibility | Suitable for SMT automatic production |
| Maximum Power Dissipation | 200 mW at Ta=25°C |
| Maximum Continuous Forward Current | 60 mA, 20 mA x 3, at Ta=25°C |
| Peak Forward Current | 120 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V at Ta=25°C |
| ESD Rating | 2000 V antistatic ability, method not specified |
| Operating Temperature Range | -40 to +85°C |
| Storage Temperature Range | -40 to +85°C |
| Lead Soldering Temperature / Time | 260°C, <=6 s absolute maximum rating |
| Luminous Intensity | 4000-6000 mcd at IF=60 mA, Ta=25°C |
| Dominant Wavelength | 515-530 nm at IF=60 mA, Ta=25°C |
| Peak Wavelength | 525 nm typ at IF=60 mA, Ta=25°C |
| Forward Voltage | 2.8-3.4 V at IF=60 mA, Ta=25°C |
| Viewing Angle | 120° typ, 2θ1/2, at IF=60 mA, Ta=25°C |
| Half Wave Width | 30 nm typ at IF=60 mA, Ta=25°C |
| Reverse Current | <=5 µA at VR=5 V, Ta=25°C |
| Brightness Bin G6 | 4100-4500 mcd at IF=60 mA |
| Brightness Bin G7 | 4500-5000 mcd at IF=60 mA |
| Brightness Bin G8 | 5000-5500 mcd at IF=60 mA |
| Brightness Bin G9 | 5500-6000 mcd at IF=60 mA |
| Voltage Bin N13-3 | 2.8-3.0 V at IF=60 mA |
| Voltage Bin N13-4 | 3.0-3.2 V at IF=60 mA |
| Voltage Bin N13-5 | 3.2-3.4 V at IF=60 mA |
| Dominant Wavelength Bin HG02 | 515-520 nm at IF=60 mA |
| Dominant Wavelength Bin HG03 | 520-525 nm at IF=60 mA |
| Dominant Wavelength Bin HG04 | 525-530 nm at IF=60 mA |
| Default Test Ambient Temperature | 25±5°C unless otherwise indicated |
| Dimension Tolerance | ±0.25 mm unless otherwise noted |
| Tape / Reel Dimension Tolerance | ±0.1 mm for belt and disk dimensions |
| Manual Soldering Iron Power | <30 W for hand soldering repair/rework only |
| Manual Soldering Temperature | <300°C, each terminal once only, <3 s |
| Reflow Soldering Limit | Maximum 2 times |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C; peak 5-10 s; above 217°C for 60-120 s; max heating 3°C/s; max cooling 6°C/s |
| Leaded Reflow Peak Temperature | 235°C +5/-0°C; peak 10-15 s; above 183°C for 60-150 s; max heating 3°C/s |
| Post-Solder Cleaning | Alcohol cleaning recommended; under 30°C for 3 min or under 50°C for 30 s |
| Ultrasonic Cleaning Power | <=300 W; pretest required before cleaning |
| Unopened Storage Condition | <=30°C, <60% RH, use within 1 year in moisture-proof anti-electrostatic package |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours / 7 days after opening |
| Recommended Workshop Condition | <=30°C, <60% RH |
| Baking Condition | 60±5°C for 24 hours if desiccant/package fails or storage time exceeded |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; datasheet also states 60 mA in Chinese and 20 mA in English |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours at Ta=85±5°C, RH=90-95% |
| High Temperature Storage Test | 1000 hours at Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours at Ta=-40±5°C |
| Cold / Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot / Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100±5°C to -40±5°C, 20 min each |
| Solderability Test | Tin loading rate >=95% pad area; 235±5°C, 25±2.5 mm/s, 2±0.5 s |
| Datasheet Status | request_only |
Product Overview
The XL-5050UGC-A is a XINGLIGHT high brightness green surface-mount LED built in a 5050 SMD package. The package dimensions are 5.0 x 5.0 x 1.6 mm, with a water clear transparent colloid for the emitted green light path. It is supplied for SMT automatic production and uses EIA standard packaging.
At IF=60 mA and Ta=25°C, the LED is specified for 4000-6000 mcd luminous intensity, 515-530 nm dominant wavelength, 525 nm typical peak wavelength, and 2.8-3.4 V forward voltage. The typical viewing angle is 120 degrees, with a 30 nm typical half wave width and reverse current limited to 5 µA at VR=5 V.
Assembly data includes MSL 3 handling, lead-free and leaded reflow profiles, a maximum of two reflow soldering passes, and alcohol cleaning recommendations after soldering. Storage guidance covers unopened, opened, workshop, and baking conditions for moisture control.
Key Features
- High brightness green emission in 5050 SMD package
- 5.0 x 5.0 x 1.6 mm package dimensions
- Water clear transparent colloid lens construction
- 4000-6000 mcd luminous intensity at 60 mA
- 515-530 nm dominant wavelength at 60 mA
- 2.8-3.4 V forward voltage at 60 mA
- 120 degree typical viewing angle
- MSL 3 moisture sensitivity classification
- RoHS Directive compliant process
- Suitable for SMT automatic production
Typical Applications
- Green status indicators
- Surface-mount signal lighting
- PCB-mounted visual indicators
- Display backlighting points
- Equipment panel indicators
- Automated SMT LED assemblies
Procurement Notes
When requesting a quote for XL-5050UGC-A, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package is used for XL-5050UGC-A?
XL-5050UGC-A uses a 5050 SMD LED package with 5.0 x 5.0 x 1.6 mm dimensions. The datasheet notes a general dimension tolerance of ±0.25 mm unless otherwise specified.
What are the main optical specifications?
At IF=60 mA and Ta=25°C, the LED is specified for 4000-6000 mcd luminous intensity, 515-530 nm dominant wavelength, 525 nm typical peak wavelength, 30 nm typical half wave width, and 120 degree typical viewing angle.
What soldering limits apply to this LED?
The datasheet lists a lead soldering limit of 260°C for no more than 6 seconds, recommends 240±5°C for 6 seconds, and limits reflow soldering to a maximum of two times.
How should opened packages be stored?
After opening, the package should be kept at no more than 30°C and below 40% RH, with soldering completed within 168 hours, or 7 days. Baking is specified at 60±5°C for 24 hours when required.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.