Specifications
| Type | Description |
|---|---|
| Part Number | XL-5050SURC |
| Manufacturer | XINGLIGHT |
| Product Type | High brightness red SMD LED |
| Category | LED |
| Package/Case | 5050 SMD LED, 5.0 mm x 5.0 mm x 1.6 mm |
| Package Dimensions | 5.0 x 5.0 x 1.6 mm |
| Emitted Color | High brightness red |
| Lens / Colloid | Water clear colloid / transparent colloid |
| RoHS Compliance | Complies with RoHS Directive |
| Moisture Sensitivity Level | MSL 3 |
| Maximum Power Dissipation | 200 mW, Ta=25°C |
| Maximum Continuous Forward Current | 60 mA, Ta=25°C |
| Peak Forward Current | 120 mA, pulse width ≤0.1 ms, duty ≤1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V, Ta=25°C |
| ESD Rating | 2000 V, antistatic ability, Ta=25°C |
| Operating Temperature Range | -40°C to +85°C |
| Storage Temperature Range | -40°C to +85°C |
| Lead Soldering Temperature / Time | 260°C for ≤6 s, absolute maximum rating |
| Luminous Intensity | 400 to 600 mcd, IF=60 mA, Ta=25°C |
| Dominant Wavelength | 615 to 630 nm, typical 625 nm, IF=60 mA, Ta=25°C |
| Peak Wavelength | 625 nm typical, IF=60 mA, Ta=25°C |
| Forward Voltage | 1.8 to 2.4 V, IF=60 mA, Ta=25°C |
| Viewing Angle | 120° typical, 2θ1/2, IF=60 mA, Ta=25°C |
| Half Wave Width | 20 nm typical, IF=60 mA, Ta=25°C |
| Reverse Current | ≤5 µA, VR=5 V, Ta=25°C |
| Brightness Bin E2 | 400 to 450 mcd, IF=60 mA |
| Brightness Bin E3 | 450 to 500 mcd, IF=60 mA |
| Brightness Bin E4 | 500 to 550 mcd, IF=60 mA |
| Brightness Bin E5 | 550 to 600 mcd, IF=60 mA |
| Voltage Bin N12-7 | 1.8 to 2.0 V, IF=60 mA |
| Voltage Bin N12-8 | 2.0 to 2.2 V, IF=60 mA |
| Voltage Bin N12-9 | 2.2 to 2.4 V, IF=60 mA |
| Dominant Wavelength Bin HR01 | 615 to 620 nm, IF=60 mA |
| Dominant Wavelength Bin HR02 | 620 to 625 nm, IF=60 mA |
| Dominant Wavelength Bin HR03 | 625 to 630 nm, IF=60 mA |
| Test Environment Temperature | 25±5°C if not otherwise indicated |
| Outline Dimension Tolerance | ±0.25 mm unless otherwise noted |
| Tape / Reel Dimensional Tolerance | ±0.1 mm for belt and disk dimensions |
| Hand Soldering Iron Power | <30 W, recommended for repair/rework only |
| Hand Soldering Temperature | <300°C, each terminal once, less than 3 s |
| Maximum Reflow Cycles | 2 cycles |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C, peak 5 to 10 s, above 217°C for 60 to 120 s |
| Lead Reflow Peak Temperature | 235°C +5/-0°C, peak 10 to 15 s, above 183°C for 60 to 150 s |
| Unopened Storage Condition | ≤30°C, ≤60% RH, use within 1 year |
| Opened Storage Condition | ≤30°C, ≤40% RH, solder within 168 hours / 7 days |
| Baking Condition | 60±5°C for 24 hours if desiccant/package fails or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
The XL-5050SURC is a XINGLIGHT high brightness red SMD LED built in a 5050 package format. The package dimensions are 5.0 x 5.0 x 1.6 mm, and the optical structure uses water clear or transparent colloid. It is specified as suitable for SMT automatic production and complies with the RoHS Directive.
Electrical and optical ratings are defined at Ta=25°C unless otherwise specified. The LED supports 60 mA maximum continuous forward current, 120 mA peak forward current under the stated pulse condition, 200 mW maximum power dissipation, and 5 V maximum reverse voltage. At IF=60 mA, forward voltage is 1.8 to 2.4 V, luminous intensity is 400 to 600 mcd, dominant wavelength is 615 to 630 nm, and viewing angle is 120° typical.
Assembly handling includes MSL 3 classification, up to two reflow cycles, lead-free reflow peak temperature of 255°C +0/-5°C, and opened-package soldering within 168 hours / 7 days under the stated storage limits.
Key Features
- High brightness red emitted color
- 5050 SMD package measuring 5.0 x 5.0 x 1.6 mm
- Water clear or transparent colloid lens structure
- 400 to 600 mcd luminous intensity at IF=60 mA
- 615 to 630 nm dominant wavelength range
- 1.8 to 2.4 V forward voltage at IF=60 mA
- 120° typical viewing angle at IF=60 mA
- 60 mA maximum continuous forward current
- MSL 3 moisture sensitivity classification
- RoHS Directive compliant environmental product
Typical Applications
- SMT automatic production
- High brightness red LED placement
- 5050 SMD LED assemblies
- RoHS-compliant LED designs
- MSL 3 controlled assembly flows
- Reflow soldered LED boards
Procurement Notes
When requesting a quote for XL-5050SURC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Alternatives
TOGIALED
TJ-S5050UG2W5TLC2R-A5
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
Application Verification Recommended
Related Technical Articles
FAQ
What type of LED is XL-5050SURC?
XL-5050SURC is a XINGLIGHT high brightness red SMD LED. It uses a 5050 package measuring 5.0 x 5.0 x 1.6 mm and is described as suitable for SMT automatic production.
What are the main optical specifications at IF=60 mA?
At IF=60 mA and Ta=25°C, XL-5050SURC has 400 to 600 mcd luminous intensity, 615 to 630 nm dominant wavelength with 625 nm typical, 625 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle.
What electrical limits apply to XL-5050SURC?
At Ta=25°C, the datasheet lists 200 mW maximum power dissipation, 60 mA maximum continuous forward current, 120 mA peak forward current under the stated pulse condition, 5 V maximum reverse voltage, and 2000 V ESD rating.
How should opened packages be handled before soldering?
After opening the package, the datasheet specifies storage at ≤30°C and ≤40% RH, with soldering within 168 hours or 7 days. If the desiccant or package fails or storage time is exceeded, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.