XL-5050UGC High Brightness Green SMD LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-5050UGC High Brightness Green SMD LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-5050UGC
Manufacturer
XINGLIGHT
Package
5050 SMD LED, 5.0 x 5.0 x 1.6 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-5050UGC from XINGLIGHT is a high brightness green SMD LED in a 5050 package measuring 5.0 x 5.0 x 1.6 mm. It is intended for SMT automatic production and infrared reflow soldering processes. Electrical and optical ratings include 2.8-3.4 V forward voltage, 60 mA continuous forward current, 4000-6000 mcd luminous intensity, 515-530 nm dominant wavelength, and 120° typical viewing angle at IF=60 mA. The device uses a water clear / transparent colloid lens, supports MSL 3 handling, and is specified for -40 to +85 °C operation.

Specifications

TypeDescription
Part NumberXL-5050UGC
ManufacturerXINGLIGHT
Product TypeHigh brightness green SMD LED
CategoryLED
Package/Case5050 SMD LED, 5.0 x 5.0 x 1.6 mm
Part Number ConditionDatasheet title shows XL-5050UGC-A variant
Outline Dimensions5.0 x 5.0 x 1.6 mm
Dimension Tolerance±0.25 mm
Emitted ColorGreen
Lens / ColloidWater clear / transparent colloid
RoHS ComplianceComplies with RoHS Directive
Moisture Sensitivity LevelMSL 3
SMT CompatibilitySuitable for SMT automatic production
Reflow Process CompatibilitySuitable for infrared reflow soldering process
Maximum Power Dissipation200 mW, Ta=25°C
Maximum Continuous Forward Current60 mA, 20 mA x 3, Ta=25°C
Peak Forward Current120 mA, pulse width ≤0.1 ms, duty ≤1/10, Ta=25°C
Maximum Reverse Voltage5 V, Ta=25°C
ESD Rating2000 V, antistatic ability, test model not specified
Operating Temperature Range-40 to +85 °C
Storage Temperature Range-40 to +85 °C
Lead Soldering Temperature / Time260°C for ≤6 s
Luminous Intensity4000-6000 mcd, IF=60 mA, Ta=25°C
Dominant Wavelength515-530 nm, IF=60 mA, Ta=25°C
Peak Wavelength525 nm typ, IF=60 mA, Ta=25°C
Forward Voltage2.8-3.4 V, IF=60 mA, Ta=25°C
Viewing Angle120° typ, 2θ1/2, IF=60 mA, Ta=25°C
Half Wave Width30 nm typ, IF=60 mA, Ta=25°C
Reverse Current≤5 µA, VR=5 V, Ta=25°C
Brightness Grade G64100-4500 mcd, IF=60 mA
Brightness Grade G74500-5000 mcd, IF=60 mA
Brightness Grade G85000-5500 mcd, IF=60 mA
Brightness Grade G95500-6000 mcd, IF=60 mA
Voltage Grade N13-32.8-3.0 V, IF=60 mA
Voltage Grade N13-43.0-3.2 V, IF=60 mA
Voltage Grade N13-53.2-3.4 V, IF=60 mA
Wavelength Grade HG02515-520 nm, IF=60 mA
Wavelength Grade HG03520-525 nm, IF=60 mA
Wavelength Grade HG04525-530 nm, IF=60 mA
Test Ambient Temperature25±5°C, unless otherwise indicated
Working Life Test1000 hours, continuous lighting at maximum rated current at room temperature; text also states test at 20 mA
High Temperature / High Humidity Storage Test240 hours, Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times
High Temperature Storage Test1000 hours, Ta=85±5°C
Low Temperature Storage Test1000 hours, Ta=-40±5°C
Cold / Hot Cycle Test100 cycles, 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min
Hot / Cold Impact Test100 cycles, IR reflow in-board 2 times; 100±5°C for 20 min to -40±5°C for 20 min
Anti-Tin Test260±5°C, 10±1 s, 2 times
Leaded Infrared Reflow Peak Temperature235°C +5/-0°C, peak 10-15 s, above 183°C for 60-150 s, heat-up max 3°C/s
Lead-Free Infrared Reflow Peak Temperature255°C +0/-5°C, peak 5-10 s, above 217°C for 60-120 s, heat-up max 3°C/s, cooling max 6°C/s
Weldability Test235±5°C, immersion time 2±0.5 s, immersion speed 25±2.5 mm/s, tin loading rate ≥95% pad area
Carrier Tape Dimensional Tolerance±0.1 mm
Hand Soldering Iron Power<30 W, recommended only for repair and rework
Hand Soldering Temperature<300°C, each terminal less than 3 s, one time only
Maximum Reflow Count2 times
Recommended Maximum Welding Temperature240±5°C for 6 s
Cleaning SolventAlcohol recommended after soldering
Cleaning Conditions≤30°C for 3 min or ≤50°C for 30 s
Ultrasonic Cleaning Power≤300 W, pretest recommended before cleaning
Unopened Storage Conditions≤30°C, ≤60% RH, use within 1 year
Opened Storage Conditions≤30°C, ≤40% RH, solder within 168 hours
Recommended Workshop Conditions≤30°C, ≤60% RH
Baking Conditions60±5°C for 24 hours if moisture absorbent material has faded or storage time exceeded
Circuit Design RequirementCurrent through each LED must not exceed absolute maximum rating; protection resistors recommended
Thermal Design RequirementHeat generation may reduce brightness and change color
Human Eye Safety WarningDo not view LED light-emitting center directly, especially high luminous intensity LEDs
Datasheet Statusrequest_only

Product Overview

The XL-5050UGC is a XINGLIGHT high brightness green SMD LED supplied in a 5050 surface-mount package. The outline dimensions are 5.0 x 5.0 x 1.6 mm with ±0.25 mm dimensional tolerance unless otherwise noted. The emitted color is green, with a water clear / transparent colloid lens structure.

Key Features

  • High brightness green SMD LED output
  • 5050 package, 5.0 x 5.0 x 1.6 mm
  • Water clear / transparent colloid lens
  • 4000-6000 mcd luminous intensity at 60 mA
  • 515-530 nm dominant wavelength range
  • 2.8-3.4 V forward voltage at 60 mA
  • 120° typical viewing angle
  • Suitable for SMT automatic production
  • Suitable for infrared reflow soldering
  • MSL 3 moisture sensitivity level

Typical Applications

  • Green SMD LED assemblies
  • SMT automatic production boards
  • Infrared reflow soldered PCBs
  • High brightness green indication
  • 5050 LED package designs
  • Designs requiring 120° viewing angle
  • Assemblies requiring RoHS-compliant LEDs

Procurement Notes

When requesting a quote for XL-5050UGC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

Alternatives

HARVATEK

HL-AF-5060U51GC-3-S1-THL

Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.

Application Verification Recommended

FAQ

What type of LED is the XL-5050UGC?

XL-5050UGC is a XINGLIGHT high brightness green SMD LED in a 5050 package. The datasheet lists green emission, a water clear / transparent colloid lens, and 5.0 x 5.0 x 1.6 mm outline dimensions.

What are the main optical specifications of XL-5050UGC?

At IF=60 mA and Ta=25°C, the datasheet specifies 4000-6000 mcd luminous intensity, 515-530 nm dominant wavelength, 525 nm typical peak wavelength, 30 nm typical half wave width, and 120° typical viewing angle.

What soldering processes are specified for this LED?

The device is listed as suitable for SMT automatic production and infrared reflow soldering. The datasheet specifies a maximum reflow count of two times and gives lead-free infrared reflow peak temperature of 255°C +0/-5°C.

How should XL-5050UGC be stored after opening?

After opening the moisture-proof anti-electrostatic package, the datasheet specifies storage at ≤30°C and ≤40% RH, with soldering within 168 hours. Baking is specified at 60±5°C for 24 hours if storage time is exceeded.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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