XL-IRM-V838M3-TR Infrared Receiver Module

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-IRM-V838M3-TR Infrared Receiver Module

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Part Number
XL-IRM-V838M3-TR
Manufacturer
XINGLIGHT
Package
SMD epoxy resin semi-spherical package, 6.8 x 3.0 x 3.2 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-IRM-V838M3-TR from XINGLIGHT is an LED-category infrared receiver module in an SMD epoxy resin semi-spherical package measuring 6.8 x 3.0 x 3.2 mm. It uses a high-speed, high-sensitivity PIN photodiode with a low-power, high-gain preamplifier IC and supports TTL/CMOS-compatible active-low output. Key parameters include 2.7 to 5.5 V working voltage, 0.22 mA typical supply current, 37.9 kHz carrier frequency, 940 nm peak wavelength, 40 m typical receive distance at 0 degrees, and 45 degree typical half angle. Applications include infrared remote-control receivers, carrier-frequency IR links, and embedded IR sensing interfaces.

Specifications

TypeDescription
Part NumberXL-IRM-V838M3-TR
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Component TypeSensor
Package / CaseSMD epoxy resin semi-spherical package, 6.8 x 3.0 x 3.2 mm
Supply Voltage Absolute Maximum-0.2 to 0.6 V; Ta=25°C; confidence: low
Operating Ambient Temperature-20 to +85 °C; absolute maximum rating
Storage Ambient Temperature-40 to +125 °C; absolute maximum rating
Reflow Soldering Condition260 °C, <=6 s; welding condition
Manual Soldering Condition300 °C, 3 s; welding condition
Working Voltage2.7 to 5.5 V; Ta=25°C
Receive Distance, 0 Degrees40 m typ; Ta=25°C
Receive Distance, Left 45 Degrees25 m typ; Ta=25°C
Receive Distance, Right 45 Degrees25 m typ; Ta=25°C
Supply Current0.22 mA typ, 0.6 mA max; VCC=5.0 V, Ta=25°C
Carrier Frequency37.9 kHz typ; Ta=25°C
Peak Wavelength940 nm typ; Ta=25°C
Low Level Output Voltage-0.2 to 0.4 V; Ta=25°C
High Level Output Voltage-0.4 to 0.2 V; Ta=25°C; confidence: low
Pulse Width400 to 800 us; Ta=25°C
Half Angle45 deg typ; Ta=25°C
Output Logic CompatibilityTTL and CMOS compatible, active low
Receiver ConstructionHigh-speed high-sensitivity PIN photodiode with low-power high-gain preamplifier IC
ShieldingInternal and external dual shielding anti-interference design
Output Waveform Test Frequency37.9 kHz; measurement conditions, Ta=25°C
Standard Transmitter Output AdjustmentVOUT 200 mVp-p; Po measuring circuit standard transmitter
Ambient Light Test Illumination200 ± 50 lux; ordinary white fluorescent lamp without high-frequency lighting
Maximum Data Word Length100 ms max; applicable data formats
Minimum Burst Length300 us; applicable data formats, tBurst
Minimum Gap Time After Each Burst300 us; applicable data formats, tGap
Minimum Pause Time In Data Stream25 ms min; applicable data formats, tPause
Required Data Pause TimetPause > (Data word length / 3) + 18.5 ms; applicable data formats
Reliability Test, Soldering Heat Resistance260 ± 5 °C for <=5 s; 20 samples, 20 passed
Reliability Test, ESD4 kV, 100 pF, 1.5 kΩ; each pin, 20 samples, 20 passed
Reliability Test, Vibration10-50 Hz/1 min, 1.5 mm amplitude, X/Y/Z, 30 min; 20 samples, 20 passed
Reliability Test, High Temperature Storage85 ± 2 °C for 240 h; 20 samples, 20 passed
Reliability Test, Low Temperature Storage-20 ± 2 °C for 240 h; 20 samples, 20 passed
Reliability Test, High Temperature High Humidity Storage85 °C, 85% RH for 240 h; 20 samples, 20 passed
Reliability Test, Temperature Cycling-20 °C for 30 s to +85 °C for 30 s, 10 cycles; 20 samples, 20 passed
Reliability Test, Lead Bending2.5 N external force, each lead bent 2 times; 20 samples, 20 passed
Outline Dimension Tolerance±0.25 mm; unless otherwise specified
Carrier Tape Dimension Tolerance±0.1 mm; packaging belt and disk dimensions
Recommended Maximum Reflow Temperature240 °C for 6 s; Pb-free reflow soldering guideline
Maximum Reflow Count2 times; reflow soldering guideline
Hand Soldering Iron Power<30 W; hand soldering guideline
Cleaning With AlcoholUnder 30 °C for 3 min or under 50 °C for 30 s; cleaning after soldering
Ultrasonic Cleaning Power<=300 W; cleaning guideline
Unopened Storage Condition<=30 °C, <60% RH, use within 1 year; before opening package
Opened Storage Condition<=30 °C, <40% RH, solder within 168 h / 7 days; after opening package
Recommended Workshop Condition<=30 °C, <40% RH; after package opening
Baking Condition60 ± 5 °C for 24 h; if moisture absorbent has faded or storage time exceeded
Static Field Voltage Limit<100 V within 1 foot of LED element; ESD precaution during operation
Datasheet Statusrequest_only

Product Overview

The XL-IRM-V838M3-TR is a XINGLIGHT infrared receiver module listed in the LED category. It is built with a high-speed, high-sensitivity PIN photodiode and a low-power, high-gain preamplifier IC, with TTL and CMOS compatible active-low output behavior.

The device operates from 2.7 to 5.5 V at Ta=25°C and is specified for 37.9 kHz carrier reception with a 940 nm typical peak wavelength. Receive distance is listed as 40 m typical at 0 degrees and 25 m typical at left or right 45 degrees, with a 45 degree typical half angle.

The package is an SMD epoxy resin semi-spherical body measuring 6.8 x 3.0 x 3.2 mm. Assembly guidance includes reflow soldering limits, manual soldering conditions, cleaning limits, storage conditions after opening, and baking guidance when moisture exposure limits are exceeded. Typical use cases include infrared remote-control receiver inputs and embedded IR signal reception where the stated carrier, pulse, burst, and pause timing requirements are suitable.

Key Features

  • 2.7 to 5.5 V working voltage range
  • 37.9 kHz typical carrier frequency
  • 940 nm typical peak wavelength response
  • 40 m typical receive distance at 0 degrees
  • TTL and CMOS compatible active-low output
  • PIN photodiode with low-power preamplifier IC
  • Internal and external dual shielding design
  • 400 to 800 us output pulse width
  • 45 degree typical half-angle reception
  • SMD epoxy resin semi-spherical package

Typical Applications

  • Infrared remote-control receivers
  • 37.9 kHz IR signal reception
  • TTL or CMOS logic interfaces
  • Embedded appliance IR inputs
  • Consumer electronics control receivers
  • SMD infrared sensing assemblies

Procurement Notes

When requesting a quote for XL-IRM-V838M3-TR, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What is the working voltage of XL-IRM-V838M3-TR?

The XL-IRM-V838M3-TR working voltage is specified as 2.7 to 5.5 V at Ta=25°C. Supply current is listed as 0.22 mA typical and 0.6 mA maximum at VCC=5.0 V and Ta=25°C.

What carrier frequency does this infrared receiver module use?

The carrier frequency is specified as 37.9 kHz typical at Ta=25°C. The output waveform test frequency is also listed as 37.9 kHz under measurement conditions at Ta=25°C.

What package is used for XL-IRM-V838M3-TR?

The module uses an SMD epoxy resin semi-spherical package with body dimensions of 6.8 x 3.0 x 3.2 mm. Unless otherwise specified, outline dimension tolerance is listed as ±0.25 mm.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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