XL-IRM1738C Infrared Remote Receiver Module

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-IRM1738C Infrared Remote Receiver Module

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-IRM1738C
Manufacturer
XINGLIGHT
Package
SMD epoxy resin semi-spherical package, 6.8 x 5.3 x 4.4 mm body, 3.1 mm pin length
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-IRM1738C from XINGLIGHT is an LED-category infrared remote receiver module in an SMD epoxy resin semi-spherical package with a 6.8 x 5.3 x 4.4 mm body and 3.1 mm pin length. It operates from a recommended 2.7 V to 5.5 V supply and uses a 37.9 kHz typical carrier frequency with 6 kHz typical BPF width. The module provides TTL and CMOS compatible active-low output, 0.3 mA typical working current at 5 V, and rated receive distance of 12 m typical at 0 degrees under the specified indoor test condition. It supports IR remote input interfaces for electronics requiring compact surface-mount assembly.

Specifications

TypeDescription
Part NumberXL-IRM1738C
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Package / CaseSMD epoxy resin semi-spherical package, 6.8 x 5.3 x 4.4 mm body, 3.1 mm pin length
Supply Voltage Absolute Maximum6.0 V; Ta=25°C
Operating Ambient Temperature-40°C to +85°C; absolute maximum rating
Storage Ambient Temperature-40°C to +125°C; absolute maximum rating
Lead Soldering Temperature and Time260°C, <=6 s; absolute maximum rating
Working Current0.2 mA min, 0.3 mA typ, 0.5 mA max; VDD=5 V, Ta=25°C
Receive Distance at 0 Degrees10 m min, 12 m typ; CH3018-12U emitter, indoor without direct sunlight on receiver window, 40 W electronic ballast fluorescent lamp 1 m front-above, 200±50 lux
Receive Distance at Left 35 Degrees5 m min, 6 m typ; CH3018-12U emitter, indoor without direct sunlight on receiver window, 40 W electronic ballast fluorescent lamp 1 m front-above, 200±50 lux
Receive Distance at Right 35 Degrees5 m min, 6 m typ; CH3018-12U emitter, indoor without direct sunlight on receiver window, 40 W electronic ballast fluorescent lamp 1 m front-above, 200±50 lux
Carrier Frequency37.9 kHz typ; Ta=25°C
BPF Width6 kHz typ; Ta=25°C
Low Level Output Voltage250 mV max; Isink=2.0 mA
High Level Output Voltage4.5 V min, 5.0 V max; VCC=5 V
Output Pulse Width Low400 us min, 600 us typ, 800 us max; burst wave, Vin=500 uVp-p
Output Pulse Width High400 us min, 640 us typ, 800 us max; burst wave, Vin=50 mVp-p
Minimum Pulse Width350 us min; Vin=50 mVp-p
Minimum Interval Time450 us min; Vin=50 mVp-p
Encoding Pause Time45 us min; Vin=50 mVp-p
Recommended Supply Voltage2.7 V min, 5.5 V max; recommended usage condition
Recommended Input Frequency37.9 kHz typ; recommended usage condition
Recommended Operating Temperature25°C typ; recommended usage condition
Moisture Sensitivity LevelMSL 3; product characteristic
Output Logic CompatibilityTTL and CMOS compatible, active low; product characteristic
Solder Heat Reliability Test260°C±5°C, within 5 s, 20 tested, 20 passed; non-stress state
ESD Reliability Test4 kV, 100 pF capacitor, 1.5 kOhm resistor, each pin, 20 tested, 20 passed; electrostatic destruction test
Vibration Reliability Test10-50 Hz/1 min, 1.5 mm amplitude, X/Y/Z for 30 min, 20 tested, 20 passed; vibration test
High Temperature Storage Test85°C±2°C for 240 h, 20 tested, 20 passed; reliability test
Low Temperature Storage Test-20°C±2°C for 240 h, 20 tested, 20 passed; reliability test
High Temperature High Humidity Storage Test85°C, 85% RH for 240 h, 20 tested, 20 passed; reliability test
Temperature Cycle Test-20°C for 30 s and +85°C for 30 s, 10 cycles, 20 tested, 20 passed; high-low temperature cycle
Pin Bending Test2.5 N external force, each pin bent 2 times, 20 tested, 20 passed; reliability test
Outline Dimension Tolerance±0.25 mm; unless otherwise specified
Carrier Tape Dimension Tolerance±0.1 mm; packaging dimensions
Manual Soldering Iron Power<30 W recommended; hand soldering for repair/rework
Manual Soldering Temperature<300°C; hand soldering
Manual Soldering Time<3 s per terminal, one time only; hand soldering
Recommended Maximum Reflow Temperature240°C for 6 s; Pb-free reflow soldering
Maximum Reflow Count2 times; reflow soldering
Datasheet Statusrequest_only

Product Overview

The XL-IRM1738C is a XINGLIGHT infrared remote receiver module listed in the LED category. It is supplied in an SMD epoxy resin semi-spherical package with a 6.8 x 5.3 x 4.4 mm body and 3.1 mm pin length, with outline dimensions specified to ±0.25 mm unless otherwise noted.

Electrical data includes a recommended supply range of 2.7 V to 5.5 V, a 37.9 kHz typical input/carrier frequency, and 0.2 mA minimum, 0.3 mA typical, 0.5 mA maximum working current at VDD=5 V and Ta=25°C. Output is TTL and CMOS compatible with active-low logic, including a 250 mV maximum low-level output at Isink=2.0 mA.

Receive-distance data is specified with a CH3018-12U emitter under indoor lighting conditions: 10 m minimum and 12 m typical at 0 degrees, and 5 m minimum and 6 m typical at left or right 35 degrees. Assembly data includes MSL 3, manual soldering below 300°C for less than 3 seconds per terminal, and Pb-free reflow up to 240°C for 6 seconds, with a maximum of two reflow cycles.

Key Features

  • Infrared remote receiver module in SMD epoxy resin package
  • 6.8 x 5.3 x 4.4 mm body dimensions
  • Recommended 2.7 V to 5.5 V supply range
  • 37.9 kHz typical carrier and input frequency
  • TTL and CMOS compatible active-low output logic
  • 0.3 mA typical working current at 5 V
  • 12 m typical receive distance at 0 degrees
  • 6 m typical receive distance at left or right 35 degrees
  • MSL 3 moisture sensitivity level specified
  • Pb-free reflow profile supports 240°C for 6 seconds

Typical Applications

  • Infrared remote control receivers
  • Consumer electronics remote input
  • Home appliance control interfaces
  • TTL logic IR receiver inputs
  • CMOS logic IR receiver inputs
  • Surface-mount control boards
  • 37.9 kHz carrier remote systems

Procurement Notes

When requesting a quote for XL-IRM1738C, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What is the recommended supply range for XL-IRM1738C?

The recommended supply voltage for XL-IRM1738C is 2.7 V minimum to 5.5 V maximum. The absolute maximum supply voltage is listed separately as 6.0 V at Ta=25°C.

What carrier frequency does XL-IRM1738C use?

XL-IRM1738C is specified with a 37.9 kHz typical carrier frequency at Ta=25°C. The recommended input frequency is also listed as 37.9 kHz typical under recommended usage conditions.

What output logic is provided by this receiver module?

The module output is TTL and CMOS compatible and active low. Electrical output data includes 250 mV maximum low-level output voltage at Isink=2.0 mA and 4.5 V minimum to 5.0 V maximum high-level output voltage at VCC=5 V.

What soldering limits are specified for XL-IRM1738C?

Hand soldering is specified below 300°C for less than 3 seconds per terminal, one time only, with less than 30 W soldering iron power recommended for repair or rework. Pb-free reflow is specified up to 240°C for 6 seconds, maximum two times.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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