Specifications
| Type | Description |
|---|---|
| Part Number | XL-PD3227B |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 3.2 x 2.7 x 1.0 mm SMD package |
| Overall Dimensions | 3.2 x 2.7 x 1.0 mm, L/W/H |
| Optical Function | Infrared receiver tube, black colloid package |
| Colloid Color | Black, infrared receiver tube |
| RoHS Compliance | Complies with RoHS Directive, environmental protection process |
| Moisture Sensitivity Level | MSL 3 |
| Packaging Standard | EIA standard packaging |
| Power Consumption | 150 mW max, maximum rating |
| Reverse Voltage | 32 V max, maximum rating |
| Operating Ambient Temperature | -20°C to +85°C, Topr |
| Storage Ambient Temperature | -40°C to +85°C, Tstg |
| Welding Conditions | 260°C for ≤6 s, Tsol maximum rating |
| Open-Circuit Voltage | 0.41 V typ, λP=940 nm, Ee=5 mW/cm², Ta=25°C |
| Short-Circuit Current | 6.5 µA typ, λP=940 nm, Ee=1 mW/cm², Ta=25°C |
| Reverse Light Current | 6.5 µA typ, λP=940 nm, Ee=1 mW/cm², VR=5 V, Ta=25°C |
| Reverse Dark Current | 10 nA max, VR=10 V, Ee=0 mW/cm², Ta=25°C |
| Rise Time | 10 µs typ, VR=10 V, RL=1000 Ω, Ta=25°C |
| Fall Time | 10 µs typ, VR=10 V, RL=1000 Ω, Ta=25°C |
| Reverse Breakdown Voltage | 32 V min, 170 V typ, Ee=0 mW/cm², IR=100 µA, Ta=25°C |
| Total Capacitance | 6 pF typ, Ee=0 mW/cm², VR=5 V, f=1 MHz, Ta=25°C |
| Spectral Bandwidth Range | 730 to 1100 nm, λ0.5, Ta=25°C |
| Peak Sensitivity Wavelength | 940 nm typ, λP, Ta=25°C |
| Outline Dimension Tolerance | ±0.30 mm unless otherwise specified |
| Tape/Reel Dimensional Tolerance | ±0.1 mm, packaging belt and disk dimensions |
| Recommended Maximum Soldering Temperature | 240°C for 6 s |
| Recommended Reflow Count | Once |
| Soldering Iron Temperature | <300°C for ≤3 s, each terminal, soldering iron capacity less than 25 W |
| Unopened Storage Condition | ≤30°C, ≤60% RH, use within 1 year |
| Opened Storage Condition | ≤30°C, ≤40% RH, solder within 168 hours / 7 days |
| Baking Condition | 60±5°C for 24 hours |
| ESD Field Voltage Recommendation | <100 V within 1 foot of LED element during operation |
| Datasheet Status | request_only |
Product Overview
The XL-PD3227B from XINGLIGHT is an infrared receiving photodiode categorized under LED components. The datasheet identifies it as an infrared receiver tube with a black colloid package, using a compact 3.2 x 2.7 x 1.0 mm SMD outline. The outline dimension tolerance is ±0.30 mm unless otherwise specified, while tape and reel dimensional tolerance is ±0.1 mm for packaging belt and disk dimensions.
Electrical and optical data are specified at 25°C for several operating conditions. The device has a 940 nm typical peak sensitivity wavelength and a 730 to 1100 nm spectral bandwidth range. At λP=940 nm, typical short-circuit current is 6.5 µA at Ee=1 mW/cm², and typical open-circuit voltage is 0.41 V at Ee=5 mW/cm². Reverse light current is 6.5 µA typical at VR=5 V, while reverse dark current is 10 nA maximum at VR=10 V.
Assembly and handling limits include 260°C for ≤6 s as a maximum welding condition, a recommended maximum soldering temperature of 240°C for 6 s, and one recommended reflow cycle. Storage guidance includes ≤30°C and ≤60% RH unopened for use within one year, or ≤30°C and ≤40% RH after opening with soldering within 168 hours.
Key Features
- 3.2 x 2.7 x 1.0 mm SMD package
- Black colloid infrared receiver tube construction
- RoHS Directive compliant environmental protection process
- MSL 3 moisture sensitivity level rating
- 150 mW maximum power consumption rating
- 32 V maximum reverse voltage rating
- 940 nm typical peak sensitivity wavelength
- 730 to 1100 nm spectral bandwidth range
- 10 µs typical rise and fall times
- 6 pF typical total capacitance
- EIA standard packaging format
- Recommended single reflow soldering cycle
Typical Applications
- Infrared receiver circuits
- 940 nm optical detection
- SMD optical sensor inputs
- Infrared remote signal reception
- Light-current sensing circuits
- Compact photodiode assemblies
- Black-package IR receiver designs
Procurement Notes
When requesting a quote for XL-PD3227B, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What type of device is the XL-PD3227B?
The XL-PD3227B is an XINGLIGHT infrared receiving photodiode listed in the LED category. The datasheet describes it as an infrared receiver tube with a black colloid package.
What package size does XL-PD3227B use?
The device uses a 3.2 x 2.7 x 1.0 mm SMD package. The datasheet also specifies an outline dimension tolerance of ±0.30 mm unless otherwise specified.
What wavelength range is specified for this photodiode?
The datasheet specifies a 730 to 1100 nm spectral bandwidth range at Ta=25°C. The typical peak sensitivity wavelength is 940 nm under the λP condition.
What soldering guidance is provided for XL-PD3227B?
Maximum welding condition is 260°C for ≤6 s, while the recommended product maximum soldering temperature is 240°C for 6 s. The datasheet recommends one reflow cycle.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.