XL-PD3227C Infrared Receiving Photodiode

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-PD3227C Infrared Receiving Photodiode

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-PD3227C
Manufacturer
XINGLIGHT
Package
3.2 x 2.7 x 1.0 mm SMD package
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-PD3227C is a XINGLIGHT LED-category infrared receiving photodiode supplied in a 3.2 x 2.7 x 1.0 mm SMD package. It uses a transparent colloid encapsulant for infrared receiver tube operation and has peak sensitivity at 940 nm with a 400 to 1100 nm spectral bandwidth. Key electrical parameters include 32 V maximum reverse voltage, 150 mW maximum power dissipation, 6.5 µA typical short-circuit current, 6 pF typical capacitance, and 10 µs typical rise and fall times. Assembly data includes MSL 3 handling, RoHS compliance, EIA standard packaging, and soldering/storage limits for controlled production use.

Specifications

TypeDescription
Part NumberXL-PD3227C
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Package / Case3.2 x 2.7 x 1.0 mm SMD package
Component TypeSensor
Outline Dimensions3.2 x 2.7 x 1.0 mm
Outline Dimensions ConditionL/W/H
Optical FunctionInfrared receiver tube
Optical Function ConditionTransparent colloid/encapsulant
RoHS ComplianceComplies with RoHS Directive
RoHS Compliance ConditionEnvironmental protection process
Moisture Sensitivity LevelMSL 3
Moisture Sensitivity Level ConditionMoisture sensitivity level
Packaging StandardEIA standard packaging
Packaging Standard ConditionManufacturer packaging statement
Power Dissipation150 mW max
Power Dissipation ConditionMaximum rating
Reverse Voltage32 V max
Reverse Voltage ConditionMaximum rating
Operating Ambient Temperature-20°C to +85°C
Operating Ambient Temperature ConditionMaximum rating
Storage Ambient Temperature-40°C to +85°C
Storage Ambient Temperature ConditionMaximum rating
Soldering Temperature260°C max for <=6 s
Soldering Temperature ConditionWelding conditions
Open-Circuit Voltage0.41 V typ
Open-Circuit Voltage ConditionTa=25°C, λP=940 nm, Ee=5 mW/cm²
Short-Circuit Current6.5 µA typ
Short-Circuit Current ConditionTa=25°C, λP=940 nm, Ee=1 mW/cm²
Reverse Light Current6.5 µA typ
Reverse Light Current ConditionTa=25°C, λP=940 nm, Ee=1 mW/cm², VR=5 V
Reverse Dark Current10 nA max
Reverse Dark Current ConditionTa=25°C, VR=10 V, Ee=0 mW/cm²
Rise Time10 µs typ
Rise Time ConditionTa=25°C, VR=10 V, RL=1000 Ω
Fall Time10 µs typ
Fall Time ConditionTa=25°C, VR=10 V, RL=1000 Ω
Reverse Breakdown Voltage32 V min, 170 V typ
Reverse Breakdown Voltage ConditionTa=25°C, Ee=0 mW/cm², IR=100 µA
Total Capacitance6 pF typ
Total Capacitance ConditionTa=25°C, Ee=0 mW/cm², VR=5 V, f=1 MHz
Spectral Bandwidth Range400 to 1100 nm
Spectral Bandwidth Range ConditionTa=25°C
Peak Sensitivity Wavelength940 nm typ
Peak Sensitivity Wavelength ConditionTa=25°C
Dimension Tolerance±0.30 mm
Dimension Tolerance ConditionUnless otherwise specified
Tape/Disk Dimension Tolerance±0.1 mm
Tape/Disk Dimension Tolerance ConditionPackaging belt and disk dimensions
Recommended Reflow Soldering CountOnce
Recommended Reflow Soldering Count ConditionManufacturer soldering guideline
Recommended Maximum Soldering Temperature240°C for 6 s
Recommended Maximum Soldering Temperature ConditionProduct recommended maximum welding temperature
Manual Soldering Limit<300°C for <=3 s, soldering iron <=25 W
Manual Soldering Limit ConditionPer terminal; allow at least 2 s interval
Unopened Storage Condition<=30°C, <=60% RH, use within 1 year
Unopened Storage Condition DetailBefore opening moisture-proof anti-static package
Opened Storage Condition<=30°C, <=40% RH, solder within 168 hours / 7 days
Opened Storage Condition DetailAfter opening package
Baking Condition60±5°C for 24 hours
Baking Condition DetailIf desiccant/package fails or storage time exceeded
ESD Field Voltage Limit<100 V
ESD Field Voltage Limit ConditionWithin 1 foot ambient range from LED element
Datasheet Statusrequest_only

Product Overview

The XL-PD3227C from XINGLIGHT is an infrared receiving photodiode classified in the LED category. The device is built as an infrared receiver tube with a transparent colloid encapsulant and is supplied in a 3.2 x 2.7 x 1.0 mm SMD package, with outline dimension tolerance of ±0.30 mm unless otherwise specified.

Optical response covers a 400 to 1100 nm spectral bandwidth at Ta=25°C, with typical peak sensitivity at 940 nm. At 25°C and 940 nm illumination, the device provides 0.41 V typical open-circuit voltage at Ee=5 mW/cm² and 6.5 µA typical short-circuit current at Ee=1 mW/cm². Reverse light current is also specified at 6.5 µA typical with VR=5 V.

Maximum ratings include 150 mW power dissipation, 32 V reverse voltage, -20°C to +85°C operating ambient temperature, and -40°C to +85°C storage ambient temperature. Assembly guidance includes MSL 3 handling, EIA standard packaging, one recommended reflow cycle, a recommended maximum soldering temperature of 240°C for 6 s, and defined storage, baking, and ESD field voltage limits.

Key Features

  • Infrared receiver tube with transparent colloid encapsulant
  • 3.2 x 2.7 x 1.0 mm SMD package
  • RoHS Directive compliance stated by manufacturer
  • MSL 3 moisture sensitivity classification
  • 150 mW maximum power dissipation rating
  • 32 V maximum reverse voltage rating
  • 940 nm typical peak sensitivity wavelength
  • 400 to 1100 nm spectral bandwidth range
  • 10 µs typical rise and fall times
  • 6 pF typical total capacitance at 1 MHz

Typical Applications

  • 940 nm infrared receiving circuits
  • Infrared light detection modules
  • SMD optical sensor assemblies
  • Remote-control receiver front ends
  • Photodiode sensing circuits
  • Near-infrared detection equipment
  • Reflow-assembled sensor boards

Procurement Notes

When requesting a quote for XL-PD3227C, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What type of device is XL-PD3227C?

XL-PD3227C is an XINGLIGHT infrared receiving photodiode in the LED category. The extracted datasheet facts describe it as an infrared receiver tube with a transparent colloid encapsulant in a 3.2 x 2.7 x 1.0 mm SMD package.

What wavelength range does XL-PD3227C cover?

At Ta=25°C, XL-PD3227C has a spectral bandwidth range of 400 to 1100 nm. Its typical peak sensitivity wavelength is specified as 940 nm, also at Ta=25°C.

What are the main electrical ratings for XL-PD3227C?

The maximum ratings include 150 mW power dissipation and 32 V reverse voltage. Electrical characteristics include 6.5 µA typical short-circuit current, 6.5 µA typical reverse light current, 10 nA maximum reverse dark current, and 6 pF typical capacitance.

What soldering guidance is specified for XL-PD3227C?

The datasheet facts list 260°C maximum for <=6 s as a soldering temperature rating. The recommended maximum soldering temperature is 240°C for 6 s, with one recommended reflow cycle. Manual soldering is limited to <300°C for <=3 s using a soldering iron <=25 W.

How should XL-PD3227C be stored after opening?

After opening the package, storage should be <=30°C and <=40% RH, and soldering should occur within 168 hours or 7 days. If storage time is exceeded or the desiccant/package fails, baking is specified at 60±5°C for 24 hours.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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