Specifications
| Type | Description |
|---|---|
| Part Number | XL-SFH7016 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 1816 SMD, 1.85 mm x 1.65 mm x 0.6 mm |
| Outline Dimensions | 1.85 x 1.65 x 0.6 mm; L/W/H |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Meets RoHS requirements; environmental protection product |
| Red Pulse Forward Current | 200 mA; pulse width 0.5 ms, duty 1/10, Ta=25°C |
| Green Pulse Forward Current | 200 mA; pulse width 0.5 ms, duty 1/10, Ta=25°C |
| Infrared Pulse Forward Current | 200 mA; pulse width 0.5 ms, duty 1/10, Ta=25°C |
| Red Forward Current | 50 mA; Ta=25°C |
| Green Forward Current | 50 mA; Ta=25°C |
| Infrared Forward Current | 50 mA; Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| Operating Temperature Range | -40 to +85°C; Ta=25°C |
| Storage Temperature Range | -40 to +100°C; Ta=25°C |
| Lead Soldering Temperature/Time | 260°C max, <=6 s; Ta=25°C |
| Red Reverse Current | max 10 µA; VR=5 V, Ta=25°C |
| Green Reverse Current | max 10 µA; VR=5 V, Ta=25°C |
| Infrared Reverse Current | max 10 µA; VR=5 V, Ta=25°C |
| Red Forward Voltage | min 1.5 V, typ 2.0 V, max 2.5 V; IF=20 mA, Ta=25°C |
| Green Forward Voltage | min 1.8 V, typ 2.6 V, max 2.8 V; IF=20 mA, Ta=25°C |
| Infrared Forward Voltage | min 0.8 V, typ 1.3 V, max 1.8 V; IF=20 mA, Ta=25°C |
| Red Peak Wavelength | min 645 nm, typ 655 nm, max 675 nm; IF=20 mA, Ta=25°C |
| Green Peak Wavelength | min 520 nm, typ 522 nm, max 550 nm; IF=20 mA, Ta=25°C |
| Infrared Peak Wavelength | min 930 nm, typ 945 nm, max 960 nm; IF=20 mA, Ta=25°C |
| Red Spectrum Radiation Bandwidth | typ 18 nm; IF=20 mA, Ta=25°C |
| Green Spectrum Radiation Bandwidth | typ 28 nm; IF=20 mA, Ta=25°C |
| Infrared Spectrum Radiation Bandwidth | typ 30 nm; IF=20 mA, Ta=25°C |
| Green Output Optical Power | min 8 mW; IF=20 mA, Ta=25°C |
| Red Output Optical Power | min 8 mW; IF=20 mA, Ta=25°C |
| Infrared Output Optical Power | min 8 mW; IF=20 mA, Ta=25°C |
| Green Pulsed Output Optical Power | 70 mW; 200 mA, 1/10 duty at 200 Hz, Ta=25°C |
| Red Pulsed Output Optical Power | 40 mW; 200 mA, 1/10 duty at 200 Hz, Ta=25°C |
| Infrared Pulsed Output Optical Power | 63 mW; 200 mA, 1/10 duty at 200 Hz, Ta=25°C |
| Half Viewing Angle | ±62 deg; Ta=25°C |
| Optical Power Tolerance | ±15%; each luminous intensity bin |
| Forward Voltage Bin Tolerance | ±0.1 V; each forward voltage bin |
| Hue Coordinate Tolerance | ±0.01; each hue X,Y bin |
| Dominant Wavelength Tolerance | ±1 nm; dominant wavelength bin |
| View Angle Tolerance | ±10°; view angle bin |
| Solderability Test | 0/22 failures; JESD22-B102, precondition 155±5°C for 8 h, Tsol=260±5°C for 10 s, 1 time, 22 samples |
| Resistance to Soldering Heat Test | 0/22 failures; JESD22-A106, Tsol=260±5°C for 10 s, 3 times, 22 samples |
| ESD-HBM Test | 0/6 failures; JESD22-A114, HBM 250 V, 500 V, 1000 V, 2000 V, forward and reverse 3 times each, 6 samples |
| High Temperature Storage Test | 0/22 failures; JESD22-A103, Ta=100°C, 1000 h, 22 samples |
| Low Temperature Storage Test | 0/22 failures; JESD22-A119, Ta=-40°C, 1000 h, 22 samples |
| Thermal Shock Test | 0/22 failures; JESD22-A104, -40°C for 30 min to 100°C for 30 min, 300 cycles, 22 samples |
| High Temperature High Humidity Operating Test | 0/22 failures; JESD22-A101, T=85°C, RH=85%, IF=5 mA, 1000 h, 22 samples |
| DC Operating Life Test | 0/77 failures; MIL-STD-750 Method 1037, T=85°C, IF=5 mA, 1000 h, 77 samples |
| High Temperature High Humidity Storage Test | 0/22 failures; JESD22-A101, T=85°C, RH=85%, 1000 h, 22 samples |
| Dimension Tolerance | ±0.1 mm; unless otherwise specified |
| Hand Soldering | soldering iron <30 W, temperature <300°C, <3 s per terminal, one time only; recommended only for repair and rework |
| Reflow Soldering Limit | maximum 2 reflow cycles; Pb-free reflow soldering |
| Recommended Maximum Soldering Temperature | 240±5°C for 6 s; reflow soldering |
| Cleaning Condition | alcohol cleaning under 30°C for 3 min or under 50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | max 300 W; pretest required to confirm no LED damage |
| Unopened Storage Condition | <=30°C, <60% RH, use within 1 year; before opening moisture-proof package |
| Opened Storage Condition | <=30°C, <10% RH, solder within 168 h / 7 days; after opening package |
| Recommended Workshop Condition | <=30°C, <60% RH; product operation/workshop environment |
| Baking Condition | 60±5°C for 24 h; if moisture absorbent has faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
The XL-SFH7016 is a XINGLIGHT multi-wavelength SMD LED built in an 1816 surface-mount package. Its outline dimensions are 1.85 x 1.65 x 0.6 mm, with a general dimension tolerance of ±0.1 mm unless otherwise specified. The device integrates red, green, and infrared emission channels for compact optical assemblies requiring multiple wavelengths from one LED package.
At IF=20 mA and Ta=25°C, the red channel has 2.0 V typical forward voltage and 655 nm typical peak wavelength. The green channel has 2.6 V typical forward voltage and 522 nm typical peak wavelength, while the infrared channel has 1.3 V typical forward voltage and 945 nm typical peak wavelength. Each channel is rated for 50 mA forward current and 200 mA pulsed forward current under the listed pulse condition.
Assembly guidance includes MSL 3 handling, a maximum of two Pb-free reflow cycles, recommended reflow at 240±5°C for 6 s, and repair-only hand soldering below 300°C for less than 3 s per terminal.
Key Features
- 1816 SMD package, 1.85 x 1.65 x 0.6 mm
- Red, green, and infrared emission channels
- 50 mA forward current per listed channel
- 200 mA pulsed forward current per channel
- Typical peak wavelengths: 655, 522, and 945 nm
- Minimum 8 mW optical power at 20 mA
- ±62 degree half viewing angle at Ta=25°C
- MSL 3 moisture sensitivity classification
- Operating temperature range from -40 to +85°C
- RoHS requirements met per datasheet
Typical Applications
- Multi-wavelength optical sensing
- Red and green status emitters
- Infrared illumination channels
- Compact SMD optical assemblies
- Pulsed LED emitter circuits
- Wearable optical modules
Procurement Notes
When requesting a quote for XL-SFH7016, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package is used for the XL-SFH7016 LED?
The XL-SFH7016 uses an 1816 SMD package with outline dimensions of 1.85 x 1.65 x 0.6 mm. The datasheet also lists a general dimension tolerance of ±0.1 mm unless otherwise specified.
Which wavelengths are specified for XL-SFH7016?
At IF=20 mA and Ta=25°C, the red channel has a 655 nm typical peak wavelength, the green channel has a 522 nm typical peak wavelength, and the infrared channel has a 945 nm typical peak wavelength.
What current ratings apply to the LED channels?
The red, green, and infrared channels are each specified for 50 mA forward current at Ta=25°C. Each channel also has a 200 mA pulsed forward current rating with 0.5 ms pulse width and 1/10 duty.
What assembly limits are listed for soldering?
The datasheet lists a maximum of two Pb-free reflow cycles and recommends 240±5°C for 6 s during reflow soldering. Hand soldering is recommended only for repair and rework below 300°C for less than 3 s per terminal.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.