Specifications
| Type | Description |
|---|---|
| Part Number | XL-SFH7015 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD package, 2.0 x 0.8 x 0.4 mm |
| Outline Dimensions | 2.0 x 0.8 x 0.4 mm, L/W/H |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Meets RoHS requirements |
| Pulse Forward Current | 200 mA, Red, pulse width 0.5 ms, duty 1/10, Ta=25°C |
| Pulse Forward Current | 200 mA, Infrared, pulse width 0.5 ms, duty 1/10, Ta=25°C |
| Forward Current | 50 mA, Red, Ta=25°C |
| Forward Current | 50 mA, Infrared, Ta=25°C |
| Maximum Reverse Voltage | 5 V, Ta=25°C |
| Operating Temperature Range | -40 to +85°C, Ta=25°C |
| Storage Temperature Range | -40 to +100°C, Ta=25°C |
| Lead Soldering Temperature/Time | 260°C max, <=6 s, Ta=25°C |
| Reverse Current | Max 10 µA, Red, VR=5 V, Ta=25°C |
| Reverse Current | Max 10 µA, Infrared, VR=5 V, Ta=25°C |
| Forward Voltage | Max 2.5 V, Red, IF=20 mA, Ta=25°C |
| Forward Voltage | Max 1.7 V, Infrared, IF=20 mA, Ta=25°C |
| Peak Wavelength | 655 min, 660 typ, 665 max nm, Red, IF=20 mA, Ta=25°C |
| Peak Wavelength | 850 min, 870 typ, 890 max nm, Infrared, IF=20 mA, Ta=25°C |
| Spectrum Radiation Bandwidth | 16 nm typ, Red, IF=20 mA, Ta=25°C |
| Spectrum Radiation Bandwidth | 24 nm typ, Infrared, IF=20 mA, Ta=25°C |
| Output Optical Power | 8.5 min, 10.5 typ mW, Red, IF=20 mA, Ta=25°C |
| Output Optical Power | 6 min, 7.2 typ mW, Infrared, IF=20 mA, Ta=25°C |
| Output Optical Power | 75 mW min, Red, 200 mA, duty 1/10 at 200 Hz, Ta=25°C |
| Output Optical Power | 50 mW min, Infrared, 200 mA, duty 1/10 at 200 Hz, Ta=25°C |
| Half Viewing Angle | ±60 deg typ, Ta=25°C |
| Luminous Intensity Bin Tolerance | ±15% |
| Forward Voltage Bin Tolerance | ±0.1 V |
| Hue Coordinate Bin Tolerance | ±0.01, X,Y coordinate bin tolerance |
| Dominant Wavelength Tolerance | ±1 nm |
| View Angle Tolerance | ±10° |
| Dimension Tolerance | ±0.1 mm, unless otherwise specified |
| Hand Soldering Iron Power | <30 W, recommended for repair/rework only |
| Hand Soldering Temperature | <300°C, each terminal once only, less than 3 s |
| Reflow Soldering Limit | Maximum 2 times, Pb-free reflow soldering |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s, reflow soldering |
| Unopened Storage Condition | <=30°C, <60% RH, use within 1 year |
| Opened Storage Condition | <=30°C, <10% RH, solder within 168 hours |
| Recommended Workshop Condition | <=30°C, <60% RH |
| Baking Condition | 60±5°C for 24 hours |
| Datasheet Status | request_only |
Product Overview
The XL-SFH7015 is a XINGLIGHT red and infrared SMD LED supplied in a 2.0 x 0.8 x 0.4 mm surface-mount package. Its datasheet identifies the device as an environmental protection product meeting RoHS requirements, with Moisture Sensitivity Level 3 handling requirements.
Electrical ratings include 50 mA forward current for both red and infrared emitters at Ta=25°C, 200 mA pulse forward current for each channel with 0.5 ms pulse width and 1/10 duty, and 5 V maximum reverse voltage. At IF=20 mA, the red channel has a maximum forward voltage of 2.5 V and a 660 nm typical peak wavelength, while the infrared channel has a maximum forward voltage of 1.7 V and an 870 nm typical peak wavelength.
Assembly guidance includes a 260°C maximum lead soldering temperature for up to 6 seconds, Pb-free reflow limited to two times, and recommended reflow welding at 240±5°C for 6 seconds. Applications can include compact red/infrared indication, optical sensing, pulse illumination, and dual-wavelength emitter designs.
Key Features
- Red and infrared emitters in one SMD LED
- 2.0 x 0.8 x 0.4 mm surface-mount package
- MSL 3 moisture sensitivity classification
- Meets RoHS requirements per manufacturer datasheet
- 50 mA forward current for each emitter
- 200 mA pulse forward current per channel
- 660 nm typical red peak wavelength
- 870 nm typical infrared peak wavelength
- ±60 degree typical half viewing angle
- Pb-free reflow soldering limited to two times
Typical Applications
- Red and infrared optical sensing
- Dual-wavelength emitter modules
- Compact SMD indicator designs
- Pulse illumination circuits
- Wearable optical assemblies
- Infrared signal emitter boards
- Space-constrained LED layouts
Procurement Notes
When requesting a quote for XL-SFH7015, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What type of LED is the XL-SFH7015?
The XL-SFH7015 is a XINGLIGHT red and infrared SMD LED. The datasheet identifies it as an LED component in a 2.0 x 0.8 x 0.4 mm surface-mount package.
What are the rated forward currents for XL-SFH7015?
Both red and infrared channels are rated for 50 mA forward current at Ta=25°C. Each channel also supports 200 mA pulse forward current with 0.5 ms pulse width and 1/10 duty.
What wavelengths does the XL-SFH7015 provide?
At IF=20 mA and Ta=25°C, the red channel has a 655 to 665 nm peak wavelength range with 660 nm typical. The infrared channel has an 850 to 890 nm range with 870 nm typical.
What soldering limits apply to this LED?
The datasheet lists 260°C maximum lead soldering for up to 6 seconds. Pb-free reflow soldering is limited to two times, with a recommended maximum welding temperature of 240±5°C for 6 seconds.
How should opened XL-SFH7015 packages be stored?
After opening the package, the storage condition is <=30°C and <10% RH, with soldering within 168 hours. If moisture protection fails or storage time is exceeded, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.