Specifications
| Type | Description |
|---|---|
| Part Number | XL-S2008RHIRC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 2008 SMD, 2.0 x 0.8 x 0.4 mm |
| Outline Dimensions | 2.0 x 0.8 x 0.4 mm; L/W/H |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Complies with RoHS requirements |
| Peak Application | Blood oxygen detection, heart rate monitoring, pulse detection |
| Pulse Forward Current, Red | 200 mA; Ta=25°C, pulse width=0.5 ms, duty=1/10 |
| Pulse Forward Current, Infrared | 200 mA; Ta=25°C, pulse width=0.5 ms, duty=1/10 |
| Forward Current, Red | 50 mA; Ta=25°C |
| Forward Current, Infrared | 50 mA; Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +100 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature/Time | 260°C for <=6 s; absolute maximum rating |
| Reverse Current, Red | Max 10 uA; VR=5 V, Ta=25°C |
| Reverse Current, Infrared | Max 10 uA; VR=5 V, Ta=25°C |
| Forward Voltage, Red | Max 2.5 V; IF=20 mA, Ta=25°C |
| Forward Voltage, Infrared | Max 1.7 V; IF=20 mA, Ta=25°C |
| Peak Wavelength, Red | 655 min, 660 typ, 665 max nm; IF=20 mA, Ta=25°C |
| Peak Wavelength, Infrared | 850 min, 870 typ, 890 max nm; IF=20 mA, Ta=25°C |
| Spectrum Radiation Bandwidth, Red | 16 typ nm; IF=20 mA, Ta=25°C |
| Spectrum Radiation Bandwidth, Infrared | 24 typ nm; IF=20 mA, Ta=25°C |
| Output Optical Power, Red | 8.5 min, 10.5 typ mW; IF=20 mA, Ta=25°C |
| Output Optical Power, Infrared | 6 min, 7.2 typ mW; IF=20 mA, Ta=25°C |
| Pulsed Output Optical Power, Red | 75 min mW; 200 mA, duty=1/10 at 200 Hz, Ta=25°C |
| Pulsed Output Optical Power, Infrared | 50 min mW; 200 mA, duty=1/10 at 200 Hz, Ta=25°C |
| Half Viewing Angle | ±60 deg; Ta=25°C |
| Luminous/Optical Intensity Bin Tolerance | ±15% |
| Forward Voltage Bin Tolerance | ±0.1 V |
| Hue Coordinate Bin Tolerance | ±0.01; X,Y coordinate bin tolerance |
| Dominant Wavelength Tolerance | ±1 nm |
| View Angle Tolerance | ±10° |
| Outline Dimension Tolerance | ±0.1 mm; unless otherwise specified |
| Tape/Reel Dimension Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering Iron Power | <30 W; manual soldering recommended only for repair/rework |
| Hand Soldering Temperature | <300°C; each terminal once only, less than 3 s |
| Reflow Soldering Limit | Maximum 2 times |
| Recommended Maximum Reflow Temperature | 240±5°C for 6 s |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or under 50°C for 30 s |
| Ultrasonic Cleaning Power | Max 300 W; pretest required before ultrasonic cleaning |
| Unopened Storage Condition | <=30°C, <60% RH, use within 1 year |
| Opened Storage Condition | <=30°C, <10% RH, solder within 168 h / 7 days |
| Recommended Workshop Condition | <=30°C, <60% RH |
| Baking Condition | 60±5°C for 24 h; if desiccant/package fails or storage time is exceeded |
| Datasheet Status | request_only |
Product Overview
XL-S2008RHIRC is a XINGLIGHT red and infrared SMD LED built in a compact 2008 surface-mount package. The outline dimensions are 2.0 x 0.8 x 0.4 mm, with an outline dimension tolerance of ±0.1 mm unless otherwise specified. The datasheet identifies the product for blood oxygen detection, heart rate monitoring, and pulse detection applications.
At Ta=25°C, both red and infrared emitters support 50 mA forward current and 200 mA pulse forward current with 0.5 ms pulse width and 1/10 duty. The maximum reverse voltage is 5 V. Red forward voltage is specified at max 2.5 V at IF=20 mA, while infrared forward voltage is max 1.7 V under the same test condition.
Optical specifications include 660 nm typical red peak wavelength and 870 nm typical infrared peak wavelength. Typical spectrum radiation bandwidths are 16 nm for red and 24 nm for infrared. Assembly guidance includes MSL 3 handling, maximum two reflow cycles, recommended maximum reflow temperature of 240±5°C for 6 s, and opened-package soldering within 168 h / 7 days.
Key Features
- Red and infrared emitters in 2008 SMD package
- 2.0 x 0.8 x 0.4 mm outline dimensions
- MSL 3 moisture sensitivity level
- RoHS requirements compliance stated in datasheet
- 50 mA forward current per red and infrared channel
- 200 mA pulse forward current per channel
- 660 nm typical red peak wavelength
- 870 nm typical infrared peak wavelength
- ±60 degree half viewing angle
- -40 to +85°C operating temperature range
Typical Applications
- Blood oxygen detection
- Heart rate monitoring
- Pulse detection
- Red optical sensing channels
- Infrared optical sensing channels
Procurement Notes
When requesting a quote for XL-S2008RHIRC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What type of LED is XL-S2008RHIRC?
XL-S2008RHIRC is a XINGLIGHT red and infrared SMD LED. The datasheet identifies it as a 2008 surface-mount device with a 2.0 x 0.8 x 0.4 mm outline.
What applications are listed for XL-S2008RHIRC?
The datasheet lists blood oxygen detection, heart rate monitoring, and pulse detection as product applications. These uses align with the red and infrared optical channels specified for the device.
What are the peak wavelengths for the two emitters?
At IF=20 mA and Ta=25°C, the red channel has a 655 min, 660 typ, 665 max nm peak wavelength. The infrared channel has an 850 min, 870 typ, 890 max nm peak wavelength.
What assembly limits are specified for this LED?
The datasheet specifies MSL 3 handling, a maximum of two reflow soldering cycles, and a recommended maximum reflow temperature of 240±5°C for 6 seconds. Opened packages should be soldered within 168 hours / 7 days.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.