Specifications
| Type | Description |
|---|---|
| Part Number | XL-SFH7016_XL-S3220PDC_XL-SFH7015 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 2008 SMD, 2.0 x 0.8 x 0.4 mm |
| Outline Dimensions | 2.0 x 0.8 x 0.4 mm; L/W/H |
| Moisture Sensitivity Level | MSL 3; moisture sensitivity level |
| RoHS Compliance | Meets RoHS requirements; environmental protection product |
| Pulse Forward Current Red | 200 mA; pulse width=0.5 ms, duty=1/10, Ta=25°C |
| Pulse Forward Current Infrared | 200 mA; pulse width=0.5 ms, duty=1/10, Ta=25°C |
| Forward Current Red | 50 mA; Ta=25°C |
| Forward Current Infrared | 50 mA; Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating |
| Storage Temperature Range | -40 to +100 °C; Ta=25°C absolute maximum rating |
| Lead Soldering Temperature/Time | 260°C max, ≤6 s; absolute maximum rating |
| Reverse Current Red | 10 µA max; VR=5 V, Ta=25°C |
| Reverse Current Infrared | 10 µA max; VR=5 V, Ta=25°C |
| Forward Voltage Red | 2.5 V max; IF=20 mA, Ta=25°C |
| Forward Voltage Infrared | 1.7 V max; IF=20 mA, Ta=25°C |
| Peak Wavelength Red | 655 min, 660 typ, 665 max nm; IF=20 mA, Ta=25°C |
| Peak Wavelength Infrared | 850 min, 870 typ, 890 max nm; IF=20 mA, Ta=25°C |
| Spectrum Radiation Bandwidth Red | 16 nm typ; IF=20 mA, Ta=25°C |
| Spectrum Radiation Bandwidth Infrared | 24 nm typ; IF=20 mA, Ta=25°C |
| Output Optical Power Red | 8.5 min, 10.5 typ mW; IF=20 mA, Ta=25°C |
| Output Optical Power Infrared | 6 min, 7.2 typ mW; IF=20 mA, Ta=25°C |
| Pulsed Output Optical Power Red | 75 mW min; 200 mA, 1/10 duty at 200 Hz, Ta=25°C |
| Pulsed Output Optical Power Infrared | 50 mW min; 200 mA, 1/10 duty at 200 Hz, Ta=25°C |
| Half Viewing Angle | ±60 deg typ; Ta=25°C |
| Luminous Intensity Bin Tolerance | ±15%; per bin tolerance |
| Forward Voltage Bin Tolerance | ±0.1 V; per bin tolerance |
| Hue Coordinate Bin Tolerance | ±0.01; X,Y coordinate bin tolerance |
| Dominant Wavelength Tolerance | ±1 nm; per bin tolerance |
| View Angle Tolerance | ±10°; per bin tolerance |
| Solderability Test | 0/22 failures; JESD22-B102, precondition 155±5°C for 8 h, Tsol=260±5°C for 10 s, 1 time, 22 samples |
| Resistance to Soldering Heat Test | 0/22 failures; JESD22-A106, Tsol=260±5°C for 10 s, 3 reflow passes, 22 samples |
| ESD HBM Test | 0/6 failures; JESD22-A114, HBM 250 V, 500 V, 1000 V, 2000 V, forward and reverse 3 times each |
| High Temperature Storage Test | 0/22 failures; JESD22-A103, Ta=100°C, 1000 h, 22 samples |
| Low Temperature Storage Test | 0/22 failures; JESD22-A119, Ta=-40°C, 1000 h, 22 samples |
| Thermal Shock Test | 0/22 failures; JESD22-A104, -40°C 30 min to 100°C 30 min, 300 cycles, 22 samples |
| High Temperature High Humidity Operating Test | 0/22 failures; JESD22-A101, T=85°C, RH=85%, IF=5 mA, 1000 h, 22 samples |
| DC Operating Life Test | 0/77 failures; MIL-STD-750 Method 1037, T=85°C, IF=5 mA, 1000 h, 77 samples |
| High Temperature High Humidity Storage Test | 0/22 failures; JESD22-A101, T=85°C, RH=85%, 1000 h, 22 samples |
| General Dimensional Tolerance | ±0.1 mm; unless otherwise specified |
| Hand Soldering Limit | 300°C max, less than 3 s per terminal, one time only; soldering iron power less than 30 W recommended |
| Reflow Soldering Limit | Maximum two reflow soldering cycles; Pb-free reflow soldering guideline |
| Recommended Maximum Reflow Temperature | 240±5°C for 6 s; product recommended maximum welding temperature |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or under 50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | 300 W max recommended; pretest required before ultrasonic cleaning |
| Unopened Storage Condition | ≤30°C, ≤60% RH, use within 1 year; before opening moisture-proof anti-static package |
| Opened Storage Condition | ≤30°C, ≤10% RH, solder within 168 h / 7 days; after opening package |
| Recommended Workshop Condition | ≤30°C, ≤60% RH; product operation/workshop condition |
| Baking Condition | 60±5°C for 24 h; if moisture absorbent faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
The XL-SFH7016_XL-S3220PDC_XL-SFH7015 is a XINGLIGHT red and infrared SMD LED supplied in a compact 2008 surface-mount package. Its outline dimensions are 2.0 x 0.8 x 0.4 mm, with a general dimensional tolerance of ±0.1 mm unless otherwise specified.
Electrical ratings include 50 mA forward current for both red and infrared channels at Ta=25°C, 200 mA pulse forward current with 0.5 ms pulse width and 1/10 duty, and 5 V maximum reverse voltage. Optical data includes 660 nm typical peak wavelength for red, 870 nm typical peak wavelength for infrared, and ±60° typical half viewing angle.
Assembly and storage controls are defined for moisture-sensitive handling. The device is rated MSL 3, with unopened storage at ≤30°C and ≤60% RH for use within one year, and opened storage at ≤30°C and ≤10% RH with soldering within 168 hours. Recommended reflow is limited to two cycles, with a recommended maximum reflow temperature of 240±5°C for 6 seconds.
Key Features
- Red and infrared emitters in one SMD LED package
- Compact 2008 SMD outline, 2.0 x 0.8 x 0.4 mm
- 660 nm typical red peak wavelength at 20 mA
- 870 nm typical infrared peak wavelength at 20 mA
- 50 mA forward current rating for each emitter
- 200 mA pulse forward current under specified pulse condition
- ±60 degree typical half viewing angle
- MSL 3 moisture sensitivity classification
- RoHS requirements met according to datasheet
- Two-cycle maximum Pb-free reflow soldering limit
Typical Applications
- Red and infrared emitter assemblies
- Compact optical sensing layouts
- Dual-wavelength indicator circuits
- Surface-mount LED modules
- Pulsed optical output designs
- Boards requiring MSL 3 handling
- Assemblies using Pb-free reflow soldering
Procurement Notes
When requesting a quote for XL-SFH7016_XL-S3220PDC_XL-SFH7015, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package is used for this XINGLIGHT LED?
The XL-SFH7016_XL-S3220PDC_XL-SFH7015 uses a 2008 SMD package with 2.0 x 0.8 x 0.4 mm outline dimensions. The datasheet also lists a general dimensional tolerance of ±0.1 mm unless otherwise specified.
What are the red and infrared peak wavelengths?
At IF=20 mA and Ta=25°C, the red channel is specified at 655 nm minimum, 660 nm typical, and 665 nm maximum. The infrared channel is specified at 850 nm minimum, 870 nm typical, and 890 nm maximum.
What current ratings apply to both emitters?
Both the red and infrared emitters are rated for 50 mA forward current at Ta=25°C. Pulse forward current is 200 mA for each emitter when pulse width is 0.5 ms, duty is 1/10, and Ta=25°C.
What soldering limits are listed in the datasheet?
The datasheet lists lead soldering at 260°C maximum for no more than 6 seconds. It also specifies a maximum of two Pb-free reflow cycles and recommends 240±5°C for 6 seconds as the maximum reflow temperature.
How should opened packages be stored before soldering?
After opening the package, the datasheet specifies storage at ≤30°C and ≤10% RH, with soldering completed within 168 hours, or 7 days. If storage time is exceeded, baking is listed at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.