Specifications
| Type | Description |
|---|---|
| Part Number | XLCNY17-1 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | DIP6, SMD6 |
| Component Type | Other |
| Current Transfer Ratio | min 20 %; IF=10 mA, VCE=10 V |
| Isolation Voltage | 5000 Vrms; input to output |
| Operating Temperature | -55 to +100 °C |
| Case | DIP6, SMD6 |
| Molding Compound Flammability Rating | UL 94V-0 |
| DIP6 Shipping Quantity | 65 pcs/tube; Part number XLCNY17-1 |
| SMD6 Shipping Quantity | 1000 pcs/tape and reel; Part number XLCNY17-1S |
| Forward Current | 60 mA; maximum rating, TA=25°C |
| Forward Peak Current | 1 A; pulse width <=1 us, duty ratio 0.001, TA=25°C |
| Reverse Voltage | 6 V; maximum rating, TA=25°C |
| Input Power Dissipation | 100 mW; maximum rating, TA=25°C |
| Collector Power Dissipation | 300 mW; maximum rating, TA=25°C |
| Collector Current | 100 mA; maximum rating, TA=25°C |
| Collector-Base Voltage | 70 V; maximum rating, TA=25°C |
| Collector-Emitter Voltage | 30 V; maximum rating, TA=25°C |
| Emitter-Collector Voltage | 7 V; maximum rating, TA=25°C |
| Total Power Dissipation | 350 mW; TA=25°C |
| Isolation Voltage | 5000 Vrms; 40 to 60% RH, AC for 1 minute; pins 1,2,3 shorted and pins 4,5,6 shorted |
| Storage Temperature Range | -55 to +125 °C |
| Soldering Temperature | 260 °C; 10 seconds |
| Forward Voltage | typ 1.2 V, max 1.5 V; IF=10 mA, TA=25°C |
| Reverse Current | max 10 uA; VR=3 V, TA=25°C |
| Input Capacitance | typ 50 pF; V=0 V, f=1 kHz, TA=25°C |
| Collector Dark Current | max 50 nA; VCE=10 V, TA=25°C |
| Collector-Base Breakdown Voltage | min 70 V; IB=0.1 mA, IF=0, TA=25°C |
| Collector-Emitter Breakdown Voltage | min 30 V; IC=0.1 mA, IF=0, TA=25°C |
| Emitter-Collector Breakdown Voltage | min 7 V; IE=0.01 mA, IF=0, TA=25°C |
| Collector-Emitter Saturation Voltage | typ 0.5 V; IF=50 mA, IC=2 mA, TA=25°C |
| Isolation Resistance | min 5e10 ohm, typ 1e11 ohm; DC 500 V, 40 to 60% RH, TA=25°C |
| Isolation Capacitance | typ 1 pF, max 2.5 pF; V=0 V, f=1 MHz, TA=25°C |
| Response Time Rise | typ 3 us, max 10 us; VCE=10 V, IC=2 mA, RL=100 ohm, TA=25°C |
| Response Time Fall | typ 3 us, max 10 us; VCE=10 V, IC=2 mA, RL=100 ohm, TA=25°C |
| Reflow Preheat Temperature | 150 to 200 °C; reflow soldering |
| Reflow Preheat Time | 60 to 120 s; reflow soldering |
| Reflow Ramp-Up Rate | max 3 °C/s; TL to TP |
| Reflow Liquidus Temperature | 217 °C; reflow soldering |
| Reflow Time Above Liquidus | 60 to 150 s; above TL |
| Reflow Peak Temperature | 260 °C; reflow soldering, no more than three times |
| Reflow Time Near Peak | max 30 s; time during which Tc is between TP-5 and TP |
| Reflow Ramp-Down Rate | max 6 °C/s; TP to TL |
| Wave Soldering Peak Temperature | 260 °C; wave soldering |
| Wave Soldering Time Within Peak Temperature | 10 s; wave soldering |
| Hand Soldering Iron Temperature | 360 °C +5 °C; within 3 s; product rework or sample testing |
| Datasheet Status | request_only |
Product Overview
XLCNY17-1 is a XINGLIGHT phototransistor optocoupler in the LED category. The extracted datasheet facts identify DIP6 and SMD6 case options, with XLCNY17-1 shipped as 65 pcs/tube for DIP6 and XLCNY17-1S shipped as 1000 pcs/tape and reel for SMD6. The molding compound flammability rating is UL 94V-0.
Electrical characteristics include a minimum 20% current transfer ratio under IF=10 mA and VCE=10 V, 5000 Vrms isolation voltage, and isolation resistance of at least 5e10 ohm at DC 500 V. Input characteristics include 60 mA maximum forward current, 1.2 V typical and 1.5 V maximum forward voltage at IF=10 mA, and 50 pF typical input capacitance.
Output-side ratings include 100 mA collector current, 70 V collector-base voltage, 30 V collector-emitter voltage, and 7 V emitter-collector voltage at TA=25°C. The response time rise and fall are each 3 us typical and 10 us maximum at VCE=10 V, IC=2 mA, and RL=100 ohm.
Key Features
- Phototransistor optocoupler in DIP6 and SMD6 cases
- Minimum 20% CTR at IF=10 mA, VCE=10 V
- 5000 Vrms input-to-output isolation voltage
- Operating temperature range from -55 to +100 °C
- UL 94V-0 molding compound flammability rating
- 60 mA maximum forward current at TA=25°C
- 100 mA maximum collector current at TA=25°C
- 30 V collector-emitter voltage maximum rating
- Typical 3 us rise and fall response times
- 260 °C reflow and wave soldering peak temperatures
Typical Applications
- Input-to-output signal isolation
- Phototransistor optocoupler switching circuits
- Isolated digital signal coupling
- Control interface isolation
- Low-capacitance isolation paths
- DIP6 tube assembly builds
- SMD6 tape-and-reel assembly
Procurement Notes
When requesting a quote for XLCNY17-1, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What type of device is the XLCNY17-1?
XLCNY17-1 is identified in the extracted datasheet facts as a XINGLIGHT phototransistor optocoupler in the LED category. The listed case options are DIP6 and SMD6.
What isolation voltage is specified for XLCNY17-1?
The datasheet facts specify 5000 Vrms isolation voltage. One condition lists input to output, while another specifies AC for 1 minute at 40 to 60% RH with pins 1,2,3 shorted and pins 4,5,6 shorted.
What current transfer ratio does XLCNY17-1 provide?
The extracted electrical data lists a minimum current transfer ratio of 20% for XLCNY17-1. The stated test condition is IF=10 mA and VCE=10 V.
What assembly temperature limits are listed?
The facts list 260 °C soldering temperature for 10 seconds, 260 °C reflow peak temperature for no more than three times, 260 °C wave soldering peak temperature, and 360 °C +5 °C hand soldering iron temperature within 3 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.