Specifications
| Type | Description |
|---|---|
| Part Number | XLH11A5-G |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package Case | DIP6 or SMD6; package outline dimensions shown in mm but numeric dimensions not provided in extracted text |
| Current Transfer Ratio Feature | ≥20% |
| Isolation Voltage Feature | 5000 Vrms |
| Operating Temperature Feature | -55 to +100 °C |
| Package Options | DIP6, SMD6 |
| Molding Compound Flammability | UL 94V-0 |
| Terminal Finish | matte tin-plated leads |
| DIP6 Shipping Quantity | 65 pcs/tube |
| SMD6 Shipping Quantity | 1000 pcs/tape and reel |
| Forward Current | 60 mA |
| Forward Peak Current | 1 A |
| Reverse Voltage | 6 V |
| Input Power Dissipation | 100 mW |
| Collector Power Dissipation | 300 mW |
| Collector Current | 100 mA |
| Collector-Base Voltage | 70 V |
| Collector-Emitter Voltage | 30 V |
| Emitter-Collector Voltage | 7 V |
| Total Power Dissipation | 350 mW |
| Isolation Voltage | 5000 Vrms |
| Operating Temperature | -55 to +100 °C |
| Storage Temperature Range | -55 to +125 °C |
| Soldering Temperature | 260 °C |
| Forward Voltage | typ 1.2 V, max 1.5 V |
| Reverse Current | max 10 µA |
| Input Capacitance | typ 50 pF |
| Collector Dark Current | max 50 nA |
| Collector-Base Breakdown Voltage | min 70 V |
| Collector-Emitter Breakdown Voltage | min 30 V |
| Emitter-Collector Breakdown Voltage | min 7 V |
| Current Transfer Ratio | min 20% |
| Collector-Emitter Saturation Voltage | typ 0.5 V |
| Isolation Resistance | min 5×10^10 Ω, typ 10^11 Ω |
| Isolation Capacitance | typ 1 pF, max 2.5 pF |
| Response Time Rise | typ 3 µs, max 10 µs |
| Response Time Fall | typ 3 µs, max 10 µs |
| Reflow Preheat Temperature | 150 to 200 °C |
| Reflow Preheat Time | 60 to 120 s |
| Reflow Ramp-Up Rate | max 3 °C/s |
| Reflow Liquidus Temperature | 217 °C |
| Reflow Time Above Liquidus | 60 to 150 s |
| Reflow Peak Temperature | 260 °C |
| Reflow Peak Time | max 30 s |
| Reflow Ramp-Down Rate | max 6 °C/s |
| Reflow Cycle Limit | no more than 3 times |
| Wave Soldering Average Ramp-Up Rate | ~200 °C/s |
| Wave Soldering Heating Rate During Preheat | typ 1 to 2 °C/s, max 4 °C/s |
| Wave Soldering Final Preheat Temperature | ~130 °C |
| Wave Soldering Preheat Time | >60 s |
| Wave Soldering Peak Temperature | 260 °C |
| Wave Soldering Peak Time | 10 s |
| Wave Soldering Ramp-Down Rate | max 5 °C/s |
| Hand Soldering Iron Temperature | 360 °C +5 °C within 3 s |
| DIP6 Packing | 65 pcs/tube, 1625 pcs/box, 19500 pcs/carton |
| SMD6 Packing | 1000 pcs/reel, 2000 pcs/box, 10000 pcs/carton |
| Datasheet Status | request_only |
Product Overview
XLH11A5-G is a XINGLIGHT phototransistor optocoupler in the LED category. The extracted datasheet facts identify DIP6 and SMD6 package options, with package outline dimensions shown in millimeters but no numeric dimensions included in the extracted text. The case molding compound is rated UL 94V-0, and the leads use a matte tin-plated finish with solderability per MIL-STD-202 Method 208.
The input side is rated for 60 mA forward current, 1 A forward peak current under pulse conditions, 6 V reverse voltage, and 100 mW input power dissipation. Output-side limits include 300 mW collector power dissipation, 100 mA collector current, 70 V collector-base voltage, 30 V collector-emitter voltage, and 7 V emitter-collector voltage.
Isolation and switching parameters include 5000 Vrms isolation voltage, isolation resistance of at least 5×10^10 Ω, typical 1 pF isolation capacitance, and 3 µs typical rise and fall times. These facts support use in isolated signal transfer, logic isolation, control feedback, and interface circuits requiring optocoupler isolation.
Key Features
- Phototransistor optocoupler with DIP6 and SMD6 package options
- Minimum 20% current transfer ratio at IF=10mA
- 5000 Vrms isolation between input and output
- Operating temperature range from -55 to +100 °C
- UL 94V-0 rated case molding compound
- Matte tin-plated leads for MIL-STD-202 solderability
- Typical 3 µs rise and fall response times
- Typical 1 pF isolation capacitance, 2.5 pF maximum
- Collector-emitter breakdown voltage rated 30 V minimum
- Reflow peak temperature specified at 260 °C
Typical Applications
- Isolated signal transfer
- Logic interface isolation
- Control feedback isolation
- Microcontroller input isolation
- PLC input interface circuits
- Low-speed digital isolation
- SMD6 tape-and-reel assembly
- DIP6 tube-packed assembly
Procurement Notes
When requesting a quote for XLH11A5-G, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is XLH11A5-G?
XLH11A5-G is identified as a XINGLIGHT phototransistor optocoupler in the LED category. The extracted facts list DIP6 and SMD6 package options and specify current transfer ratio, isolation voltage, temperature range, and phototransistor output characteristics.
What isolation rating is specified for this optocoupler?
The extracted datasheet facts specify 5000 Vrms isolation voltage. The detailed condition is AC for 1 minute at 40 to 60% RH with pins 1,2,3 shorted and pins 4,5,6 shorted together.
Which package and packing options are listed?
The listed package options are DIP6 and SMD6. DIP6 packing is 65 pcs per tube, 1625 pcs per box, and 19500 pcs per carton. SMD6 packing is 1000 pcs per reel, 2000 pcs per box, and 10000 pcs per carton.
What are the key input-side ratings?
Input-side maximum ratings include 60 mA forward current, 1 A forward peak current for pulse width ≤1 µs at duty ratio 0.001, 6 V reverse voltage, and 100 mW input power dissipation at TA=25°C unless otherwise specified.
What soldering limits are provided in the extracted facts?
The facts specify 260 °C soldering temperature for 10 seconds. Reflow data includes 150 to 200 °C preheat, 217 °C liquidus, 260 °C peak, and no more than 3 reflow cycles. Hand soldering is listed as 360 °C +5 °C within 3 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.