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XL-B324SURSYGC: F3 Red/YG Bicolor LED for Signal & Backlight Modules

The XL-B324SURSYGC is a compact F3 3.8mm red/YG bicolor LED with transparent epoxy. Designed for backlight modules, automotive interiors, and signal indication, this datasheet details its optical, electrical, and reli...

XL-B324SURSYGC: F3 Red/YG Bicolor LED for Signal & Backlight Modules

📌 Product Overview

The XL-B324SURSYGC is a high-brightness, F3-form-factor bicolor LED, emitting both red and yellow-green light from a single transparent epoxy package. It is engineered for applications requiring compact, reliable, and efficient illumination. Its design focuses on long-term stability and ease of integration into space-constrained environments, making it suitable for demanding industrial and consumer electronics applications.


🔍 Typical Applications

  • Backlight modules for displays and control panels
  • Automotive interior lighting and dashboard indicators
  • Signal indication in industrial control systems
  • Smart home device status indicators
  • General-purpose lighting in consumer electronics

⚙️ Key Technical Specifications

ParameterSymbolRedYGUnitTest Condition
Luminous IntensityIv400-700100-200mcdIF=20mA
Dominant Wavelengthλd630-640565-575nmIF=20mA
Forward VoltageVF1.8-2.42.0-2.6VIF=20mA
Viewing Angle2Ø1/23030degIF=20mA

🔒 Absolute Maximum Ratings & Process Limits

ParameterSymbolRedYGUnit
Max Power DissipationPD5050mW
Max Continuous Forward CurrentIF2020mA
Peak Forward CurrentIFP8080mA
Operating Temperature RangeTOPR-20 ~ +85°C
Reflow SolderingTSOL240°C ≤6s
Manual SolderingTSOL300°C 3s

📦 Package, Dimensions & Assembly Notes

  • Package Type: F3 3.8mm diameter through-hole LED
  • Dimensions: 3.8mm (L) x 3.0mm (W) x 5.2mm (H) x 28mm (lead length)
  • Soldering: Keep solder joint ≥2.0mm from epoxy body to prevent damage
  • Moisture Sensitivity Level (MSL): 2 (requires standard EIA packaging)
  • Assembly: Suitable for both wave and manual soldering with specified temperature limits

🚀 Sourcing & Supply Considerations

  • Binning options available for luminous intensity (A1-A6) and voltage (N12-7 to N13-1)
  • ROHS-compliant manufacturing ensures environmental compliance
  • EIA-standard packaging supports automated assembly processes
  • Recommended to verify authenticity with authorized distributors for critical projects

❓ FAQ

Q: What are the brightness binning options for this LED?
A: The XL-B324SURSYGC offers multiple brightness bins, including A1 (100-200mcd) and A6 (500-700mcd) for red, and A1 (100-200mcd) for yellow-green, allowing precise luminosity matching in designs.

Q: What is the recommended soldering process?
A: Reflow soldering should not exceed 240°C for ≤6s, while manual soldering requires 300°C for 3s. Maintain a 2.0mm clearance from the epoxy body to the solder joint.

Q: Does this LED meet automotive temperature requirements?
A: Yes, it operates reliably in temperatures from -40°C to +85°C, passing endurance tests including high-temperature storage (85°C) and cold/hot cycling.

Q: How does the bicolor functionality work?
A: The LED integrates red and yellow-green dies in a single package, enabling independent or simultaneous activation for status indication or color-mixing applications.

Q: What is the moisture sensitivity level for storage?
A: The LED has an MSL rating of 2, requiring standard EIA moisture-barrier packaging to prevent degradation during storage and handling.
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About Leon Zhang

Founder and Strategic Sourcing Lead, LDeepAI

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

Expertise: electronic component sourcing, China supply-chain verification, LED components, memory and storage sourcing, RFQ risk screening.

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