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XL-B324SURUBW LED: Binning Specs for Backlight & Signal Indication

The XL-B324SURUBW is a high-brightness red/blue dual-color LED with a 3.8x3.0mm F3 package. This article provides a detailed technical analysis of its specifications, including brightness, voltage, and wavelength binn...

XL-B324SURUBW LED: Binning Specs for Backlight & Signal Indication


📌 Product Overview

The XL-B324SURUBW is a high-brightness, red/blue dual-color LED from XINGLIGHT, featuring a compact F3 package. It is designed for applications requiring reliable, energy-efficient lighting. Its primary focus is on backlight modules, automotive interiors, and signal indication systems, where its dual-color output and robust construction provide significant design flexibility.

📌 Typical Applications

  • Backlight Modules: Ideal for status indicators and localized lighting in displays.
  • Automotive Interiors: Used for interior mood lighting, switch illumination, and dashboard indicators.
  • Signal Indication: Suitable for status and control panels in various electronic devices.
  • Smart Home Applications: Integration into smart switches, hubs, and control interfaces.
  • General Lighting: Effective for decorative and functional accent lighting in consumer electronics.

📌 Key Technical Specifications

The following table details the primary optical and electrical characteristics for the XL-B324SURUBW LED, tested at Ta=25°C and IF=20mA.

ParameterRedBlueUnit
Luminous Intensity (Iv)400 - 700 mcd1200 - 2100 mcd@ IF=20mA
Dominant Wavelength (λd)630 - 640 nm460 - 470 nm@ IF=20mA
Forward Voltage (VF)1.8 - 2.4 V2.8 - 3.4 V@ IF=20mA
Viewing Angle (2Ø1/2)3030deg

📌 Absolute Maximum Ratings & Process Limits

💡 Exceeding these parameters can cause permanent damage. The following table outlines the absolute maximum ratings for the XL-B324SURUBW.

ParameterRedBlueUnit
Max Power Dissipation (PD)5070mW
Max Continuous Forward Current (IF)2020mA
Peak Forward Current (IFP)8080mA
Operating Temperature (TOPR)-20 ~ +85-20 ~ +85°C
Reflow Soldering (TSOL)240°C, ≤6s-

📌 Package, Dimensions & Assembly Notes

The XL-B324SURUBW utilizes an F3 package with dimensions of 3.8 x 3.0 x 5.2 mm. For reliable assembly, adhere to the following soldering guidelines:

  • Reflow Soldering: Temperature must not exceed 240°C for a duration of 6 seconds or less.
  • Manual Soldering: Temperature must not exceed 300°C for a duration of 3 seconds.
  • Critical Requirement: The soldering point must be at least 2.0mm away from the bottom of the LED's epoxy body to prevent damage.

📌 Sourcing & Supply Considerations

  • Binning: The model is available in specific brightness (A5-B2), voltage (N12-9, N13-5), and wavelength (HB05, HR05) binning grades for consistent performance.
  • Packaging: Components are packaged according to EIA standard specifications to ensure integrity during handling and automated assembly.
  • Compliance: This is a RoHS-compliant, environmentally friendly product.
  • Moisture Sensitivity: MSL rating is 2, requiring standard handling precautions.

📌 FAQ

Q: What are the available brightness grades for the blue LED?
A: The blue LED's luminous intensity is graded into four bins: A9 (1200-1500 mcd), B1 (1500-1800 mcd), and B2 (1800-2100 mcd) at IF=20mA.

Q: What is the typical forward voltage for the red LED?
A: The typical forward voltage for the red LED ranges from 1.8V to 2.4V when tested at a forward current of 20mA.

Q: What is the maximum operating temperature for this LED?
A: The XL-B324SURUBW has a maximum operating temperature range of -20°C to +85°C.

Q: How does the wavelength binning work for this component?
A: The red LED has a dominant wavelength range of 630-640 nm, while the blue LED ranges from 460-470 nm. Specific codes (e.g., HR05 for red, HB05 for blue) denote tighter sub-ranges within these tolerances.

Q: What is the Moisture Sensitivity Level (MSL)?
A: The MSL for the XL-B324SURUBW is 2, indicating standard moisture sensitivity and requiring standard handling procedures in a production environment.

About Leon Zhang

Founder and Strategic Sourcing Lead, LDeepAI

Leon Zhang is the founder of LDeepAI, focusing on AI-assisted electronic component sourcing and verified China supply-chain support for overseas buyers. He previously worked within the Huaqiang Group ecosystem, including experience related to HQEW, one of China's well-known electronic component trading platforms. This background gives him practical insight into China's electronic component supply-chain structure, supplier screening, channel verification and cross-border sourcing workflows.

Expertise: electronic component sourcing, China supply-chain verification, LED components, memory and storage sourcing, RFQ risk screening.

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