Specifications
| Type | Description |
|---|---|
| Part Number | XL-2012RGBC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 2012 SMD, 2.0 x 1.2 x 0.8 mm |
| Outline Dimensions | 2.0 x 1.2 x 0.8 mm; L/W/H |
| Luminous Color | Colorful RGB; Transparent/water colloid |
| Moisture Sensitivity Level | MSL 3; Moisture sensitivity level |
| RoHS Compliance | Complies with RoHS directive; Environmental protection product |
| Packaging Standard | EIA standard packaging; Standard packaging |
| Power Dissipation Red | 50 mW; Ta=25°C |
| Power Dissipation Green | 70 mW; Ta=25°C |
| Power Dissipation Blue | 70 mW; Ta=25°C |
| Peak Forward Current Red | 80 mA; Pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Peak Forward Current Green | 80 mA; Pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Peak Forward Current Blue | 80 mA; Pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Forward Working Current Red | 20 mA; Ta=25°C |
| Forward Working Current Green | 20 mA; Ta=25°C |
| Forward Working Current Blue | 20 mA; Ta=25°C |
| Reverse Voltage Red | 5 V; Ta=25°C |
| Reverse Voltage Green | 5 V; Ta=25°C |
| Reverse Voltage Blue | 5 V; Ta=25°C |
| ESD Withstand Voltage | 2000 V; Antistatic ability |
| Operating Ambient Temperature | -40°C to +85°C; Topr |
| Storage Temperature | -40°C to +85°C; Tstg |
| Reflow Soldering Limit | 260°C, 6 s; Tsol welding condition |
| Manual Soldering Limit | 300°C, 3 s; Tsol welding condition |
| Luminous Intensity Red | Typ 130 mcd; IF=20 mA, Ta=25°C |
| Luminous Intensity Green | Typ 650 mcd; IF=20 mA, Ta=25°C |
| Luminous Intensity Blue | Typ 150 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength Red | Min 615 nm, Max 625 nm; IF=20 mA, Ta=25°C |
| Dominant Wavelength Green | Min 520 nm, Max 535 nm; IF=20 mA, Ta=25°C |
| Dominant Wavelength Blue | Min 460 nm, Max 475 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength Red | Typ 625 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength Green | Typ 525 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength Blue | Typ 465 nm; IF=20 mA, Ta=25°C |
| Spectral Half Width Red | Typ 20 nm; IF=20 mA, Ta=25°C |
| Spectral Half Width Green | Typ 30 nm; IF=20 mA, Ta=25°C |
| Spectral Half Width Blue | Typ 25 nm; IF=20 mA, Ta=25°C |
| Forward Voltage Red | Min 1.9 V, Max 2.3 V; IF=20 mA, Ta=25°C |
| Forward Voltage Green | Min 2.6 V, Max 3.4 V; IF=20 mA, Ta=25°C |
| Forward Voltage Blue | Min 2.6 V, Max 3.4 V; IF=20 mA, Ta=25°C |
| Viewing Angle | Typ 120 deg; R/G/B, IF=20 mA, Ta=25°C |
| Reverse Current Red | Max 1 uA; VR=5 V, Ta=25°C |
| Reverse Current Green | Max 1 uA; VR=5 V, Ta=25°C |
| Reverse Current Blue | Max 1 uA; VR=5 V, Ta=25°C |
| Brightness Bin D3 | 120 to 150 mcd; IF=20 mA |
| Brightness Bin D4 | 150 to 180 mcd; IF=20 mA |
| Brightness Bin D5 | 180 to 210 mcd; IF=20 mA |
| Brightness Bin E6 | 600 to 700 mcd; IF=20 mA |
| Brightness Bin E7 | 700 to 800 mcd; IF=20 mA |
| Brightness Bin E8 | 800 to 900 mcd; IF=20 mA |
| Brightness Bin E9 | 900 to 1000 mcd; IF=20 mA |
| Brightness Tolerance | ±10%; Brightness grading |
| Voltage Bin N11-4 | 1.9 to 2.1 V; IF=20 mA |
| Voltage Bin N11-5 | 2.1 to 2.3 V; IF=20 mA |
| Voltage Bin N13-2 | 2.6 to 2.8 V; IF=20 mA |
| Voltage Bin N13-3 | 2.8 to 3.0 V; IF=20 mA |
| Voltage Bin N13-4 | 3.0 to 3.2 V; IF=20 mA |
| Voltage Bin N13-5 | 3.2 to 3.4 V; IF=20 mA |
| Voltage Tolerance | ±0.1 V; Voltage grading |
| Wavelength Bin HR02 | 620 to 625 nm; IF=20 mA |
| Wavelength Bin HB04 | 460 to 465 nm; IF=20 mA |
| Wavelength Bin HB05 | 465 to 470 nm; IF=20 mA |
| Wavelength Bin HB06 | 470 to 475 nm; IF=20 mA |
| Wavelength Bin HG03 | 520 to 525 nm; IF=20 mA |
| Wavelength Bin HG04 | 525 to 530 nm; IF=20 mA |
| Wavelength Bin HG05 | 530 to 535 nm; IF=20 mA |
| Wavelength Tolerance | ±1 nm; Wavelength grading |
| Default Test Ambient Temperature | 25±5°C; Unless otherwise indicated |
| Moisture Proof Grade Test | 260°C max reflow, 10 s, two reflows; precondition 30°C, 70% RH, 168 h; JEITA ED-4701 300.301, failure criterion #1, 0/22 failures |
| Lead-Free Reflow Reliability Test | 245±5°C maximum reflow temperature, 5 s; JEITA ED-4701 303/303A, failure criterion #2, 0/22 failures |
| Thermal Cycling Test | -40°C 30 min to 25°C 5 min to 100°C 30 min to 25°C 5 min, 100 cycles; JESD22-A104, failure criterion #1, 0/22 failures |
| Thermal Shock Test | -35°C 15 min, conversion time 3 min, 85°C 15 min, 100 cycles; JESD22-A106, failure criterion #1, 0/22 failures |
| High Temperature Storage Test | Ta=100°C, 1000 h; JESD22-A103, failure criterion #1, 0/22 failures |
| Low Temperature Storage Test | Ta=-40°C, 1000 h; JESD22-A119, failure criterion #1, 0/22 failures |
| Normal Temperature Aging Test | 1000 h; Ta=25°C, IF=20 mA, JESD22-A108, failure criterion #1, 0/22 failures |
| Failure Criterion Forward Voltage | > U.S.L x 1.1; IF=20 mA |
| Failure Criterion Light Intensity | < L.S.L x 0.7; IF=20 mA |
| Failure Criterion Reverse Current | > U.S.L x 2.0; VR=5 V |
| Failure Criterion Soldering Reliability | Solder paste covering pads less than 95%; Welding reliability |
| Dimensional Tolerance | ±0.25 mm; Unless otherwise noted |
| Tape/Reel Dimensional Tolerance | ±0.15 mm; Belt and disk dimensions |
| Hand Soldering Iron Power | <30 W; Hand soldering recommended only for repair/rework |
| Hand Soldering Temperature | <300°C; Each terminal one time only, less than 3 s |
| Maximum Reflow Count | 2 times; Reflow soldering |
| Recommended Maximum Soldering Temperature | 240±5°C for 6 s; Product best maximum welding temperature |
| Alcohol Cleaning Condition | Under 30°C for 3 min or under 50°C for 30 s; After soldering |
| Ultrasonic Cleaning Power | Max 300 W; Pretest recommended |
| Unopened Storage Condition | <=30°C, <60% RH, use within 1 year; Before opening moisture-proof antistatic package |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 h / 7 days; After opening package |
| Recommended Workshop Condition | <=30°C, <60% RH; After opening package |
| Baking Condition | 60±5°C for 24 h; If desiccant/package failed or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
The XL-2012RGBC is a XINGLIGHT high brightness RGB SMD LED supplied in a 2012 surface-mount package with 2.0 x 1.2 x 0.8 mm outline dimensions. The datasheet identifies the luminous color as colorful RGB with transparent/water colloid construction, EIA standard packaging, MSL 3 moisture sensitivity level, and RoHS directive compliance.
Each red, green, and blue channel is rated for 20 mA forward working current at Ta=25°C, with 80 mA peak forward current under pulse width <=0.1 ms and duty <=1/10. Typical luminous intensity is 130 mcd red, 650 mcd green, and 150 mcd blue at IF=20 mA, Ta=25°C. Forward voltage ranges are 1.9 to 2.3 V for red and 2.6 to 3.4 V for green and blue.
Assembly guidance includes a 260°C, 6 s reflow soldering limit, 300°C, 3 s manual soldering limit, a recommended maximum soldering temperature of 240±5°C for 6 s, and a maximum of two reflow cycles. Storage guidance requires unopened storage at <=30°C and <60% RH within 1 year, or opened-package soldering within 168 h / 7 days at <=30°C and <40% RH.
Key Features
- 2012 SMD package, 2.0 x 1.2 x 0.8 mm
- Colorful RGB output with transparent/water colloid construction
- 20 mA forward working current per color channel
- Typical 120 deg viewing angle for R/G/B channels
- Red forward voltage range of 1.9 to 2.3 V
- Green and blue forward voltage range of 2.6 to 3.4 V
- Operating ambient temperature from -40°C to +85°C
- MSL 3 moisture sensitivity level
- RoHS directive compliant environmental product
- EIA standard packaging
Typical Applications
- Compact RGB status indicators
- Surface-mount color indication
- Display pixel lighting
- Color backlighting modules
- RGB signal lamps
- Small-format illumination assemblies
Procurement Notes
When requesting a quote for XL-2012RGBC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size does XL-2012RGBC use?
XL-2012RGBC uses a 2012 SMD package with outline dimensions of 2.0 x 1.2 x 0.8 mm. The datasheet lists a dimensional tolerance of ±0.25 mm unless otherwise noted.
What are the RGB forward voltage ranges?
At IF=20 mA and Ta=25°C, the red channel forward voltage is specified from 1.9 to 2.3 V. The green and blue channels are each specified from 2.6 to 3.4 V.
What soldering limits apply to this LED?
The datasheet lists a reflow soldering limit of 260°C for 6 s and a manual soldering limit of 300°C for 3 s. It also recommends a maximum soldering temperature of 240±5°C for 6 s and no more than two reflow cycles.
How should opened XL-2012RGBC packages be stored?
After opening the package, storage should be <=30°C and <40% RH, with soldering completed within 168 h / 7 days. The recommended workshop condition after opening is <=30°C and <60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.