Specifications
| Type | Description |
|---|---|
| Part Number | XL-2012UBC-DS |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD 2012, 2.0 x 1.2 x 0.8 mm |
| Appearance Dimension | 2.0 x 1.2 x 0.8 mm; L/W/H |
| Luminous Color | Blue; high brightness, transparent colloid |
| Encapsulant / Colloid | Transparent colloid; blue LED |
| Moisture Sensitivity Level | MSL 3; moisture sensitivity level stated as 3 levels |
| Operating Voltage | 2.0-4.5 V; VDD, Ta=25°C unless otherwise defined |
| Operating Current | 0.2 mA max; IDD, no load, VDD=3 V, Ta=25°C |
| Driving Current | 20 mA typ; IOL, VDS=1.0 V |
| Operating Temperature | -40 to 85 °C; TOPR |
| Storage Temperature Range | -40 to 85 °C; TSTR |
| Luminous Intensity | 120-240 mcd; Iv, IF=20 mA, Ta=25°C |
| Dominant Wavelength | 460-475 nm; λd, IF=20 mA, Ta=25°C |
| Peak Wavelength | 470 nm typ; λp, IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Brightness Bin D3 | 120-150 mcd; IF=20 mA |
| Brightness Bin D4 | 150-180 mcd; IF=20 mA |
| Brightness Bin D5 | 180-210 mcd; IF=20 mA |
| Brightness Bin D6 | 210-240 mcd; IF=20 mA |
| Wavelength Bin HB04 | 460-465 nm; IF=20 mA |
| Wavelength Bin HB05 | 465-470 nm; IF=20 mA |
| Wavelength Bin HB06 | 470-475 nm; IF=20 mA |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours; Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 50 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 50 cycles; IR reflow in-board 2 times; 100±5°C 20 min to -40±5°C 20 min |
| Anti-Tin Test | 260±5°C for 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; keep at peak for 10-15 s |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C; keep at peak for 5-10 s |
| Weldability Test | 235±5°C, immersion time 2±0.5 s; immersion speed 25±2.5 mm/s; tin loading rate ≥95% pad area |
| Outline Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering Iron Power | <30 W; recommended for repair/rework only |
| Hand Soldering Temperature | <300°C; each terminal once only, less than 3 s |
| Maximum Reflow Count | 2 times max; reflow soldering |
| Recommended Maximum Soldering Temperature | 240±5°C for 6 s; product recommended maximum welding temperature |
| Cleaning Condition | ≤30°C for 3 min or ≤50°C for 30 s; alcohol solvent cleaning after soldering |
| Ultrasonic Cleaning Power | ≤300 W; pretest recommended before cleaning |
| Unopened Storage Condition | ≤30°C, <60% RH, use within 1 year; before opening package |
| Opened Storage Condition | ≤30°C, <40% RH, solder within 168 hours; after opening package |
| Recommended Workshop Condition | ≤30°C, <60% RH; product operation after package opening |
| Baking Condition | 60±5°C for 24 hours; if desiccant/package fails or storage time is exceeded |
| Datasheet Status | request_only |
Product Overview
XL-2012UBC-DS is a XINGLIGHT high brightness blue SMD LED supplied in a compact SMD 2012 package. The outline dimensions are 2.0 x 1.2 x 0.8 mm with transparent colloid encapsulation for the blue LED structure. Unless otherwise noted, the outline dimension tolerance is ±0.25 mm.
At IF=20 mA and Ta=25°C, the LED is specified for 120-240 mcd luminous intensity, 460-475 nm dominant wavelength, 470 nm typical peak wavelength, and 120° typical viewing angle. Brightness bins cover D3 through D6 from 120 mcd to 240 mcd, while wavelength bins HB04 through HB06 cover 460 nm to 475 nm.
Assembly guidance includes a maximum of two reflow soldering passes, recommended maximum soldering temperature of 240±5°C for 6 s, and hand soldering below 300°C using an iron below 30 W for repair or rework only. Storage guidance includes MSL 3 handling, unopened storage within one year at ≤30°C and <60% RH, and soldering within 168 hours after opening at ≤30°C and <40% RH.
Key Features
- SMD 2012 package measures 2.0 x 1.2 x 0.8 mm
- Blue luminous color with transparent colloid encapsulation
- 120-240 mcd luminous intensity at IF=20 mA
- 460-475 nm dominant wavelength at IF=20 mA
- 470 nm typical peak wavelength at IF=20 mA
- 120° typical viewing angle at IF=20 mA
- 2.0-4.5 V operating voltage range
- 20 mA typical driving current condition
- MSL 3 moisture sensitivity level
- -40 to 85°C operating temperature range
- Two maximum reflow soldering passes
- Opened packages require soldering within 168 hours
Typical Applications
- Blue status indication
- Compact SMD indicator lighting
- Surface-mount panel indicators
- Blue display backlighting
- Signal and function indicators
- Low-profile PCB illumination
Procurement Notes
When requesting a quote for XL-2012UBC-DS, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package size is used by XL-2012UBC-DS?
XL-2012UBC-DS uses an SMD 2012 package with appearance dimensions of 2.0 x 1.2 x 0.8 mm. The datasheet states an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What optical output is specified for this blue LED?
At IF=20 mA and Ta=25°C, the LED is specified for 120-240 mcd luminous intensity, 460-475 nm dominant wavelength, 470 nm typical peak wavelength, and a 120° typical viewing angle.
What soldering limits apply to XL-2012UBC-DS?
The datasheet specifies two reflow soldering passes maximum and a recommended maximum soldering temperature of 240±5°C for 6 s. Hand soldering is for repair or rework only, using an iron below 30 W and below 300°C for less than 3 s per terminal.
How should opened packages be stored before soldering?
After opening the package, the datasheet specifies storage at ≤30°C and <40% RH, with soldering completed within 168 hours. If storage time is exceeded or the package/desiccant fails, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.