Specifications
| Type | Description |
|---|---|
| Part Number | XL-C2016P2S10-65B |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 2.0 x 1.6 x 0.6 mm SMD LED |
| Appearance Dimensions | 2.0 x 1.6 x 0.6 mm, L/W/H |
| Luminous Color and Colloid | White / yellow fog |
| Chip Technology | Flip chip |
| Moisture Sensitivity Level | MSL 3 |
| Power Dissipation | 3 W max, Ta=25°C |
| Forward Current | 700 mA max, Ta=25°C |
| Pulse Forward Current | 1500 mA max, Ta=25°C |
| Reverse Voltage | 5 V max, Ta=25°C |
| Operating Temperature | -40 to +135°C |
| Storage Temperature | -40 to +85°C |
| Soldering Temperature | 260°C for 6 s, reflow soldering |
| Forward Voltage | 2.8-3.4 V, IF=350 mA, Ta=25°C |
| Luminous Flux | 100-150 lm, IF=350 mA, Ta=25°C |
| Color Rendering Index | 70 typ Ra, IF=350 mA, Ta=25°C |
| Reverse Current | 5 uA max, VR=5 V, Ta=25°C |
| Viewing Angle | 120 deg typ, 2θ1/2, IF=350 mA, Ta=25°C |
| Junction Temperature | 145°C max, IF=350 mA |
| Color Temperature | 5500-7500 K, IF=350 mA, Ta=25°C |
| ESD Sensitivity | 2000 V, HBM |
| Brightness Bin K3 | 100-110 lm, IF=350 mA |
| Brightness Bin K4 | 110-120 lm, IF=350 mA |
| Brightness Bin K5 | 120-130 lm, IF=350 mA |
| Brightness Bin K6 | 130-140 lm, IF=350 mA |
| Brightness Bin K7 | 140-150 lm, IF=350 mA |
| Voltage Bin N13-3 | 2.8-3.0 V, IF=350 mA |
| Voltage Bin N13-4 | 3.0-3.2 V, IF=350 mA |
| Voltage Bin N13-5 | 3.2-3.4 V, IF=350 mA |
| Color Temperature Bin UW7-10 | 5500-6000 K, IF=350 mA |
| Color Temperature Bin UW9-10 | 6000-6500 K, IF=350 mA |
| Color Temperature Bin UW11-10 | 6500-7000 K, IF=350 mA |
| Test Environment Temperature | 25±5°C, unless otherwise indicated |
| Outline Dimension Tolerance | ±0.1 mm, if unmarked |
| Recommended Steel Mesh Thickness | 0.6-1 mm, heat dissipation substrate recommendation |
| Tape and Reel Dimensional Tolerance | ±0.1 mm, packaging dimensions |
| Hand Soldering Iron Power | <30 W, hand soldering recommended only for repair/rework |
| Hand Soldering Temperature | <300°C, each terminal once only |
| Hand Soldering Time | <3 s, each terminal once only |
| Maximum Reflow Cycles | 2 times max, reflow soldering |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s, product soldering recommendation |
| Cleaning Solvent | Alcohol, after soldering |
| Cleaning Condition | Under 30°C for 3 min or under 50°C for 30 s, alcohol cleaning after soldering |
| Ultrasonic Cleaning Power | 300 W max, pretest recommended |
| Unopened Storage Condition | ≤30°C, <60% RH, use within 1 year, before opening package |
| Opened Storage Condition | ≤30°C, <40% RH, solder within 168 hours / 7 days, after opening package |
| Recommended Workshop Condition | ≤30°C, <60% RH, operation environment |
| Baking Condition | 60±5°C for 24 hours, if desiccant/package fails or storage time exceeded |
| Working Life Test | 1000 hours, continuous lighting at maximum rated current at room temperature; 700 mA stated |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours, Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours, Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours, Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles, 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles, IR reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each |
| Anti-tin Test | 260±5°C, 10±1 s, 2 times, soldering temperature T.sol |
| Weldability Test | 235±5°C, immersion time 2±0.5 s, tin loading rate ≥95% pad area, immersion speed 25±2.5 mm/s |
| Datasheet Status | request_only |
Product Overview
The XL-C2016P2S10-65B is a XINGLIGHT white high-flux LED built in a 2.0 x 1.6 x 0.6 mm SMD LED package. The device uses flip-chip technology and has a white/yellow fog luminous colloid. Its specified moisture sensitivity level is MSL 3, with storage and workshop handling limits defined for humidity-controlled assembly.
Key Features
- 2.0 x 1.6 x 0.6 mm SMD LED package
- White/yellow fog colloid for white light output
- Flip-chip LED construction
- 100-150 lm luminous flux at 350 mA
- 2.8-3.4 V forward voltage at 350 mA
- 5500-7500 K color temperature range
- 120 deg typical viewing angle
- 700 mA maximum forward current
- 1500 mA maximum pulse forward current
- -40 to +135°C operating temperature
- MSL 3 moisture sensitivity level
- 2000 V HBM ESD sensitivity
Typical Applications
- Compact white-light LED modules
- High-flux indicator lighting
- SMD board-level illumination
- Cool-white lighting assemblies
- Reflow-assembled LED boards
- Temperature-rated lighting designs
Procurement Notes
When requesting a quote for XL-C2016P2S10-65B, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Alternatives
LITEON
LTPL-C0675WPYB
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
LITEON
LTPL-C0677WPYB
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
Application Verification Recommended
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FAQ
What package size does XL-C2016P2S10-65B use?
XL-C2016P2S10-65B is specified as a 2.0 x 1.6 x 0.6 mm SMD LED. The outline dimension tolerance is ±0.1 mm if unmarked.
What are the main optical ratings at 350 mA?
At IF=350 mA and Ta=25°C, the LED is specified for 100-150 lm luminous flux, 5500-7500 K color temperature, 70 typ Ra color rendering index, and 120 deg typical viewing angle.
What are the maximum current and thermal ratings?
At Ta=25°C, maximum forward current is 700 mA, pulse forward current is 1500 mA, and power dissipation is 3 W. The operating temperature range is -40 to +135°C, with 145°C maximum junction temperature at IF=350 mA.
What assembly handling conditions are specified?
The part is rated MSL 3. Reflow soldering is limited to two cycles, with a recommended maximum welding temperature of 240±5°C for 6 s. Hand soldering is recommended only for repair or rework below 30 W, below 300°C, and below 3 s per terminal.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.