Specifications
| Type | Description |
|---|---|
| Part Number | XL-C3570P5S10-62C3C2 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 3570, 3.5 x 7.0 x 0.7 mm |
| Appearance Dimension | 3.5 x 7.0 x 0.7 mm; L/W/H |
| Luminous Color and Colloid | white / yellow fog |
| Chip Technology | Flip Chip Technology |
| Moisture Sensitivity Level | MSL 3 |
| Power Dissipation | 15 W max; Ta=25°C |
| Forward Current | 1600 mA max; Ta=25°C |
| Pulse Forward Current | 2000 mA max; Ta=25°C |
| Operating Temperature | -40 to +135°C |
| Storage Temperature | -40 to +85°C |
| Soldering Temperature | 260°C for 3 sec; Reflow soldering |
| Luminous Flux | 1600-2100 lm; IF=1600 mA, Ta=25°C |
| Forward Voltage | 8.7-9.6 V; IF=1600 mA, Ta=25°C |
| Color Temperature | 5500-7000 K; IF=1600 mA, Ta=25°C |
| Color Rendering Index | 70 min; IF=1600 mA, Ta=25°C |
| Reverse Current | not specified; Ta=25°C |
| Viewing Angle | 120 deg; 2θ1/2, IF=1600 mA, Ta=25°C |
| Thermal Resistance | 3-5 °C/W; Rthj-s, IF=1600 mA, Ta=25°C |
| Junction Temperature | 145°C max; IF=1600 mA, Ta=25°C |
| ESD Sensitivity | 2000 V; HBM |
| Brightness Grade S1 | 1650-1800 lm; IF=1600 mA |
| Brightness Grade S2 | 1800-2000 lm; IF=1600 mA |
| Voltage Grade S13-3 | 8.7-9.0 V; IF=1600 mA |
| Voltage Grade S13-4 | 9.0-9.3 V; IF=1600 mA |
| Voltage Grade S13-5 | 9.3-9.6 V; IF=1600 mA |
| Color Temperature Grade UW7-10 | 5500-6000 K; IF=1600 mA |
| Color Temperature Grade UW9-10 | 6000-6500 K; IF=1600 mA |
| Color Temperature Grade UW11-10 | 6500-7000 K; IF=1600 mA |
| Test Environment Temperature | 25 ± 5°C; Unless otherwise indicated |
| Outline Dimension Tolerance | ±0.25 mm; Unless otherwise noted |
| Tape and Reel Dimensional Tolerance | ±0.1 mm; Belt and disk dimensions |
| Hand Soldering Iron Power | <30 W; Manual soldering |
| Hand Soldering Temperature | <300°C; Each terminal once, less than 3 sec |
| Maximum Reflow Count | 2 times max; Reflow soldering |
| Recommended Maximum Welding Temperature | 240 ± 5°C for 6 sec; Product recommendation |
| Storage Before Opening | ≤30°C, ≤60%RH, use within 1 year; Unopened moisture-proof anti-electrostatic package |
| Storage After Opening | ≤30°C, ≤40%RH, solder within 168 hours / 7 days; Opened package |
| Baking Condition | 60 ± 5°C for 24 hours; If moisture absorbent failed or storage time exceeded |
| Thermal Interface Dielectric Withstand | ≥500 V; Cooling medium dielectric withstand test |
| Drive Method | constant current; Recommended drive control |
| Datasheet Status | request_only |
Product Overview
The XL-C3570P5S10-62C3C2 is a XINGLIGHT white flip-chip LED supplied in a 3570 package with 3.5 x 7.0 x 0.7 mm appearance dimensions. The datasheet identifies white/yellow fog colloid, flip chip technology, and MSL 3 moisture sensitivity.
At IF=1600 mA and Ta=25°C, the LED is specified for 1600-2100 lm luminous flux, 8.7-9.6 V forward voltage, 5500-7000 K color temperature, 70 minimum CRI, and a 120 degree viewing angle. Thermal data includes 3-5 °C/W junction-to-solder thermal resistance and 145°C maximum junction temperature.
Assembly guidance includes 260°C for 3 seconds reflow soldering, a maximum of two reflow cycles, and a recommended maximum welding temperature of 240 ± 5°C for 6 seconds. Storage guidance includes use within 1 year before opening and soldering within 168 hours after opening under the stated humidity limits.
Key Features
- 3570 package, 3.5 x 7.0 x 0.7 mm
- White/yellow fog luminous colloid construction
- Flip chip LED technology
- MSL 3 moisture sensitivity classification
- 1600-2100 lm at IF=1600 mA
- 8.7-9.6 V forward voltage range
- 5500-7000 K color temperature range
- 70 minimum color rendering index
- 120 degree viewing angle at rated test current
- 3-5 °C/W junction-to-solder thermal resistance
- 145°C maximum junction temperature
- Constant-current drive method recommended
Typical Applications
- White LED lighting modules
- Constant-current lighting designs
- Cool-white illumination assemblies
- Reflow-assembled LED boards
- Thermally managed LED fixtures
- Tape-and-reel production assembly
Procurement Notes
When requesting a quote for XL-C3570P5S10-62C3C2, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Alternatives
LITEON
LTPA-H4S5338
Cross-reference candidate from XINGLIGHT replacement table; validate package, optical/electrical parameters, binning and sourcing requirements before substitution.
Application Verification Recommended
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FAQ
What package is used for XL-C3570P5S10-62C3C2?
XL-C3570P5S10-62C3C2 uses a 3570 LED package with appearance dimensions of 3.5 x 7.0 x 0.7 mm. The outline dimension tolerance is specified as ±0.25 mm unless otherwise noted.
What are the rated optical parameters at 1600 mA?
At IF=1600 mA and Ta=25°C, the datasheet specifies 1600-2100 lm luminous flux, 5500-7000 K color temperature, 70 minimum CRI, and a 120 degree viewing angle.
What soldering conditions are specified for this LED?
The extracted datasheet facts specify 260°C for 3 seconds for reflow soldering, with a maximum of two reflow cycles. The product recommendation lists a maximum welding temperature of 240 ± 5°C for 6 seconds.
How should opened packages be stored before soldering?
After opening, the package should be kept at ≤30°C and ≤40%RH, and the LEDs should be soldered within 168 hours, or 7 days. If storage time is exceeded, baking is specified at 60 ± 5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.