Specifications
| Type | Description |
|---|---|
| Part Number | XL-S1816RGIRC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 1816 SMD LED, 1.85 mm x 1.65 mm x 0.6 mm |
| Outline Dimensions | 1.85 x 1.65 x 0.6 mm; L/W/H |
| Moisture Sensitivity Level | MSL 3; moisture sensitivity level |
| Forward Pulse Current Red | 200 mA; pulse width=0.5 ms, duty=1/10, Ta=25°C |
| Forward Pulse Current Green | 200 mA; pulse width=0.5 ms, duty=1/10, Ta=25°C |
| Forward Pulse Current Infrared | 200 mA; pulse width=0.5 ms, duty=1/10, Ta=25°C |
| Forward Current Red | 50 mA; Ta=25°C |
| Forward Current Green | 50 mA; Ta=25°C |
| Forward Current Infrared | 50 mA; Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +100 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature/Time | 260°C max, <=6 s; absolute maximum rating |
| Reverse Current Red | max 10 µA; VR=5 V, Ta=25°C |
| Reverse Current Green | max 10 µA; VR=5 V, Ta=25°C |
| Reverse Current Infrared | max 10 µA; VR=5 V, Ta=25°C |
| Forward Voltage Red | min 1.5 V, typ 2.0 V, max 2.5 V; IF=20 mA, Ta=25°C |
| Forward Voltage Green | min 1.8 V, typ 2.6 V, max 2.8 V; IF=20 mA, Ta=25°C |
| Forward Voltage Infrared | min 0.8 V, typ 1.3 V, max 1.8 V; IF=20 mA, Ta=25°C |
| Peak Wavelength Red | min 645 nm, typ 655 nm, max 675 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength Green | min 520 nm, typ 522 nm, max 550 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength Infrared | min 930 nm, typ 945 nm, max 960 nm; IF=20 mA, Ta=25°C |
| Spectrum Radiation Bandwidth Red | typ 18 nm; IF=20 mA, Ta=25°C |
| Spectrum Radiation Bandwidth Green | typ 28 nm; IF=20 mA, Ta=25°C |
| Spectrum Radiation Bandwidth Infrared | typ 30 nm; IF=20 mA, Ta=25°C |
| Output Optical Power Green | min 8 mW; IF=20 mA, Ta=25°C |
| Output Optical Power Red | min 8 mW; IF=20 mA, Ta=25°C |
| Output Optical Power Infrared | min 8 mW; IF=20 mA, Ta=25°C |
| Output Optical Power Green Pulsed | 70 mW; 200 mA, 1/10 duty at 200 Hz |
| Output Optical Power Red Pulsed | 40 mW; 200 mA, 1/10 duty at 200 Hz |
| Output Optical Power Infrared Pulsed | 63 mW; 200 mA, 1/10 duty at 200 Hz |
| Half Viewing Angle | ±62 deg; Ta=25°C |
| Luminous/Radiant Intensity Bin Tolerance | ±15%; bin tolerance |
| Forward Voltage Bin Tolerance | ±0.1 V; bin tolerance |
| Hue Coordinate Bin Tolerance | ±0.01; X,Y coordinate bin tolerance |
| Dominant Wavelength Tolerance | ±1 nm; bin tolerance |
| View Angle Tolerance | ±10°; bin tolerance |
| Solderability Test | 0/22 failures; JESD22-B102, precondition 155±5°C 8 h, Tsol=260±5°C for 10 s, 1 time |
| Resistance to Soldering Heat Test | 0/22 failures; JESD22-A106, Tsol=260±5°C for 10 s, reflow 3 times |
| ESD HBM Test | 0/6 failures; JESD22-A114, HBM 250 V, 500 V, 1000 V, 2000 V, positive and negative 3 times each |
| High Temperature Storage Test | 0/22 failures; JESD22-A103, Ta=100°C, 1000 h |
| Low Temperature Storage Test | 0/22 failures; JESD22-A119, Ta=-40°C, 1000 h |
| Thermal Shock Test | 0/22 failures; JESD22-A104, -40°C 30 min to 100°C 30 min, 300 cycles |
| High Temperature High Humidity Operating Test | 0/22 failures; JESD22-A101, T=85°C, RH=85%, IF=5 mA, 1000 h |
| DC Operating Life Test | 0/77 failures; MIL-STD-750 Method 1037, T=85°C, IF=5 mA, 1000 h |
| High Temperature High Humidity Storage Test | 0/22 failures; JESD22-A101, T=85°C, RH=85%, 1000 h |
| Outline Dimension Tolerance | ±0.1 mm; unless otherwise specified |
| Tape/Reel Dimension Unit | mm; belt and disk dimensions |
| Tape/Reel Dimension Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering Iron Power | <30 W; manual soldering recommended only for repair/rework |
| Hand Soldering Temperature | <300°C; each terminal one time only |
| Hand Soldering Time | <3 s; each terminal one time only |
| Maximum Reflow Cycles | 2 times; reflow soldering |
| Recommended Maximum Soldering Temperature | 240±5°C for 6 s; reflow soldering |
| Cleaning Condition Alcohol | 30°C max for 3 min or 50°C max for 30 s; after soldering |
| Ultrasonic Cleaning Power | max 300 W; pretest required before cleaning |
| Unopened Storage Life | 1 year; moisture-proof anti-electrostatic package with desiccant |
| Storage Before Opening | <=30°C, <60% RH; before opening package |
| Storage After Opening | <=30°C, <10% RH; after opening package |
| Floor Life After Opening | 168 h / 7 days; after opening package, solder within specified time |
| Recommended Workshop Condition | <=30°C, <60% RH; product operation/workshop condition |
| Baking Condition | 60±5°C for 24 h; if desiccant/package failed or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
Electrical ratings cover red, green, and infrared channels. Each channel is rated for 50 mA forward current at Ta=25°C and 200 mA forward pulse current with 0.5 ms pulse width and 1/10 duty. Forward voltage is specified at IF=20 mA: red 1.5 to 2.5 V, green 1.8 to 2.8 V, and infrared 0.8 to 1.8 V. Maximum reverse voltage is 5 V, and reverse current is 10 µA maximum at VR=5 V.
Key Features
- 1816 SMD LED package, 1.85 x 1.65 x 0.6 mm
- RGB infrared SMD LED component structure
- MSL 3 moisture sensitivity classification
- 50 mA forward current per red, green, infrared channel
- 200 mA pulse current per channel at 1/10 duty
- Red peak wavelength typ 655 nm at IF=20 mA
- Green peak wavelength typ 522 nm at IF=20 mA
- Infrared peak wavelength typ 945 nm at IF=20 mA
- Half viewing angle specified as ±62 degrees
- Operating temperature range from -40 to +85 °C
- Reflow soldering recommended maximum 240±5°C for 6 s
- Floor life after opening specified as 168 h / 7 days
Typical Applications
- RGB-infrared optical indicators
- Compact SMD light emitters
- Pulsed LED emitter circuits
- Multi-wavelength sensing light sources
- Reflow-soldered LED assemblies
- Surface-mount optical modules
- 85°C operating LED designs
Procurement Notes
When requesting a quote for XL-S1816RGIRC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package is used for XL-S1816RGIRC?
XL-S1816RGIRC uses an 1816 SMD LED package with outline dimensions of 1.85 x 1.65 x 0.6 mm. The datasheet states an outline dimension tolerance of ±0.1 mm unless otherwise specified.
What are the forward current ratings per channel?
The red, green, and infrared channels are each rated for 50 mA forward current at Ta=25°C. Each channel also has a 200 mA forward pulse current rating with 0.5 ms pulse width and 1/10 duty.
What wavelengths are specified for the red, green, and infrared emitters?
At IF=20 mA and Ta=25°C, the typical peak wavelengths are 655 nm for red, 522 nm for green, and 945 nm for infrared. The datasheet also provides min and max ranges for each channel.
What handling limits apply after opening the package?
After opening, storage is specified at <=30°C and <10% RH, with a floor life of 168 hours or 7 days. If storage time is exceeded or the package/desiccant fails, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.