Specifications
| Type | Description |
|---|---|
| Part Number | XL-5050UYC-A |
| Manufacturer | XINGLIGHT |
| Product Type | High brightness yellow SMD LED |
| Category | LED |
| Package/Case | 5050 SMD LED, 5.0 x 5.0 x 1.6 mm |
| Outline Dimensions | 5.0 x 5.0 x 1.6 mm; L/W/H |
| Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Emitted Color | High brightness yellow |
| Lens / Colloid | Transparent colloid / water colloid |
| RoHS Compliance | Complies with RoHS Directive |
| Moisture Sensitivity Level | MSL 3 |
| Maximum Power Dissipation | 200 mW; Ta=25°C |
| Maximum Continuous Forward Current | 60 mA; Ta=25°C |
| Peak Forward Current | 120 mA; pulse width ≤0.1 ms, duty ≤1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Rating | 2000 V; antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85°C |
| Storage Temperature Range | -40 to +85°C |
| Lead Soldering Temperature / Time | 260°C, ≤6 s; absolute maximum rating |
| Luminous Intensity | 1300 to 2000 mcd; IF=60 mA, Ta=25°C |
| Dominant Wavelength | 585 to 595 nm; IF=60 mA, Ta=25°C |
| Peak Wavelength | 588 nm typ.; IF=60 mA, Ta=25°C |
| Forward Voltage | 1.8 to 2.4 V; IF=60 mA, Ta=25°C |
| Viewing Angle | 120° typ.; 2θ1/2, IF=60 mA, Ta=25°C |
| Half Wave Width | 20 nm typ.; IF=60 mA, Ta=25°C |
| Reverse Current | ≤5 µA; VR=5 V, Ta=25°C |
| Brightness Bin F3 | 1300 to 1450 mcd; IF=60 mA |
| Brightness Bin F4 | 1450 to 1600 mcd; IF=60 mA |
| Brightness Bin F5 | 1600 to 1800 mcd; IF=60 mA |
| Brightness Bin F6 | 1800 to 2000 mcd; IF=60 mA |
| Voltage Bin N12-7 | 1.8 to 2.0 V; IF=60 mA |
| Voltage Bin N12-8 | 2.0 to 2.2 V; IF=60 mA |
| Voltage Bin N12-9 | 2.2 to 2.4 V; IF=60 mA |
| Dominant Wavelength Bin HY03 | 585 to 587.5 nm; IF=60 mA |
| Dominant Wavelength Bin HY04 | 587.5 to 590 nm; IF=60 mA |
| Dominant Wavelength Bin HY05 | 590 to 592.5 nm; IF=60 mA |
| Dominant Wavelength Bin HY06 | 592.5 to 595 nm; IF=60 mA |
| Test Environment Temperature | 25±5°C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours; Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 50 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 50 cycles; IR reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each |
| Anti-Tin Test | 260±5°C for 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Profile | Peak 235°C +5/-0°C; time above 183°C 60-150 s; time at peak 10-15 s; heat-up rate max 3°C/s from 183°C to peak; keep 125±25°C for ≤120 s |
| Lead-Free Reflow Profile | Peak 255°C +0/-5°C; time above 217°C 60-120 s; time at peak 5-10 s; heat-up rate max 3°C/s from 217°C to peak; keep 175±25°C for ≤180 s; cooling rate max 6°C/s |
| Weldability Test | Tin loading rate ≥95% pad area; soldering temperature 235±5°C; immersion speed 25±2.5 mm/s; immersion time 2±0.5 s |
| Hand Soldering Recommendation | Soldering iron <30 W, temperature <300°C, less than 3 s per terminal, one time only; recommended only for repair/rework |
| Reflow Soldering Limit | Maximum 2 times |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or under 50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | ≤300 W; pretest recommended before cleaning |
| Unopened Storage Condition | ≤30°C, <60% RH, use within 1 year |
| Opened Storage Condition | ≤30°C, <40% RH, solder within 168 hours / 7 days |
| Recommended Workshop Condition | ≤30°C, <60% RH |
| Baking Condition | 60±5°C for 24 hours; if moisture absorbent material has faded or storage time exceeded |
| Packaging | EIA standard packaging; moisture-proof anti-electrostatic bag with desiccant |
| Process Compatibility | Suitable for SMT automatic production and infrared reflow soldering |
| Tape / Reel Dimensional Tolerance | ±0.1 mm; belt and disk dimensions |
| Datasheet Source | Manufacturer technical datasheet |
| Datasheet Status | request_only |
Product Overview
XL-5050UYC-A is a XINGLIGHT high brightness yellow SMD LED built in a 5050 surface-mount package. The outline dimensions are 5.0 x 5.0 x 1.6 mm, with a general dimensional tolerance of ±0.25 mm unless otherwise noted. The device uses transparent colloid / water colloid and is supplied in EIA standard packaging with a moisture-proof anti-electrostatic bag and desiccant.
At IF=60 mA and Ta=25°C, the LED is specified for 1300 to 2000 mcd luminous intensity, 585 to 595 nm dominant wavelength, 588 nm typical peak wavelength, 1.8 to 2.4 V forward voltage, 120° typical viewing angle, and 20 nm typical half wave width. Absolute maximum ratings include 200 mW power dissipation, 60 mA continuous forward current, 120 mA peak forward current under pulse conditions, 5 V maximum reverse voltage, and 2000 V ESD rating.
Assembly guidance includes SMT automatic production and infrared reflow soldering compatibility. Lead-free reflow is specified with a 255°C +0/-5°C peak, while reflow soldering is limited to a maximum of two times. Storage guidance is tied to MSL 3 handling, including 168 hours / 7 days soldering time after opening under the stated humidity limits.
Key Features
- High brightness yellow emission in 5050 SMD package
- 5.0 x 5.0 x 1.6 mm outline dimensions
- 1300 to 2000 mcd luminous intensity at 60 mA
- 585 to 595 nm dominant wavelength range
- 1.8 to 2.4 V forward voltage at 60 mA
- 120° typical viewing angle at 60 mA
- MSL 3 moisture sensitivity rating
- RoHS Directive compliant environmental product
- Suitable for SMT automatic production
- Infrared reflow soldering compatible
Typical Applications
- SMT LED assemblies
- Yellow indicator lighting
- Surface-mount signal displays
- Infrared reflow PCB production
- Assemblies requiring 120° viewing angle
- Applications using 585 to 595 nm yellow output
Procurement Notes
When requesting a quote for XL-5050UYC-A, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package is used for XL-5050UYC-A?
XL-5050UYC-A uses a 5050 SMD LED package with outline dimensions of 5.0 x 5.0 x 1.6 mm. The datasheet lists a ±0.25 mm dimensional tolerance unless otherwise noted.
What are the main optical specifications of XL-5050UYC-A?
At IF=60 mA and Ta=25°C, the LED is specified for 1300 to 2000 mcd luminous intensity, 585 to 595 nm dominant wavelength, 588 nm typical peak wavelength, and 120° typical viewing angle.
What current and voltage ratings apply to XL-5050UYC-A?
The datasheet lists 60 mA maximum continuous forward current, 120 mA peak forward current under pulse conditions, 1.8 to 2.4 V forward voltage at 60 mA, and 5 V maximum reverse voltage.
How should XL-5050UYC-A be handled after opening?
After opening the moisture-proof anti-electrostatic package, storage should be ≤30°C and <40% RH, and soldering should be completed within 168 hours / 7 days. Baking is specified at 60±5°C for 24 hours when required.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.