Specifications
| Type | Description |
|---|---|
| Part Number | XL-5050YWC |
| Manufacturer | XINGLIGHT |
| Product Type | High brightness yellow SMD LED |
| Category | LED |
| Package/Case | 5050 SMD LED |
| Outline Dimensions | 5.0 x 5.0 x 1.6 mm |
| Emitted Color | High brightness yellow |
| Lens/Colloid Color | Yellow colloid |
| RoHS Compliance | Complied with RoHS Directive |
| Moisture Sensitivity Level | MSL 3 |
| Packaging Standard | EIA standard packaging |
| Assembly Compatibility | Suitable for SMT automatic production |
| Reflow Compatibility | Suitable for infrared reflow soldering process |
| Maximum Power Dissipation | 200 mW, Ta=25°C |
| Maximum Continuous Forward Current | 60 mA, Ta=25°C |
| Peak Forward Current | 120 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V, Ta=25°C |
| ESD Rating | 2000 V; test model not specified |
| Operating Temperature Range | -40 to +85 °C |
| Storage Temperature Range | -40 to +85 °C |
| Lead Soldering Temperature/Time | 260°C <=6 s |
| Luminous Flux | 13 lm min, 20 lm typ, 27 lm max at IF=60 mA, Ta=25°C |
| Color Temperature | 1600 K min, 2200 K max at IF=60 mA, Ta=25°C |
| Chromaticity Coordinate X | Not specified; table shows blank/placeholder values at IF=60 mA |
| Chromaticity Coordinate Y | Not specified; table shows blank/placeholder values at IF=60 mA |
| Forward Voltage | 2.8 V min, 3.4 V max at IF=60 mA, Ta=25°C |
| Viewing Angle | 120 deg typ, 2θ1/2, IF=60 mA, Ta=25°C |
| Reverse Current | 5 μA max at VR=5 V, Ta=25°C |
| Brightness Bin H8 | 13-17 lm at IF=60 mA |
| Brightness Bin H9 | 17-20 lm at IF=60 mA |
| Brightness Bin J1 | 20-23 lm at IF=60 mA |
| Brightness Bin J2 | 23-27 lm at IF=60 mA |
| Forward Voltage Bin N13-3 | 2.8-3.0 V at IF=60 mA |
| Forward Voltage Bin N13-4 | 3.0-3.2 V at IF=60 mA |
| Forward Voltage Bin N13-5 | 3.2-3.4 V at IF=60 mA |
| Color Temperature Bin YW5-4 | 1600-1800 K at IF=60 mA |
| Color Temperature Bin YW7-4 | 1800-2000 K at IF=60 mA |
| Color Temperature Bin YW9-4 | 2000-2200 K at IF=60 mA |
| Test Ambient Temperature | 25±5°C unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature and High Humidity Storage Test | 240 hours; Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours at Ta=85±5°C |
| Low Temperature Storage Test | Ta=-40±5°C reliability endurance test |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100±5°C for 20 min, -40±5°C for 20 min |
| Anti-Tin Test | 260±5°C, 10±1 s, 2 times |
| Lead Reflow Profile | Max temperature 235°C +5/-0°C; peak time 10-15 s; above 183°C for 60-150 s |
| Lead-Free Reflow Profile | Max temperature 255°C +0/-5°C; peak time 5-10 s; above 217°C for 60-120 s |
| Weldability Test | 235±5°C, immersion time 2±0.5 s; tin loading rate >=95% pad area |
| Mechanical Dimension Tolerance | ±0.25 mm unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm for belt and disk dimensions |
| Hand Soldering Recommendation | Soldering iron <30 W, temperature <300°C, <3 s per terminal, one time only |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s |
| Maximum Reflow Count | 2 times |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or under 50°C for 30 s |
| Ultrasonic Cleaning Power | <=300 W; pretest recommended before cleaning |
| Unopened Storage Condition | <=30°C, <60% RH, use within 1 year |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours / 7 days |
| Recommended Workshop Condition | <=30°C, <60% RH |
| Baking Condition | 60±5°C for 24 hours if moisture absorbent faded or storage time exceeded |
| Circuit Design Requirement | Current through each LED must not exceed absolute maximum rating; protection resistors recommended |
| Peak/Dominant Wavelength | Not specified in provided datasheet content |
| Datasheet Source | Manufacturer technical datasheet |
| Datasheet Status | request_only |
Product Overview
XL-5050YWC is a XINGLIGHT high brightness yellow SMD LED supplied in a 5050 package format. The outline dimensions are 5.0 x 5.0 x 1.6 mm, with yellow colloid and a 120 degree typical viewing angle at IF=60 mA and Ta=25°C.
Electrical and optical data include 13 lm minimum, 20 lm typical, and 27 lm maximum luminous flux at IF=60 mA. Forward voltage is specified from 2.8 V to 3.4 V, reverse current is 5 μA maximum at VR=5 V, and the color temperature range is 1600 K to 2200 K. Peak or dominant wavelength values are not specified in the provided datasheet content.
The device is suitable for SMT automatic production and infrared reflow soldering. It is RoHS-compliant, rated MSL 3, and supplied with EIA standard packaging. Handling data include unopened storage at <=30°C and <60% RH within 1 year, opened storage at <=30°C and <40% RH with soldering within 168 hours, and a maximum of two reflow soldering cycles.
Key Features
- 5050 SMD LED package, 5.0 x 5.0 x 1.6 mm
- High brightness yellow emission with yellow colloid
- 13 to 27 lm luminous flux at IF=60 mA
- 2.8 to 3.4 V forward voltage range
- 120 degree typical viewing angle at IF=60 mA
- 60 mA maximum continuous forward current
- 120 mA peak forward current under pulsed conditions
- RoHS-compliant product with MSL 3 rating
- Suitable for SMT automatic production
- Compatible with infrared reflow soldering process
Typical Applications
- SMT automatic production
- Infrared reflow soldered assemblies
- Yellow LED indication circuits
- RoHS-compliant LED designs
- Rework and repair soldering
- Current-limited LED circuits
Procurement Notes
When requesting a quote for XL-5050YWC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package is used for XL-5050YWC?
XL-5050YWC uses a 5050 SMD LED package. The datasheet outline dimensions are 5.0 x 5.0 x 1.6 mm, with mechanical dimension tolerance listed as ±0.25 mm unless otherwise noted.
What are the main optical ratings for this LED?
At IF=60 mA and Ta=25°C, XL-5050YWC is specified for 13 lm minimum, 20 lm typical, and 27 lm maximum luminous flux. The typical viewing angle is 120 degrees, and color temperature is 1600 K to 2200 K.
What forward voltage range is specified?
The forward voltage range is 2.8 V minimum to 3.4 V maximum at IF=60 mA and Ta=25°C. The datasheet also lists voltage bins N13-3, N13-4, and N13-5 across 2.8 V to 3.4 V.
How should opened reels be stored before soldering?
After opening the moisture-proof anti-electrostatic package, storage should be <=30°C and <40% RH. The datasheet states that devices should be soldered within 168 hours, or 7 days, after opening.
Does the datasheet specify peak or dominant wavelength?
No. The provided datasheet content does not specify a peak or dominant wavelength value. It identifies the emitted color as high brightness yellow and provides color temperature bins from 1600 K to 2200 K.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.