Specifications
| Type | Description |
|---|---|
| Part Number | XL-5050UYC |
| Manufacturer | XINGLIGHT |
| Product Type | High brightness yellow SMD LED |
| Category | LED |
| Package/Case | 5050 SMD LED, 5.0 x 5.0 x 1.6 mm |
| Component Type | LED |
| Outline Dimensions | 5.0 x 5.0 x 1.6 mm, L/W/H |
| Package Suitability | SMT automatic production; infrared reflow soldering process |
| Emitted Color | High brightness yellow |
| Lens / Colloid | Water clear / transparent colloid |
| RoHS Compliance | Complied with RoHS Directive; environmental protection products |
| Moisture Sensitivity Level | MSL 3 |
| Maximum Power Dissipation | 200 mW at Ta=25°C |
| Maximum Continuous Forward Current | 60 mA at Ta=25°C |
| Peak Forward Current | 120 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V at Ta=25°C |
| ESD / Antistatic Ability | 2000 V; test model not specified |
| Operating Temperature Range | -40 to +85°C |
| Storage Temperature Range | -40 to +85°C |
| Lead Soldering Temperature / Time | 260°C, <=6 s |
| Luminous Intensity | 600-1000 mcd at IF=60 mA, Ta=25°C |
| Dominant Wavelength | 585-595 nm at IF=60 mA, Ta=25°C |
| Peak Wavelength | Typ. 588 nm at IF=60 mA, Ta=25°C |
| Forward Voltage | 1.8-2.4 V at IF=60 mA, Ta=25°C |
| Viewing Angle | Typ. 120° at IF=60 mA, Ta=25°C |
| Half Wave Width | Typ. 20 nm at IF=60 mA, Ta=25°C |
| Reverse Current | <=5 µA at VR=5 V, Ta=25°C |
| Brightness Bin E6 | 600-700 mcd at IF=60 mA |
| Brightness Bin E7 | 700-800 mcd at IF=60 mA |
| Brightness Bin E8 | 800-900 mcd at IF=60 mA |
| Brightness Bin E9 | 900-1000 mcd at IF=60 mA |
| Voltage Bin N12-7 | 1.8-2.0 V at IF=60 mA |
| Voltage Bin N12-8 | 2.0-2.2 V at IF=60 mA |
| Voltage Bin N12-9 | 2.2-2.4 V at IF=60 mA |
| Dominant Wavelength Bin HY03 | 585-587.5 nm at IF=60 mA |
| Dominant Wavelength Bin HY04 | 587.5-590 nm at IF=60 mA |
| Dominant Wavelength Bin HY05 | 590-592.5 nm at IF=60 mA |
| Dominant Wavelength Bin HY06 | 592.5-595 nm at IF=60 mA |
| Test Environment Temperature | 25±5°C unless otherwise indicated |
| Working Life Reliability Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours; Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours at Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours at Ta=-40±5°C |
| Cold and Hot Cycle Test | 50 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 50 cycles; IR reflow in-board 2 times; 100±5°C for 20 min to -40±5°C for 20 min |
| Anti-Tin Test | 260±5°C, 10±1 s, 2 times; soldering temperature T.sol |
| Lead Reflow Profile | Peak 235°C +5/-0°C; time at peak 10-15 s; heat-up max 3°C/s from 183°C to peak; 125±25°C <=120 s; above 183°C for 60-150 s |
| Lead-Free Reflow Profile | Peak 255°C +0/-5°C; time at peak 5-10 s; heat-up max 3°C/s from 217°C to peak; 175±25°C <=180 s; above 217°C for 60-120 s; cooling max 6°C/s |
| Weldability Test | Tin loading rate >=95% pad area; 235±5°C; 25±2.5 mm/s immersion speed; 2±0.5 s immersion time |
| Mechanical Dimension Tolerance | ±0.25 mm unless otherwise noted |
| Tape / Reel Dimension Tolerance | ±0.1 mm for belt and disk dimensions |
| Hand Soldering | Soldering iron <30 W; temperature <300°C; <3 s per terminal; one time only; repair and rework |
| Maximum Reflow Cycles | 2 times maximum |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s |
| Cleaning Conditions | Alcohol cleaning under 30°C for 3 min or under 50°C for 30 s after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest required |
| Unopened Storage | 1 year in moisture-proof anti-electrostatic package with moisture absorbent material |
| Storage Before Opening | <=30°C, <60% RH; use within 1 year |
| Storage After Opening | <=30°C, <40% RH; solder within 168 hours / 7 days; recommended workshop condition <=30°C and <60% RH |
| Baking Condition | 60±5°C for 24 hours if moisture absorbent material has faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-5050UYC is a XINGLIGHT high brightness yellow SMD LED supplied in a 5050 package with 5.0 x 5.0 x 1.6 mm outline dimensions. The device uses a water clear transparent colloid and emits yellow light with a 585-595 nm dominant wavelength range.
Key Features
- 5050 SMD package with 5.0 x 5.0 x 1.6 mm outline
- High brightness yellow emission with water clear colloid
- 600-1000 mcd luminous intensity at IF=60 mA
- 585-595 nm dominant wavelength at IF=60 mA
- 1.8-2.4 V forward voltage at IF=60 mA
- Typical 120° viewing angle at IF=60 mA
- 60 mA maximum continuous forward current at Ta=25°C
- MSL 3 moisture sensitivity level for assembly handling
- Compatible with SMT automatic production and infrared reflow
- RoHS-compliant environmental protection product
Typical Applications
- Yellow SMT indicator assemblies
- Surface-mount signal lighting
- Panel status indication
- PCB-mounted yellow light output
- Reflow-assembled LED modules
- Wide-angle visual indication
- Brightness-binned LED assemblies
Procurement Notes
When requesting a quote for XL-5050UYC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
Related Technical Articles
FAQ
What package is used for XL-5050UYC?
XL-5050UYC uses a 5050 SMD LED package with 5.0 x 5.0 x 1.6 mm outline dimensions and is suitable for SMT automatic production and infrared reflow soldering.
What are the main optical specifications?
At IF=60 mA and Ta=25°C, XL-5050UYC provides 600-1000 mcd luminous intensity, 585-595 nm dominant wavelength, typical 588 nm peak wavelength, typical 20 nm half wave width, and typical 120° viewing angle.
What forward voltage and current ratings apply?
The forward voltage range is 1.8-2.4 V at IF=60 mA and Ta=25°C. Maximum continuous forward current is 60 mA, and peak forward current is 120 mA under the specified pulsed condition.
How should the LED be stored after opening?
After opening, storage should be <=30°C and <40% RH, with soldering completed within 168 hours or 7 days. Baking is specified at 60±5°C for 24 hours if storage time is exceeded.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: June 30, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.