XL-C2016P2S10-65B White High-Flux SMD LED

Specifications

Product Overview

The XL-C2016P2S10-65B is a XINGLIGHT white high-flux SMD LED built in a 2.0 x 1.6 x 0.6 mm surface-mount package. The device uses flip chip technology and has a white/yellow fog luminous colloid. It is classified as MSL 3, with an outline dimension tolerance of ±0.1 mm unless otherwise marked.

At IF=350 mA and Ta=25°C, the LED is specified for 2.8-3.4 V forward voltage, 100-150 lm luminous flux, 70 typ Ra color rendering index, 5500-7500 K color temperature, and a 120° typ viewing angle. The junction temperature rating is 145°C max, reverse current is 5 uA max at VR=5 V, and ESD sensitivity is 2000 V HBM.

Assembly data includes 260°C for 6 seconds reflow soldering, with a recommended maximum welding temperature of 240±5°C for 6 seconds and a maximum of 2 reflow cycles. Hand soldering is recommended only for repair or rework, using <30 W, <300°C, and <3 seconds per terminal. These parameters suit compact white LED illumination, backlight, indicator, and module designs where package size, thermal handling, and bin selection are design inputs.

Key Features

• 2.0 x 1.6 x 0.6 mm SMD LED package
• White emission with yellow fog colloid construction
• Flip chip technology listed in product characteristics
• MSL 3 moisture sensitivity classification
• 100-150 lm luminous flux at IF=350 mA
• 2.8-3.4 V forward voltage at IF=350 mA
• 5500-7500 K color temperature range
• 120° typical viewing angle at IF=350 mA
• 700 mA maximum forward current rating
• -40 to +135°C operating temperature range
• 260°C for 6 seconds reflow soldering rating
• 2000 V HBM ESD sensitivity

Typical Applications

• Compact white LED lighting
• Indicator and signal illumination
• Backlight source designs
• Small illumination modules
• Cool white lighting assemblies
• Reflow-assembled LED boards
• Bin-controlled LED products

Procurement Notes

When requesting a quote for XL-C2016P2S10-65B, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.