Specifications
| Type | Description |
|---|---|
| Part Number | XL-IRM0038C-38B |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package Case | SMD epoxy resin semi-circular spherical package, 5.0 x 5.0 x 3.5 mm body, 3.1 mm pin length |
| Component Type | Sensor |
| Supply Voltage Absolute Maximum | 6.0 V; Ta=25°C |
| Operating Ambient Temperature | -20°C to +85°C; absolute maximum rating |
| Storage Ambient Temperature | -40°C to +125°C; absolute maximum rating |
| Wave Soldering Temperature | 260°C, <=6 s; soldering condition |
| Manual Soldering Temperature | 300°C, 3 s; soldering condition |
| Working Current | 0.3 min, 0.4 typ, 0.5 max mA; VDD=5 V, Ta=25°C |
| Receive Distance, 0° | 10 min, 15 typ m; Ta=25°C; transmitter CH3018-12U; indoor, no direct sunlight on receiving window; 40 W electronic ballast fluorescent lamp 1 m above/front; 200±50 lux |
| Receive Distance, Left 35° | 5 min, 6 typ m; Ta=25°C |
| Receive Distance, Right 35° | 5 min, 6 typ m; Ta=25°C |
| Carrier Frequency | 37.9 typ kHz; Ta=25°C |
| BPF Width | 6 typ kHz; Ta=25°C |
| Low Level Output Voltage | 250 max mV; Isink=2.0 mA, Ta=25°C |
| High Level Output Voltage | 4.5 min, 5.0 max V; VCC=5 V, Ta=25°C |
| Output Pulse Width Low | 400 min, 600 typ, 800 max us; burst wave, Vin=500 uVp-p, Ta=25°C |
| Output Pulse Width High | 400 min, 640 typ, 800 max us; burst wave, Vin=50 mVp-p, Ta=25°C |
| Minimum Pulse Width | 350 min us; Vin=50 mVp-p, Ta=25°C |
| Minimum Interval | 450 min us; Vin=50 mVp-p, Ta=25°C |
| Encoding Pause Time | 45 min us; Vin=50 mVp-p, Ta=25°C |
| Recommended Supply Voltage | 2.7 min, 5.5 max V; recommended usage condition |
| Recommended Input Frequency | 37.9 typ kHz; recommended usage condition |
| Recommended Operating Temperature | 25 typ °C; recommended usage condition |
| Receive Distance Grade L1 | 6 min, 8 max m; ICC=0.5 mA |
| Receive Distance Grade L2 | 10 min, 15 max m; ICC=0.5 mA |
| Receive Distance Grade L3 | 15 min, 20 max m; ICC=0.5 mA |
| Working Voltage Grade V1 | 2.5 min, 5.5 max V; ICC=0.5 mA |
| Working Voltage Grade V2 | 2.7 min, 5.5 max V; ICC=0.5 mA |
| Working Current Grade I1 | 0.3 min, 0.5 max mA; VDD=5 V |
| Working Current Grade I2 | 0.4 min, 0.7 max mA; VDD=5 V |
| Output Logic Compatibility | TTL, CMOS level; active low output |
| Operating Voltage Range | 2.7 V to 5.5 V |
| Package Dimensions | 5.0 x 5.0 x 3.5 mm, pin length 3.1 mm; length x width x height x pin length |
| Outline Dimension Tolerance | ±0.25 mm; unless otherwise specified |
| Packaging Dimension Tolerance | ±0.1 mm; belt and disk dimensions |
| Manual Soldering Power | <30 W soldering iron recommended; hand soldering |
| Hand Soldering Limit | <300°C, <3 s per terminal, one time only; hand soldering |
| Reflow Soldering Cycles | Maximum 2 times; Pb-free reflow soldering guideline |
| Recommended Maximum Soldering Temperature | 240°C / 6 s; product soldering recommendation |
| Cleaning Condition, Alcohol | <=30°C for 3 minutes or <=50°C for 30 seconds; after soldering cleaning |
| Ultrasonic Cleaning Power | <=300 W; cleaning guideline |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year; before opening package |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 hours / 7 days; after opening package |
| Baking Condition | 60±5°C for 24 hours; if moisture absorbent material has faded or storage time exceeded |
| Static Field Voltage Limit | <100 V within 1 foot of LED element; ESD precaution during operation |
| ESD Test Voltage | 4 kV; 100 pF capacitor, 1.5 kΩ resistor, each pin; reliability test quantity 20, passed 20 |
| Vibration Test | 10-50 Hz/1 min, amplitude 1.5 mm, X/Y/Z 30 min; reliability test quantity 20, passed 20 |
| High Temperature Storage Test | 85±2°C for 240 h; reliability test quantity 20, passed 20 |
| Low Temperature Storage Test | -20±2°C for 240 h; reliability test quantity 20, passed 20 |
| High Temperature High Humidity Storage Test | 85°C, 85% RH for 240 h; reliability test quantity 20, passed 20 |
| Temperature Cycling Test | 10 cycles, -20°C for 30 s and +85°C for 30 s; reliability test quantity 20, passed 20 |
| Pin Bending Test | 2.5 N external force, bend each pin 2 times; reliability test quantity 20, passed 20 |
| Datasheet Status | request_only |
Product Overview
The XL-IRM0038C-38B is a XINGLIGHT infrared receiver module categorized under LED components. Its package is an SMD epoxy resin semi-circular spherical body with 5.0 x 5.0 x 3.5 mm dimensions and a 3.1 mm pin length, with outline dimension tolerance of ±0.25 mm unless otherwise specified.
Electrical operation is centered on a 37.9 kHz typical carrier frequency. Recommended supply voltage is 2.7 V to 5.5 V, while the absolute maximum supply voltage is 6.0 V at Ta=25°C. The output is TTL and CMOS compatible with active-low logic, with low-level output voltage up to 250 mV at Isink=2.0 mA and high-level output from 4.5 V to 5.0 V at VCC=5 V.
The receiver distance is specified as 10 m minimum and 15 m typical at 0 degrees under the stated indoor fluorescent-light test setup. At left and right 35 degrees, receive distance is 5 m minimum and 6 m typical at Ta=25°C.
Assembly and handling parameters include wave soldering at 260°C for up to 6 s, manual soldering at 300°C for 3 s, a recommended soldering maximum of 240°C for 6 s, and up to two Pb-free reflow cycles. Storage, cleaning, baking, ESD, vibration, humidity, and temperature-cycle limits are specified in the manufacturer technical datasheet.
Key Features
- Infrared receiver module for 37.9 kHz carrier signals
- 2.7 V to 5.5 V recommended supply range
- TTL and CMOS compatible active-low output
- 0.3 to 0.5 mA working current at 5 V
- 15 m typical receive distance at 0 degrees
- 6 m typical receive distance at left or right 35 degrees
- SMD epoxy resin semi-circular spherical package
- 5.0 x 5.0 x 3.5 mm body dimensions
- 400 to 800 us low output pulse width
- 400 to 800 us high output pulse width
- Maximum two Pb-free reflow soldering cycles
- 4 kV ESD test voltage condition
Typical Applications
- Infrared remote control receivers
- 37.9 kHz IR signal detection
- TTL logic interface receivers
- CMOS logic interface receivers
- Active-low IR output circuits
- SMD infrared receiver assemblies
- Indoor IR receiving modules
Procurement Notes
When requesting a quote for XL-IRM0038C-38B, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What supply voltage does XL-IRM0038C-38B use?
The recommended supply voltage for XL-IRM0038C-38B is 2.7 V minimum to 5.5 V maximum. The absolute maximum supply voltage is 6.0 V at Ta=25°C, according to the manufacturer technical datasheet.
What carrier frequency is specified for this infrared receiver module?
The XL-IRM0038C-38B has a typical carrier frequency of 37.9 kHz at Ta=25°C. The recommended input frequency is also listed as 37.9 kHz typical under the recommended usage condition.
What output logic does XL-IRM0038C-38B provide?
The module provides TTL and CMOS level compatibility with active-low output. At VCC=5 V and Ta=25°C, high-level output voltage is specified from 4.5 V minimum to 5.0 V maximum.
What are the package dimensions for XL-IRM0038C-38B?
The package is an SMD epoxy resin semi-circular spherical type. The listed body dimensions are 5.0 x 5.0 x 3.5 mm, with a 3.1 mm pin length and ±0.25 mm outline dimension tolerance unless otherwise specified.
What soldering limits are given in the datasheet?
Wave soldering is specified at 260°C for no more than 6 s, while manual soldering is listed at 300°C for 3 s. The product soldering recommendation gives a maximum soldering temperature of 240°C for 6 s.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 11, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.



