Specifications
| Type | Description |
|---|---|
| Part Number | XL-ITR1203 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Component Type | Sensor |
| Package / Case | Through-beam photoelectric switch package; outline dimensions shown in mm, tolerance ±0.3 mm unless otherwise specified |
| Device Construction | Infrared emission diode and NPN silicon phototransistor; packaged side by side on converging optical axis in black thermoplastic shell |
| Peak Wavelength | 940 nm; IF=20 mA, Ta=25°C |
| Cut-off Visible Wavelength | λp=940 nm; characteristic listing |
| Input Emitter Power Dissipation | 75 mW; absolute maximum rating, Ta=25°C |
| Continuous Forward Current | 50 mA; input emitter absolute maximum rating, Ta=25°C |
| Peak Forward Current | 200 mA; pulse width ≤100 μs, duty cycle=1%, Ta=25°C |
| Reverse Voltage | 5 V; input emitter absolute maximum rating, Ta=25°C |
| Output Detector Power Dissipation | 75 mW; absolute maximum rating, Ta=25°C |
| Collector-Emitter Voltage | 35 V; output detector absolute maximum rating, Ta=25°C |
| Emitter-Collector Voltage | 5 V; output detector absolute maximum rating, Ta=25°C |
| Collector Current | 20 mA; output detector absolute maximum rating, Ta=25°C |
| Operating Temperature | -25 to +85 °C; absolute maximum rating |
| Storage Temperature | -40 to +85 °C; absolute maximum rating |
| Lead Soldering Temperature | 260 °C; soldering within 5 seconds, at least 2 mm from body |
| Forward Voltage | Typ 1.2 V, Max 1.6 V; IF=20 mA, Ta=25°C |
| Forward Voltage | Typ 1.4 V, Max 1.85 V; IF=100 mA pulse, Ta=25°C |
| Forward Voltage | Typ 2.6 V, Max 4.0 V; IF=1 A pulse, Ta=25°C |
| Reverse Current | Max 10 μA; VR=5 V, Ta=25°C |
| Dark Current | Max 100 nA; Ee=0 mW/cm², VCE=20 V, Ta=25°C |
| Collector-Emitter Saturation Voltage | Max 0.4 V; IC=2 mA, Ee=1 mW/cm², Ta=25°C |
| Rise Time | Typ 15 μs; VCE=5 V, IC=1 mA, RL=1000 Ω, Ta=25°C |
| Fall Time | Typ 15 μs; VCE=5 V, IC=1 mA, RL=1000 Ω, Ta=25°C |
| Collector Current IC(ON) | Min 0.2 mA, Typ 0.5 mA, Max 0.95 mA; IF=20 mA, VCE=5 V, Ta=25°C |
| Voltage Grading Code | R2-4: Min 1.2 V, Max 1.6 V; IF=20 mA |
| Collector Current Grading Code | IC6-18: Min 0.3 mA, Max 0.9 mA; IF=20 mA, VCE=5 V |
| Moisture Sensitivity Level | MSL 2; characteristic listing |
| Compliance | Pb-free, RoHS compliant; characteristic listing |
| Recommended Wave Soldering Peak Temperature | 240±5 °C for 6 s; product recommended maximum soldering temperature |
| Wave Soldering Limit | Do not perform more than once; wave peak welding guidance |
| Soldering Iron Temperature | Less than 300 °C for less than 3 s; per terminal, soldering iron capacity less than 25 W |
| Datasheet Status | request_only |
Product Overview
XL-ITR1203 is a XINGLIGHT infrared through-beam photoelectric switch in the LED category. Its construction combines an infrared emission diode with an NPN silicon phototransistor, packaged side by side on a converging optical axis inside a black thermoplastic shell. The package drawing uses millimeter dimensions with ±0.3 mm tolerance unless otherwise specified.
The emitter is characterized at 940 nm peak wavelength at IF=20 mA and Ta=25°C. Absolute maximum ratings include 75 mW emitter power dissipation, 50 mA continuous forward current, 200 mA peak forward current under ≤100 μs pulse width and 1% duty cycle, and 5 V reverse voltage. The detector side is rated for 75 mW power dissipation, 35 V collector-emitter voltage, 5 V emitter-collector voltage, and 20 mA collector current.
Electrical behavior includes forward voltage options from low-current to pulse-drive conditions, max 10 μA reverse current, max 100 nA dark current, max 0.4 V collector-emitter saturation voltage, and typical 15 μs rise and fall times. Assembly guidance includes MSL 2, Pb-free/RoHS compliance, a 240±5 °C wave-soldering peak for 6 seconds, one wave-soldering pass maximum, and soldering iron limits below 300 °C for less than 3 seconds per terminal.
Key Features
- Infrared emitter and NPN phototransistor construction
- Side-by-side devices on converging optical axis
- Black thermoplastic through-beam switch package
- 940 nm peak wavelength at 20 mA
- 50 mA continuous forward current rating
- 35 V collector-emitter detector voltage rating
- Typical 15 μs rise and fall times
- Collector current IC(ON) up to 0.95 mA
- Operating temperature range from -25 to +85 °C
- MSL 2, Pb-free and RoHS compliant
Typical Applications
- Through-beam object sensing
- Beam interruption detection
- Optical presence detection
- Infrared slot-style sensing assemblies
- Emitter-detector switching circuits
- Object counting sensor modules
Procurement Notes
When requesting a quote for XL-ITR1203, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What type of device is the XL-ITR1203?
XL-ITR1203 is an infrared through-beam photoelectric switch from XINGLIGHT. The device uses an infrared emission diode and an NPN silicon phototransistor packaged side by side on a converging optical axis in a black thermoplastic shell.
What wavelength does the XL-ITR1203 emitter use?
The extracted datasheet facts list a 940 nm peak wavelength at IF=20 mA and Ta=25°C. The characteristic listing also identifies λp=940 nm for the cut-off visible wavelength entry.
What soldering limits apply to XL-ITR1203?
The device has a lead soldering temperature rating of 260°C within 5 seconds at least 2 mm from the body. Recommended wave soldering is 240±5°C for 6 seconds, with no more than one wave-soldering pass.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 7, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.



