XL-J1608UBC-06 Blue SMD LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-J1608UBC-06 Blue SMD LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-J1608UBC-06
Manufacturer
XINGLIGHT
Package
1608 SMD, 1.6 x 0.8 x 0.6 mm
Category
LED
Product Type
Blue SMD LED

Quick Sourcing Note

XL-J1608UBC-06 from XINGLIGHT is a blue SMD LED in the LED category, supplied in a 1608 SMD package measuring 1.6 x 0.8 x 0.6 mm. The device uses a water clear colloid/lens and is specified for blue emission with 455-475 nm dominant wavelength, 460 nm typical peak wavelength, and 120-240 mcd luminous intensity at IF=20 mA and Ta=25°C. Electrical limits include 25 mA continuous forward current, 75 mW power dissipation, 5 V maximum reverse voltage, and 2000 V ESD withstand voltage. Typical applications include compact indicator lighting, status indication, keypad illumination, and blue signal points on surface-mount assemblies.

Specifications

TypeDescription
Part NumberXL-J1608UBC-06
ManufacturerXINGLIGHT
Product TypeBlue SMD LED
CategoryLED
Package / Case1608 SMD, 1.6 x 0.8 x 0.6 mm
Outline Dimensions1.6 x 0.8 x 0.6 mm; L/W/H
Luminous ColorBlue; water clear colloid
Colloid / LensWater clear; Blue LED
Moisture Sensitivity LevelMSL 3; moisture sensitivity level stated as 3 levels
RoHS ComplianceComplies with RoHS Directive; environmental protection products
Maximum Power Dissipation75 mW; Ta=25°C
Maximum Continuous Forward Current25 mA; Ta=25°C
Peak Forward Current80 mA; Ta=25°C, pulse width <=0.1 ms, duty <=1/10
Maximum Reverse Voltage5 V; Ta=25°C
ESD Withstand Voltage2000 V; Ta=25°C
Operating Temperature Range-40 to +85 °C; Ta=25°C absolute maximum ratings table
Storage Temperature Range-40 to +85 °C; Ta=25°C absolute maximum ratings table
Lead Soldering Temperature / Time260°C <=6 s; Ta=25°C absolute maximum ratings table
Luminous Intensity120-240 mcd; IF=20 mA, Ta=25°C
Dominant Wavelength455-475 nm; IF=20 mA, Ta=25°C
Peak Wavelength460 nm typ; IF=20 mA, Ta=25°C
Forward Voltage2.7-3.4 V; IF=20 mA, Ta=25°C
Half Wave Width20 nm typ; IF=20 mA, Ta=25°C
Viewing Angle120° typ; IF=20 mA, 2θ1/2, Ta=25°C
Reverse Current<=1 µA; VR=5 V, Ta=25°C
Brightness Bin D3120-150 mcd; IF=20 mA, brightness error ±10%
Brightness Bin D4150-180 mcd; IF=20 mA, brightness error ±10%
Brightness Bin D5180-210 mcd; IF=20 mA, brightness error ±10%
Brightness Bin D6210-240 mcd; IF=20 mA, brightness error ±10%
Forward Voltage Bin M18-92.7-2.8 V; IF=20 mA, voltage error ±0.1 V
Forward Voltage Bin M19-12.8-2.9 V; IF=20 mA, voltage error ±0.1 V
Forward Voltage Bin M19-22.9-3.0 V; IF=20 mA, voltage error ±0.1 V
Forward Voltage Bin M19-33.0-3.1 V; IF=20 mA, voltage error ±0.1 V
Forward Voltage Bin M19-43.1-3.2 V; IF=20 mA, voltage error ±0.1 V
Forward Voltage Bin M19-53.2-3.3 V; IF=20 mA, voltage error ±0.1 V
Forward Voltage Bin M19-63.3-3.4 V; IF=20 mA, voltage error ±0.1 V
Wavelength Bin HB03455-460 nm; IF=20 mA, wavelength error ±1 nm
Wavelength Bin HB04460-465 nm; IF=20 mA, wavelength error ±1 nm
Wavelength Bin HB05465-470 nm; IF=20 mA, wavelength error ±1 nm
Wavelength Bin HB06470-475 nm; IF=20 mA, wavelength error ±1 nm
Test Environment Temperature25 ±5 °C; unless otherwise indicated
Outline Dimension Tolerance±0.25 mm; unless otherwise noted
Tape/Reel Dimension Tolerance±0.1 mm; belt and disk dimensions
Hand Soldering Iron Power<30 W; hand soldering recommended only for repair/rework
Hand Soldering Temperature<300 °C; each terminal once only
Hand Soldering Time<3 s; each terminal once only
Reflow Soldering CyclesMaximum 2 times; reflow soldering
Recommended Maximum Soldering Temperature240 ±5 °C for 6 s; product recommendation
Cleaning With AlcoholUnder 30°C for 3 min or under 50°C for 30 s; after soldering
Ultrasonic Cleaning Power<=300 W; pretest recommended before cleaning
Unopened Storage Conditions<=30°C, <=60% RH, use within 1 year; before opening package
Opened Storage Conditions<=30°C, <=40% RH, solder within 168 hours / 7 days; after opening package
Recommended Workshop Conditions<=30°C, <=60% RH; operation after opening package
Baking Condition60 ±5 °C for 24 hours; if desiccant faded or storage time exceeded
Datasheet Statusrequest_only

Product Overview

XL-J1608UBC-06 is a XINGLIGHT blue SMD LED built in a compact 1608 surface-mount outline. The package dimensions are 1.6 x 0.8 x 0.6 mm, with water clear colloid/lens construction and outline dimension tolerance of ±0.25 mm unless otherwise noted.

At IF=20 mA and Ta=25°C, the LED is specified for 120-240 mcd luminous intensity, 455-475 nm dominant wavelength, 460 nm typical peak wavelength, 2.7-3.4 V forward voltage, 20 nm typical half wave width, and 120° typical viewing angle. Reverse current is specified as <=1 µA at VR=5 V and Ta=25°C.

Assembly and handling data include MSL 3, RoHS compliance, reflow soldering up to two cycles, a recommended maximum soldering condition of 240 ±5°C for 6 s, and opened-package storage at <=30°C and <=40% RH with soldering within 168 hours / 7 days. These characteristics suit compact blue indication, panel status points, keypad backlighting, and surface-mount signal lighting.

Key Features

  • Blue SMD LED with water clear colloid
  • 1608 package, 1.6 x 0.8 x 0.6 mm
  • 120-240 mcd luminous intensity at 20 mA
  • 455-475 nm dominant wavelength at 20 mA
  • 2.7-3.4 V forward voltage at 20 mA
  • 120° typical viewing angle at 20 mA
  • 25 mA maximum continuous forward current
  • 80 mA peak forward current under pulse limits
  • MSL 3 moisture sensitivity level
  • RoHS Directive compliant per datasheet

Typical Applications

  • Compact blue status indicators
  • Panel signal lighting
  • Keypad backlighting points
  • Portable device indicators
  • Surface-mount blue indication
  • Control board status LEDs
  • Small equipment indicator lights

Procurement Notes

When requesting a quote for XL-J1608UBC-06, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package is used for XL-J1608UBC-06?

XL-J1608UBC-06 is specified as a 1608 SMD LED with outline dimensions of 1.6 x 0.8 x 0.6 mm. The datasheet also lists an outline dimension tolerance of ±0.25 mm unless otherwise noted.

What are the optical ratings at 20 mA?

At IF=20 mA and Ta=25°C, the datasheet specifies 120-240 mcd luminous intensity, 455-475 nm dominant wavelength, 460 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle.

What forward voltage range is specified?

The forward voltage range is 2.7-3.4 V at IF=20 mA and Ta=25°C. Datasheet voltage bins span 2.7-2.8 V through 3.3-3.4 V, with voltage error stated as ±0.1 V.

What storage rules apply after opening the package?

After opening, the datasheet specifies storage at <=30°C and <=40% RH, with soldering within 168 hours / 7 days. Recommended workshop conditions are <=30°C and <=60% RH.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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