Specifications
| Type | Description |
|---|---|
| Part Number | XL-J1608UGC-06 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 1608 SMD, 1.6 x 0.8 x 0.6 mm |
| Outline Dimensions | 1.6 x 0.8 x 0.6 mm, L/W/H |
| Luminous Color | green, transparent/water-clear colloid |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | complies with RoHS directive, environmental protection process |
| Maximum Power Dissipation | 75 mW at Ta=25°C |
| Maximum Continuous Forward Current | 25 mA at Ta=25°C |
| Peak Forward Current | 80 mA at Ta=25°C, pulse width <=0.1 ms, duty <=1/10 |
| Maximum Reverse Voltage | 5 V at Ta=25°C |
| ESD Withstand Voltage | 2000 V at Ta=25°C |
| Operating Temperature Range | -40 to +85°C |
| Storage Temperature Range | -40 to +85°C |
| Lead Soldering Temperature/Time | 260°C maximum, <=6 s |
| Luminous Intensity | 600 min, 1000 max mcd at IF=20 mA, Ta=25°C |
| Dominant Wavelength | 515 min, 530 max nm at IF=20 mA, Ta=25°C |
| Peak Wavelength | 525 typ nm at IF=20 mA, Ta=25°C |
| Forward Voltage | 2.5 min, 3.0 max V at IF=20 mA, Ta=25°C |
| Spectral Half Width | 28 typ nm at IF=20 mA, Ta=25°C |
| Viewing Angle | 120 typ deg at IF=20 mA, Ta=25°C, 2θ1/2 |
| Reverse Current | <=1 µA at VR=5 V, Ta=25°C |
| Brightness Bin E6 | 600 to 700 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin E7 | 700 to 800 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin E8 | 800 to 900 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin E9 | 900 to 1000 mcd at IF=20 mA, brightness error ±10% |
| Voltage Bin M18-7 | 2.5 to 2.6 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-8 | 2.6 to 2.7 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-9 | 2.7 to 2.8 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-1 | 2.8 to 2.9 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-2 | 2.9 to 3.0 V at IF=20 mA, voltage error ±0.1 V |
| Wavelength Bin HG02 | 515 to 520 nm at IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HG03 | 520 to 525 nm at IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HG04 | 525 to 530 nm at IF=20 mA, wavelength error ±1 nm |
| Working Life Test | 1000 hours, continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours at Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours at Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours at Ta=-40±5°C |
| Thermal Cycle Test | 100 cycles, 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Thermal Shock Test | 100 cycles, IR reflow in-board 2 times; 100±5°C for 20 min to -40±5°C for 20 min |
| Anti-Tin Test | 10±1 s, 2 times at soldering temperature 260±5°C |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; peak 10-15 s, above 183°C for 60-150 s, heat-up max 3°C/s, cooling max 6°C/s |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C; peak 5-10 s, above 217°C for 60-120 s, heat-up max 3°C/s, cooling max 6°C/s |
| Solderability Test | tin loading rate >=95% pad area; T.sol=235±5°C, immersion speed 25±2.5 mm/s, immersion time 2±0.5 s |
| Outline Dimension Tolerance | ±0.25 mm unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm for belt and disk dimensions |
| Hand Soldering Iron Power | <30 W, recommended only for repair/rework |
| Hand Soldering Temperature | <300°C, less than 3 s per terminal, one time only |
| Maximum Reflow Count | 2 times for reflow soldering |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s, product recommendation |
| Cleaning With Alcohol | 3 min at <=30°C or 30 s at <=50°C after soldering |
| Ultrasonic Cleaning Power | <=300 W, pretest required to confirm no LED damage |
| Unopened Storage Condition | <=30°C, <60% RH, use within 1 year in moisture-proof anti-static package with desiccant |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours after opening package |
| Recommended Workshop Condition | <=30°C, <60% RH for operation after opening |
| Baking Condition | 60±5°C for 24 hours if desiccant/package fails or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-J1608UGC-06 is a XINGLIGHT green SMD chip LED supplied in a 1608 surface-mount outline. The package dimensions are 1.6 x 0.8 x 0.6 mm with an outline tolerance of ±0.25 mm unless otherwise noted, and the optical construction is described as green emission with a transparent/water-clear colloid.
At IF=20 mA and Ta=25°C, the LED is specified for 600 to 1000 mcd luminous intensity, 515 to 530 nm dominant wavelength, 525 nm typical peak wavelength, 2.5 to 3.0 V forward voltage, 28 nm typical spectral half width, and 120° typical viewing angle. Absolute maximum ratings include 75 mW power dissipation, 25 mA continuous forward current, 80 mA peak forward current for pulse width <=0.1 ms and duty <=1/10, and 5 V reverse voltage.
Assembly data includes MSL 3 handling, a maximum of two reflow soldering cycles, lead-free reflow peak temperature of 255°C +0/-5°C, and recommended storage after opening at <=30°C and <40% RH with soldering within 168 hours. Applications include compact green indication, visual status outputs, and board-mounted signal lighting.
Key Features
- 1608 SMD package, 1.6 x 0.8 x 0.6 mm
- Green emission with transparent/water-clear colloid
- 600 to 1000 mcd luminous intensity at 20 mA
- 515 to 530 nm dominant wavelength range
- 2.5 to 3.0 V forward voltage at 20 mA
- 120° typical viewing angle at 20 mA
- 25 mA maximum continuous forward current
- 80 mA peak forward current under pulsed conditions
- MSL 3 moisture sensitivity classification
- Lead-free reflow peak temperature 255°C +0/-5°C
- Operating temperature range from -40 to +85°C
- RoHS directive compliance stated in datasheet
Typical Applications
- Green status indicators
- Compact PCB signal lighting
- Surface-mount visual indication
- Board-level green annunciators
- 20 mA LED indicator circuits
- Wide-angle indication windows
- Reflow-assembled LED boards
Procurement Notes
When requesting a quote for XL-J1608UGC-06, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package size does XL-J1608UGC-06 use?
XL-J1608UGC-06 uses a 1608 SMD package with outline dimensions of 1.6 x 0.8 x 0.6 mm. The datasheet states an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 600 to 1000 mcd luminous intensity, 515 to 530 nm dominant wavelength, 525 nm typical peak wavelength, 28 nm typical spectral half width, and 120° typical viewing angle.
What forward voltage range is specified for this LED?
The forward voltage is specified as 2.5 V minimum to 3.0 V maximum at IF=20 mA and Ta=25°C. The datasheet also lists voltage bins from 2.5 to 3.0 V with ±0.1 V voltage error.
What storage controls apply after opening the package?
After opening, the storage condition is <=30°C and <40% RH, and the parts should be soldered within 168 hours. The recommended workshop condition after opening is <=30°C and <60% RH.
How many reflow soldering cycles are allowed?
The maximum reflow count is two times. For lead-free reflow, the peak temperature is 255°C +0/-5°C with 5 to 10 seconds at peak and 60 to 120 seconds above 217°C.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.