XL-J1608UOC-06 Orange SMD Chip LED

Specifications

Product Overview

XL-J1608UOC-06 is a XINGLIGHT orange SMD chip LED classified in the LED category. Its package is a 1608 SMD LED outline with 1.6 x 0.8 x 0.6 mm dimensions, making the part suitable for compact board layouts where orange visual indication is required.

At IF=20 mA and Ta=25°C, the LED is specified for 80 to 210 mcd luminous intensity, 600 to 608 nm dominant wavelength, 605 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle. Forward voltage is specified from 1.9 to 2.3 V, while reverse current is limited to ≤1 µA at VR=5 V.

Assembly and handling limits include MSL 3 moisture sensitivity, a maximum of two reflow soldering cycles, recommended welding at 240 ±15°C for 6 s, and lead soldering rated at 260°C for ≤6 s. Storage guidance specifies unopened storage at ≤30°C and ≤60% RH for use within 1 year, and opened storage at ≤30°C and ≤40% RH with soldering within 168 hours.

Key Features

• 1608 SMD LED package measures 1.6 x 0.8 x 0.6 mm
• Orange luminous color with transparent/water colloid construction
• 80 to 210 mcd luminous intensity at 20 mA
• 600 to 608 nm dominant wavelength at 20 mA
• 605 nm typical peak wavelength at 20 mA
• 1.9 to 2.3 V forward voltage range
• 120° typical viewing angle for board indicators
• 30 mA maximum continuous forward current rating
• 80 mA peak forward current under specified pulse conditions
• MSL 3 moisture sensitivity handling classification
• Maximum two reflow soldering cycles specified
• Opened package requires soldering within 168 hours

Typical Applications

• Orange board status indicators
• Compact SMD visual indication
• Panel indicator light points
• Space-constrained signal lighting
• Color-coded equipment indicators
• Low-profile PCB illumination

Procurement Notes

When requesting a quote for XL-J1608UOC-06, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.