Specifications
| Type | Description |
|---|---|
| Part Number | XL-J1608UWC-06 |
| Manufacturer | XINGLIGHT |
| Product Type | White SMD LED |
| Category | LED |
| Outline Dimensions | 1.6 x 0.8 x 0.6 mm; L/W/H |
| Luminous Color | White light; Yellow mist colloid |
| Colloid / Lens Appearance | Yellow mist; White LED package |
| RoHS Compliance | Complied with RoHS Directive; Environmental protection process |
| Moisture Sensitivity Level | MSL 3; Moisture sensitivity level |
| Packaging Standard | EIA standard packaging; Standard packaging |
| Maximum Power Dissipation | 75 mW; Ta=25°C |
| Maximum Continuous Forward Current | 25 mA; Ta=25°C |
| Peak Forward Current | 80 mA; Pulse width ≤0.1 ms, duty ≤1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD / Antistatic Ability | 2000 V; Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C rating table |
| Lead Soldering Temperature / Time | 260°C for ≤6 s; Ta=25°C rating table |
| Luminous Intensity | 500 to 1000 mcd; IF=20 mA, Ta=25°C |
| Color Temperature | 10000 K typ; IF=20 mA, Ta=25°C |
| Chromaticity Coordinate X | 0.284 typ; IF=20 mA, Ta=25°C |
| Chromaticity Coordinate Y | 0.289 typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 2.6 to 3.4 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Reverse Current | 1 µA max; VR=5 V, Ta=25°C |
| Brightness Bin E4 | 500 to 550 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin E5 | 550 to 600 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin E6 | 600 to 700 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin E7 | 700 to 800 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin E8 | 800 to 900 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin E9 | 900 to 1000 mcd; IF=20 mA, brightness error ±10% |
| Voltage Bin M18-8 | 2.6 to 2.7 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-9 | 2.7 to 2.8 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-1 | 2.8 to 2.9 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-2 | 2.9 to 3.0 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-3 | 3.0 to 3.1 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-4 | 3.1 to 3.2 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-5 | 3.2 to 3.3 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M19-6 | 3.3 to 3.4 V; IF=20 mA, voltage error ±0.1 V |
| Color Zone Code CWP2 | CW4-23; Main color zone code |
| Color Zone Code CWP3 | CW2-21; Main color zone code |
| Color Zone Code CWP4 | CW1-20; Main color zone code |
| Chromaticity Coordinate Tolerance | ±0.01; XY coordinate error |
| Default Test Ambient Temperature | 25 ±5 °C; Unless otherwise indicated |
| Working Life Test | 1000 hours; Continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature and High Humidity Storage Test | 240 hours ±2 hours; IR-Reflow in-board 2 times, Ta=85±5°C, RH=90-95% |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR-Reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each |
| Anti-tin Test | 260±5°C, 10±1 s, 2 times; Soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; Keep at peak for 10-15 s; cooling rate max 6°C/s |
| Lead-free Reflow Peak Temperature | 255°C +0/-5°C; Keep at peak for 5-10 s; cooling rate max 6°C/s |
| Weldability Test | 235±5°C, 2±0.5 s immersion; Immersion speed 25±2.5 mm/s; tin loading rate ≥95% pad area |
| Outline Dimension Tolerance | ±0.25 mm; Unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm; Belt and disk dimensions |
| Hand Soldering Iron Power | Less than 30 W; Hand soldering recommended only for repair/rework |
| Hand Soldering Temperature | Below 300°C; Each terminal less than 3 s, one time only |
| Maximum Reflow Cycles | 2 times max; Reflow soldering |
| Recommended Maximum Soldering Temperature | 240±5°C for 6 s; Product recommended maximum welding temperature |
| Cleaning Condition | Alcohol cleaning below 30°C for 3 min or below 50°C for 30 s; After soldering |
| Ultrasonic Cleaning Power | ≤300 W generally; Pretest required before cleaning |
| Unopened Storage Condition | ≤30°C, ≤60% RH, within 1 year; Before opening moisture-proof anti-static package |
| Opened Storage Condition | ≤30°C, ≤40% RH, solder within 168 hours / 7 days; After opening package |
| Recommended Workshop Condition | ≤30°C, ≤60% RH; Operation after opening package |
| Baking Condition | 60±5°C for 24 hours; If moisture absorbent failed or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
The XL-J1608UWC-06 is a XINGLIGHT white SMD LED supplied in a 1608 package with 1.6 x 0.8 x 0.6 mm outline dimensions. The package is described as a white LED with yellow mist colloid, producing white light. Its compact surface-mount format suits board-level visual indication, compact display backlighting, keypad illumination, and small status-light positions where the 1608 footprint is required.
At IF=20 mA and Ta=25°C, the LED is specified for 500 to 1000 mcd luminous intensity, 10000 K typical color temperature, chromaticity coordinates of X=0.284 typical and Y=0.289 typical, and 120° typical viewing angle. Forward voltage is specified from 2.6 to 3.4 V, with voltage bin ranges from M18-8 through M19-6.
Assembly and handling data include MSL 3 moisture sensitivity, EIA standard packaging, up to 2 reflow cycles, and a recommended maximum soldering temperature of 240±5°C for 6 s. The datasheet also lists RoHS compliance, -40 to +85°C operating and storage temperature ranges, and defined storage, baking, cleaning, and soldering conditions.
Key Features
- 1608 SMD package, 1.6 x 0.8 x 0.6 mm
- White light output with yellow mist colloid
- 500 to 1000 mcd at IF=20 mA
- 2.6 to 3.4 V forward voltage range
- 120° typical viewing angle at IF=20 mA
- 25 mA maximum continuous forward current
- 75 mW maximum power dissipation at Ta=25°C
- -40 to +85°C operating temperature range
- MSL 3 moisture sensitivity level
- RoHS directive complied
Typical Applications
- Compact status indicators
- Display backlighting positions
- Keypad and button illumination
- Portable device indicators
- Panel indicator LEDs
- Board-level visual indication
- White light marking points
Procurement Notes
When requesting a quote for XL-J1608UWC-06, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package does XL-J1608UWC-06 use?
XL-J1608UWC-06 uses a 1608 SMD package with outline dimensions of 1.6 x 0.8 x 0.6 mm. The datasheet also lists an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical specifications?
At IF=20 mA and Ta=25°C, the LED is specified for 500 to 1000 mcd luminous intensity, 10000 K typical color temperature, X=0.284 typical, Y=0.289 typical, and 120° typical viewing angle.
What forward voltage range is specified?
The forward voltage range is 2.6 to 3.4 V at IF=20 mA and Ta=25°C. The datasheet also defines voltage bins from M18-8 at 2.6 to 2.7 V through M19-6 at 3.3 to 3.4 V.
What soldering limits apply to this LED?
The datasheet lists 2 maximum reflow cycles and a recommended maximum soldering temperature of 240±5°C for 6 s. Hand soldering is recommended only for repair or rework, below 300°C and less than 3 s per terminal.
How should opened packages be stored?
After opening the package, storage is specified at ≤30°C and ≤40% RH, with soldering within 168 hours or 7 days. If storage time is exceeded or moisture absorbent fails, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 5, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.