Specifications
| Type | Description |
|---|---|
| Part Number | XL-JY2012SURC-11 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD LED, 2.0 x 1.2 x 1.1 mm |
| Outline Dimensions | 2.0 x 1.2 x 1.1 mm; L/W/H |
| Luminous Color | Red; transparent/water colloid |
| Colloid / Lens Type | Water colloid / transparent colloid; red LED |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Complies with RoHS directive |
| Maximum Power Dissipation | 60 mW; Ta=25°C |
| Maximum Continuous Forward Current | 30 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Rating | 2000 V; antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85°C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85°C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature / Time | 260°C <=6 s; absolute maximum rating |
| Luminous Intensity | 120 min, 240 max mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 615 min, 630 max nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 625 typ nm; IF=20 mA, Ta=25°C |
| Forward Voltage | 1.9 min, 2.4 max V; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 20 typ nm; IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; VR=5 V, Ta=25°C |
| Brightness Bin D3 | 120 to 150 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D4 | 150 to 180 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D5 | 180 to 210 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D6 | 210 to 240 mcd; IF=20 mA, brightness error ±10% |
| Voltage Bin M18-1 | 1.9 to 2.0 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-2 | 2.0 to 2.1 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-3 | 2.1 to 2.2 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-4 | 2.2 to 2.3 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-5 | 2.3 to 2.4 V; IF=20 mA, voltage error ±0.1 V |
| Wavelength Bin HR01 | 615 to 620 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HR02 | 620 to 625 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HR03 | 625 to 630 nm; IF=20 mA, wavelength error ±1 nm |
| Outline Dimension Tolerance | ±0.20 mm; unless otherwise noted |
| Tape / Reel Dimension Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering Iron Power | <30 W; recommended for repair/rework only |
| Hand Soldering Temperature | <300°C; each terminal once only, duration <3 s |
| Recommended Maximum Reflow Temperature | 240±5°C for 6 s |
| Maximum Reflow Cycles | 2 times; reflow soldering |
| Unopened Storage Condition | <=30°C, <60% RH, use within 1 year |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours / 7 days |
| Baking Condition | 60±5°C for 24 hours if moisture absorbent has faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-JY2012SURC-11 is a XINGLIGHT red SMD chip LED built in a 2.0 x 1.2 x 1.1 mm L/W/H outline. The package uses transparent water colloid, with an outline dimension tolerance of ±0.20 mm unless otherwise noted.
Electrical and optical ratings are specified at Ta=25°C. Maximum power dissipation is 60 mW, continuous forward current is 30 mA, peak forward current is 80 mA under pulse width <=0.1 ms and duty <=1/10, and maximum reverse voltage is 5 V. At IF=20 mA, luminous intensity is 120 to 240 mcd, dominant wavelength is 615 to 630 nm, forward voltage is 1.9 to 2.4 V, and viewing angle is 120° typical.
Assembly data includes 260°C <=6 s lead soldering, recommended maximum reflow of 240±5°C for 6 s, and up to two reflow cycles. Storage guidance covers MSL 3 handling, 168-hour opened-package soldering life, and 60±5°C baking for 24 hours when required.
Key Features
- 2.0 x 1.2 x 1.1 mm SMD LED package
- Red emission with transparent water colloid lens
- 120 to 240 mcd luminous intensity at 20 mA
- 615 to 630 nm dominant wavelength range
- 1.9 to 2.4 V forward voltage at 20 mA
- 120° typical viewing angle at 20 mA
- 30 mA maximum continuous forward current
- 80 mA peak forward current under specified pulse conditions
- MSL 3 moisture sensitivity level
- RoHS directive compliant environmental product
- 240±5°C for 6 s recommended maximum reflow
- Opened package soldering window of 168 hours
Typical Applications
- Compact red status indicators
- Panel indicator lighting
- Portable device indicators
- Backlight or signal points
- Reflow-assembled LED boards
- Binned red LED assemblies
- Moisture-controlled SMT production
Procurement Notes
When requesting a quote for XL-JY2012SURC-11, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package size does XL-JY2012SURC-11 use?
XL-JY2012SURC-11 uses an SMD LED package with 2.0 x 1.2 x 1.1 mm outline dimensions. The datasheet also states an outline dimension tolerance of ±0.20 mm unless otherwise noted.
What optical output is specified at 20 mA?
At IF=20 mA and Ta=25°C, the LED has 120 to 240 mcd luminous intensity, 615 to 630 nm dominant wavelength, 625 nm typical peak wavelength, 20 nm typical half wave width, and a 120° typical viewing angle.
What are the main electrical limits for this LED?
The absolute maximum ratings list 60 mW power dissipation, 30 mA continuous forward current, 80 mA peak forward current under specified pulse conditions, 5 V maximum reverse voltage, and 2000 V ESD rating at Ta=25°C.
How should opened packages be stored before soldering?
After opening, the storage condition is <=30°C and <40% RH, with soldering within 168 hours or 7 days. If the moisture absorbent has faded or storage time is exceeded, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 3, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.