Specifications
| Type | Description |
|---|---|
| Part Number | XL-JY2012UBC-11 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 2012 SMD LED, 2.0 x 1.2 x 1.1 mm |
| Outline Dimensions | 2.0 x 1.2 x 1.1 mm; L/W/H |
| Luminous Color | Blue; transparent/water colloid lens |
| Encapsulation / Colloid | Transparent / water colloid; blue LED body description |
| RoHS Compliance | Complies with RoHS Directive; environmental protection process |
| Moisture Sensitivity Level | MSL 3; moisture sensitivity level stated as 3 levels |
| SMT Compatibility | Suitable for SMT automatic production; application/process suitability |
| Reflow Soldering Compatibility | Suitable for reflow soldering process; application/process suitability |
| Maximum Power Dissipation | 60 mW; Ta=25°C |
| Maximum Continuous Forward Current | 30 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD / Antistatic Ability | 2000 V; Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature / Time | 260°C <=6 s; absolute maximum rating |
| Luminous Intensity | 150 to 300 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 455 to 475 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 465 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 2.6 to 3.2 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 25 nm typ; IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; VR=5 V, Ta=25°C |
| Brightness Bin D4 | 150 to 180 mcd; IF=20 mA |
| Brightness Bin D5 | 180 to 210 mcd; IF=20 mA |
| Brightness Bin D6 | 210 to 240 mcd; IF=20 mA |
| Brightness Bin D7 | 240 to 270 mcd; IF=20 mA |
| Brightness Bin D8 | 270 to 300 mcd; IF=20 mA |
| Brightness Tolerance | ±10%; brightness grading |
| Voltage Bin M18-8 | 2.6 to 2.7 V; IF=20 mA |
| Voltage Bin M18-9 | 2.7 to 2.8 V; IF=20 mA |
| Voltage Bin M19-1 | 2.8 to 2.9 V; IF=20 mA |
| Voltage Bin M19-2 | 2.9 to 3.0 V; IF=20 mA |
| Voltage Bin M19-3 | 3.0 to 3.1 V; IF=20 mA |
| Voltage Bin M19-4 | 3.1 to 3.2 V; IF=20 mA |
| Voltage Tolerance | ±0.1 V; voltage grading |
| Wavelength Bin HB03 | 455 to 460 nm; IF=20 mA |
| Wavelength Bin HB04 | 460 to 465 nm; IF=20 mA |
| Wavelength Bin HB05 | 465 to 470 nm; IF=20 mA |
| Wavelength Bin HB06 | 470 to 475 nm; IF=20 mA |
| Wavelength Tolerance | ±1 nm; wavelength grading |
| Test Environment Temperature | 25±5°C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours; Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each |
| Anti-tin Test | 260±5°C, 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; keep at peak for 10-15 s |
| Lead-free Process Reflow Peak Temperature | 255°C +0/-5°C; keep at peak for 5-10 s |
| Weldability Test | Tin loading rate >=95% pad area; T.sol=235±5°C, immersion speed 25±2.5 mm/s, immersion time 2±0.5 s |
| General Dimension Tolerance | ±0.20 mm; unless otherwise noted |
| Tape / Reel Dimension Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering Iron Power | <30 W; hand soldering recommended only for repair/rework |
| Hand Soldering Temperature | <300°C; each terminal less than 3 s, one time only |
| Maximum Reflow Cycles | 2 times; reflow soldering |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; product recommended maximum welding temperature |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or 50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest required to confirm no LED damage |
| Unopened Storage Life | 1 year; moisture-proof anti-electrostatic package with desiccant, <=30°C and <=60%RH before opening |
| Opened Storage Floor Life | 168 hours / 7 days; store <=30°C and <=40%RH after opening |
| Recommended Workshop Condition | <=30°C and <=60%RH; after opening package |
| Baking Condition | 60±5°C for 24 hours; if moisture absorbent has faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-JY2012UBC-11 is a XINGLIGHT blue SMD chip LED with a 2012 surface-mount outline. The package dimensions are 2.0 x 1.2 x 1.1 mm, with a transparent water colloid encapsulation used for the blue emitting structure.
Electrical and optical ratings are specified at Ta=25°C unless otherwise noted. At IF=20 mA, luminous intensity is 150 to 300 mcd, dominant wavelength is 455 to 475 nm, peak wavelength is 465 nm typical, forward voltage is 2.6 to 3.2 V, half wave width is 25 nm typical, and viewing angle is 120° typical.
The device is suitable for SMT automatic production and reflow soldering, with up to two reflow cycles specified. Handling and storage controls include MSL 3 classification, 168 hours floor life after opening at <=30°C and <=40%RH, and baking at 60±5°C for 24 hours if required.
Key Features
- 2012 SMD LED package, 2.0 x 1.2 x 1.1 mm
- Blue emission with transparent water colloid encapsulation
- 150 to 300 mcd luminous intensity at 20 mA
- 455 to 475 nm dominant wavelength range
- 2.6 to 3.2 V forward voltage at 20 mA
- 120° typical viewing angle at 20 mA
- 30 mA maximum continuous forward current rating
- MSL 3 moisture sensitivity classification
- Suitable for SMT automatic production
- Supports reflow soldering process
Typical Applications
- SMT automatic production
- Reflow soldered PCB assemblies
- Blue LED indicator circuits
- Compact surface-mount lighting points
- Moisture-controlled LED assembly
- Repair and rework hand soldering
Procurement Notes
When requesting a quote for XL-JY2012UBC-11, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package size does XL-JY2012UBC-11 use?
XL-JY2012UBC-11 uses a 2012 SMD LED package with outline dimensions of 2.0 x 1.2 x 1.1 mm. The datasheet also specifies a general dimension tolerance of ±0.20 mm unless otherwise noted.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 150 to 300 mcd luminous intensity, 455 to 475 nm dominant wavelength, 465 nm typical peak wavelength, 25 nm typical half wave width, and 120° typical viewing angle.
What storage controls apply after opening the package?
After opening, the floor life is 168 hours or 7 days when stored at <=30°C and <=40%RH. The recommended workshop condition after opening is <=30°C and <=60%RH.
How many reflow soldering cycles are allowed?
The datasheet specifies a maximum of two reflow soldering cycles. Lead process peak temperature is 235°C +5/-0°C for 10 to 15 seconds, while lead-free process peak temperature is 255°C +0/-5°C for 5 to 10 seconds.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 6, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.