Specifications
| Type | Description |
|---|---|
| Part Number | XL-JY2012UGC-11 |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD LED, 2.0 x 1.2 x 1.1 mm |
| Outline Dimensions | 2.0 x 1.2 x 1.1 mm; L/W/H |
| Luminous Color | green; transparent/water colloid |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Complies with RoHS directive |
| Maximum Power Dissipation | 60 mW; Ta=25°C |
| Maximum Continuous Forward Current | 30 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Rating | 2000 V; Ta=25°C |
| Operating Temperature Range | -40 to +85 °C |
| Storage Temperature Range | -40 to +85 °C |
| Lead Soldering Temperature/Time | 260°C for <=6 s |
| Luminous Intensity | 600-1000 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 515-530 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 525 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 2.6-3.2 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 30 nm typ; IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; VR=5 V, Ta=25°C |
| Brightness Grade E5 | 550-600 mcd; IF=20 mA |
| Brightness Grade E6 | 600-700 mcd; IF=20 mA |
| Brightness Grade E7 | 700-800 mcd; IF=20 mA |
| Brightness Grade E8 | 800-900 mcd; IF=20 mA |
| Brightness Grade E9 | 900-1000 mcd; IF=20 mA |
| Brightness Tolerance | ±10% |
| Voltage Grade M18-8 | 2.6-2.7 V; IF=20 mA |
| Voltage Grade M18-9 | 2.7-2.8 V; IF=20 mA |
| Voltage Grade M19-1 | 2.8-2.9 V; IF=20 mA |
| Voltage Grade M19-2 | 2.9-3.0 V; IF=20 mA |
| Voltage Grade M19-3 | 3.0-3.1 V; IF=20 mA |
| Voltage Grade M19-4 | 3.1-3.2 V; IF=20 mA |
| Voltage Tolerance | ±0.1 V |
| Wavelength Grade HG02 | 515-520 nm; IF=20 mA |
| Wavelength Grade HG03 | 520-525 nm; IF=20 mA |
| Wavelength Grade HG04 | 525-530 nm; IF=20 mA |
| Wavelength Tolerance | ±1 nm |
| Hand Soldering Iron Power | <30 W; recommended for repair/rework only |
| Hand Soldering Temperature | <300°C; less than 3 s per terminal, one time only |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; reflow soldering |
| Reflow Soldering Limit | maximum 2 times |
| Alcohol Cleaning Condition | under 30°C for 3 min or under 50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest recommended |
| Unopened Storage Condition | <=30°C, <60% RH, within 1 year; before opening package |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours; after opening package |
| Baking Condition | 60±5°C for 24 hours; if desiccant/package fails or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-JY2012UGC-11 is a XINGLIGHT green surface mount LED built in a compact 2.0 x 1.2 x 1.1 mm SMD package. The luminous color is green with transparent/water colloid construction, making the part suited to compact board-level visual indication where a 120° typical viewing angle is required.
At IF=20 mA and Ta=25°C, the LED is specified for 600-1000 mcd luminous intensity, 515-530 nm dominant wavelength, 525 nm typical peak wavelength, 30 nm typical half wave width, and 2.6-3.2 V forward voltage. Reverse current is specified at <=1 µA with VR=5 V and Ta=25°C.
Electrical limits include 60 mW maximum power dissipation, 30 mA maximum continuous forward current, 80 mA peak forward current for pulse width <=0.1 ms and duty <=1/10, 5 V maximum reverse voltage, and 2000 V ESD rating. Assembly guidance includes reflow soldering at 240±5°C for 6 s with a maximum of two reflow cycles, MSL 3 handling, and defined storage and baking conditions.
Key Features
- Green surface mount LED in 2.0 x 1.2 x 1.1 mm package
- 600-1000 mcd luminous intensity at IF=20 mA
- 515-530 nm dominant wavelength at IF=20 mA
- 525 nm typical peak wavelength at IF=20 mA
- 2.6-3.2 V forward voltage at IF=20 mA
- 120° typical viewing angle at IF=20 mA
- 30 mA maximum continuous forward current at Ta=25°C
- 80 mA peak forward current under specified pulse conditions
- MSL 3 moisture sensitivity level
- RoHS directive compliant device
Typical Applications
- Compact board status indicators
- Green visual indication circuits
- SMD indicator light positions
- Panel and keypad indicators
- Portable electronics indicators
- Signal and mode indication
- Reflow-assembled LED boards
Procurement Notes
When requesting a quote for XL-JY2012UGC-11, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
FAQ
What package size does XL-JY2012UGC-11 use?
XL-JY2012UGC-11 uses an SMD LED package with outline dimensions of 2.0 x 1.2 x 1.1 mm, measured as length, width, and height according to the extracted datasheet dimensions.
What are the main optical ratings for this LED?
At IF=20 mA and Ta=25°C, the LED is specified for 600-1000 mcd luminous intensity, 515-530 nm dominant wavelength, 525 nm typical peak wavelength, 30 nm typical half wave width, and 120° typical viewing angle.
What current and voltage limits apply to XL-JY2012UGC-11?
At Ta=25°C, the maximum continuous forward current is 30 mA, peak forward current is 80 mA under the stated pulse condition, maximum reverse voltage is 5 V, and maximum power dissipation is 60 mW.
What assembly conditions are specified for this SMD LED?
The datasheet specifies reflow soldering at 240±5°C for 6 s with a maximum of two reflow cycles. Hand soldering for repair or rework uses less than 30 W and less than 300°C for under 3 s per terminal, one time only.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 6, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.



