Specifications
| Type | Description |
|---|---|
| Part Number | XL-JY2012UYC-11 |
| Manufacturer | XINGLIGHT |
| Product Type | Yellow SMD LED |
| Category | LED |
| Package / Case | SMD 2012, 2.0 x 1.2 x 1.1 mm |
| Outline Dimensions | 2.0 x 1.2 x 1.1 mm; L/W/H |
| Luminous Color | Yellow; transparent/water colloid lens |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Complies with RoHS directive |
| Maximum Power Dissipation | 60 mW; Ta=25°C |
| Maximum Continuous Forward Current | 30 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Withstand Voltage | 2000 V; antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum rating table |
| Lead Soldering Temperature/Time | 260°C <=6 s; absolute maximum rating table |
| Luminous Intensity | 80 to 210 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 585 to 595 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 590 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 1.9 to 2.4 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 20 nm typ; IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; VR=5 V, Ta=25°C |
| Brightness Bin D2 | 80 to 120 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D3 | 120 to 150 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D4 | 150 to 180 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin D5 | 180 to 210 mcd; IF=20 mA, brightness error ±10% |
| Voltage Bin M18-1 | 1.9 to 2.0 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-2 | 2.0 to 2.1 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-3 | 2.1 to 2.2 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-4 | 2.2 to 2.3 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin M18-5 | 2.3 to 2.4 V; IF=20 mA, voltage error ±0.1 V |
| Wavelength Bin HY03 | 585 to 587.5 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HY04 | 587.5 to 590 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HY05 | 590 to 592.5 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HY06 | 592.5 to 595 nm; IF=20 mA, wavelength error ±1 nm |
| General Test Ambient Temperature | 25 ±5 °C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours; Ta=85 ±5°C, RH=90 to 95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours; Ta=85 ±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40 ±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100 ±5°C for 20 min, -40 ±5°C for 20 min |
| Anti-tin Test | 260 ±5°C, 10 ±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; keep at peak for 10 to 15 s |
| Lead Process Reflow Time Above 183°C | 60 to 150 s; infrared reflow welding, lead process |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C; keep at peak for 5 to 10 s |
| Lead-Free Reflow Time Above 217°C | 60 to 120 s; infrared reflow welding, lead-free process |
| Weldability Test | 235 ±5°C, immersion time 2 ±0.5 s; immersion speed 25 ±2.5 mm/s, tin loading rate >=95% pad area |
| Outline Dimension Tolerance | ±0.20 mm; unless otherwise noted |
| Tape/Reel Dimension Tolerance | ±0.1 mm; belt and disk dimensions |
| Hand Soldering Iron Power | <30 W; recommended for repair/rework only |
| Hand Soldering Temperature | <300°C; each terminal less than 3 s, one time only |
| Maximum Reflow Soldering Count | 2 times maximum; reflow soldering process |
| Recommended Maximum Welding Temperature | 240 ±5°C for 6 s; product recommended maximum welding temperature |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or 50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest recommended before cleaning |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year; before opening moisture-proof antistatic package |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Condition | <=30°C, <=60% RH; operation after package opening |
| Baking Condition | 60 ±5°C for 24 hours; if desiccant/package fails or storage time is exceeded |
| Datasheet Status | request_only |
Product Overview
XL-JY2012UYC-11 is a XINGLIGHT yellow SMD LED built in a compact SMD 2012 package with outline dimensions of 2.0 x 1.2 x 1.1 mm. The part is identified with a yellow luminous color through a transparent/water colloid lens and is listed as compliant with the RoHS directive.
At IF=20 mA and Ta=25°C, the LED is specified for 80 to 210 mcd luminous intensity, 585 to 595 nm dominant wavelength, 590 nm typical peak wavelength, and 1.9 to 2.4 V forward voltage. The optical profile includes a 120° typical viewing angle and 20 nm typical half wave width, supporting broad-angle yellow indication or display illumination.
The absolute maximum ratings include 60 mW power dissipation, 30 mA continuous forward current, 80 mA peak forward current under pulse conditions, 5 V reverse voltage, and 2000 V ESD withstand voltage. The operating and storage temperature ranges are both -40 to +85°C.
Assembly and handling data includes MSL 3 moisture sensitivity, two maximum reflow soldering passes, lead and lead-free reflow peak temperature limits, hand soldering limits, cleaning conditions, workshop storage requirements, and baking guidance after package or storage exposure limits are exceeded.
Key Features
- Yellow luminous color with transparent/water colloid lens
- SMD 2012 package, 2.0 x 1.2 x 1.1 mm
- 80 to 210 mcd luminous intensity at 20 mA
- 585 to 595 nm dominant wavelength range
- 1.9 to 2.4 V forward voltage at 20 mA
- 120° typical viewing angle for broad emission
- 30 mA maximum continuous forward current
- MSL 3 moisture sensitivity classification
- RoHS directive compliant manufacturing process
- Lead-free reflow peak rating of 255°C +0/-5°C
Typical Applications
- Yellow status indicators
- Compact panel indicators
- SMD display indication
- Signal and warning lamps
- Broad-angle visual indicators
- PCB-mounted indicator lighting
- Equipment front-panel illumination
Procurement Notes
When requesting a quote for XL-JY2012UYC-11, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package is used for XL-JY2012UYC-11?
XL-JY2012UYC-11 uses an SMD 2012 package with outline dimensions of 2.0 x 1.2 x 1.1 mm. The datasheet lists the outline dimension tolerance as ±0.20 mm unless otherwise noted.
What are the optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the part is specified for 80 to 210 mcd luminous intensity, 585 to 595 nm dominant wavelength, 590 nm typical peak wavelength, 120° typical viewing angle, and 20 nm typical half wave width.
What are the main electrical limits for this LED?
The absolute maximum ratings include 60 mW power dissipation, 30 mA continuous forward current, 80 mA peak forward current under the stated pulse condition, 5 V maximum reverse voltage, and 2000 V ESD withstand voltage at Ta=25°C.
How should the opened package be stored before soldering?
After opening the package, the datasheet specifies storage at <=30°C and <=40% RH, with soldering within 168 hours or 7 days. Recommended workshop conditions after opening are <=30°C and <=60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 6, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.