Specifications
| Type | Description |
|---|---|
| Part Number | XL-N1005UGC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD 1005, 1.0 x 0.5 x 0.4 mm |
| Outline Dimensions | 1.0 x 0.5 x 0.4 mm (L/W/H) |
| Luminous Color | green, transparent/water-clear colloid |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Complied with RoHS Directive; environmental protection process |
| Maximum Power Dissipation | 75 mW at Ta=25°C |
| Maximum Continuous Forward Current | 25 mA at Ta=25°C |
| Peak Forward Current | 80 mA, pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V at Ta=25°C |
| ESD Withstand Voltage | 2000 V at Ta=25°C |
| Operating Temperature Range | -40 to +85°C |
| Storage Temperature Range | -40 to +85°C |
| Lead Soldering Temperature/Time | 260°C <=6 s |
| Luminous Intensity | 600 to 1000 mcd at IF=20 mA, Ta=25°C |
| Dominant Wavelength | 515 to 530 nm at IF=20 mA, Ta=25°C |
| Peak Wavelength | 525 nm typ at IF=20 mA, Ta=25°C |
| Forward Voltage | 2.5 to 3.0 V at IF=20 mA, Ta=25°C |
| Half Wave Width | 28 nm typ at IF=20 mA, Ta=25°C |
| Viewing Angle | 120° typ, 2θ1/2, IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA at VR=5 V, Ta=25°C |
| Brightness Bin E6 | 600 to 700 mcd at IF=20 mA |
| Brightness Bin E7 | 700 to 800 mcd at IF=20 mA |
| Brightness Bin E8 | 800 to 900 mcd at IF=20 mA |
| Brightness Bin E9 | 900 to 1000 mcd at IF=20 mA |
| Voltage Bin M18-7 | 2.5 to 2.6 V at IF=20 mA |
| Voltage Bin M18-8 | 2.6 to 2.7 V at IF=20 mA |
| Voltage Bin M18-9 | 2.7 to 2.8 V at IF=20 mA |
| Voltage Bin M19-1 | 2.8 to 2.9 V at IF=20 mA |
| Voltage Bin M19-2 | 2.9 to 3.0 V at IF=20 mA |
| Wavelength Bin HG02 | 515 to 520 nm at IF=20 mA |
| Wavelength Bin HG03 | 520 to 525 nm at IF=20 mA |
| Wavelength Bin HG04 | 525 to 530 nm at IF=20 mA |
| Test Ambient Temperature | 25 ±5°C unless otherwise indicated |
| Working Life Test | 1000 hours, continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature and High Humidity Storage Test | 240 hours ±2 hours; IR reflow in-board 2 times; Ta=85 ±5°C, RH=90-95% |
| High Temperature Storage Test | 1000 hours at Ta=85 ±5°C |
| Low Temperature Storage Test | 1000 hours at Ta=-40 ±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100 ±5°C for 20 min, -40 ±5°C for 20 min |
| Anti-tin Test | 260 ±5°C, 10 ±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C for 10-15 s; lead process infrared reflow welding |
| Lead-free Reflow Peak Temperature | 255°C +0/-5°C for 5-10 s; lead-free infrared reflow welding |
| Weldability Test | 235 ±5°C, immersion time 2 ±0.5 s; immersion speed 25 ±2.5 mm/s, tin loading rate >=95% pad area |
| Outline Dimension Tolerance | ±0.25 mm unless otherwise noted |
| Tape/Reel Dimensional Tolerance | ±0.1 mm for belt and disk dimensions |
| Hand Soldering Iron Power | <30 W for manual repair/rework soldering |
| Hand Soldering Temperature | <300°C, less than 3 s per terminal, one time only |
| Maximum Reflow Count | 2 times maximum |
| Recommended Maximum Welding Temperature | 240 ±5°C for 6 s |
| Cleaning With Alcohol | under 30°C for 3 min or under 50°C for 30 s after soldering |
| Ultrasonic Cleaning Power | <=300 W recommended maximum; pretest required to confirm no LED damage |
| Unopened Storage Conditions | <=30°C, <=60% RH, use within 1 year |
| Opened Storage Conditions | <=30°C, <=40% RH, solder within 168 hours / 7 days |
| Recommended Workshop Conditions | <=30°C, <=60% RH |
| Baking Condition | 60 ±5°C for 24 hours if moisture absorbent faded or LEDs exceeded storage time |
| Datasheet Status | request_only |
Product Overview
XL-N1005UGC is a XINGLIGHT green chip LED supplied in a compact SMD 1005 package with outline dimensions of 1.0 x 0.5 x 0.4 mm. The datasheet identifies a transparent/water-clear colloid and green luminous color, making the part suitable for compact visual indication and board-mounted signaling functions where a small 1005 LED footprint is required.
At IF=20 mA and Ta=25°C, the LED is specified for 600 to 1000 mcd luminous intensity, 515 to 530 nm dominant wavelength, 525 nm typical peak wavelength, 28 nm typical half-wave width, and 120° typical viewing angle. Forward voltage is specified from 2.5 to 3.0 V, with voltage and wavelength bins provided for production selection.
Assembly and handling data include MSL 3 classification, maximum two reflow cycles, lead-free infrared reflow peak conditions of 255°C +0/-5°C for 5-10 s, and opened-package storage of no more than 30°C and 40% RH with soldering within 168 hours. The device is specified for -40 to +85°C operating and storage temperature ranges.
Key Features
- SMD 1005 package, 1.0 x 0.5 x 0.4 mm
- Green luminous output with transparent/water-clear colloid
- 600 to 1000 mcd intensity at 20 mA
- 515 to 530 nm dominant wavelength range
- 2.5 to 3.0 V forward voltage at 20 mA
- 120° typical viewing angle at 20 mA
- 25 mA maximum continuous forward current
- MSL 3 moisture sensitivity classification
- RoHS Directive compliant process stated
- -40 to +85°C operating temperature range
Typical Applications
- Compact PCB status indicators
- Green signal lamps
- Panel indication LEDs
- Portable device indicators
- Backlighting for small controls
- Visual state indication
- SMD LED replacement designs
Procurement Notes
When requesting a quote for XL-N1005UGC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package is used for the XL-N1005UGC LED?
XL-N1005UGC uses an SMD 1005 package with outline dimensions of 1.0 x 0.5 x 0.4 mm. The datasheet also lists an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 600 to 1000 mcd luminous intensity, 515 to 530 nm dominant wavelength, 525 nm typical peak wavelength, 28 nm typical half-wave width, and 120° typical viewing angle.
What current and voltage limits apply to this part?
The maximum continuous forward current is 25 mA at Ta=25°C. Peak forward current is 80 mA for pulse width <=0.1 ms and duty <=1/10. Maximum reverse voltage is 5 V, and reverse current is <=1 µA at VR=5 V.
What storage rules apply after opening the package?
After opening the moisture-proof anti-electrostatic package, the datasheet specifies storage at <=30°C and <=40% RH, with soldering within 168 hours or 7 days. Baking is specified at 60 ±5°C for 24 hours if storage time is exceeded.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 6, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.