XL-N1005UOC Orange Chip LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-N1005UOC Orange Chip LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-N1005UOC
Manufacturer
XINGLIGHT
Package
SMD LED, 1.0 x 0.5 x 0.4 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-N1005UOC from XINGLIGHT is an orange chip LED in a 1.0 x 0.5 x 0.4 mm SMD package with a transparent water colloid lens. It is specified for 80 to 180 mcd luminous intensity, 600 to 608 nm dominant wavelength, 605 nm typical peak wavelength, and 1.8 to 2.4 V forward voltage at IF=20 mA and Ta=25°C. Absolute maximum ratings include 75 mW power dissipation, 25 mA continuous forward current, 80 mA peak forward current, and 5 V reverse voltage. The device supports compact orange indication and backlighting applications where a 120° typical viewing angle is required.

Specifications

TypeDescription
Part NumberXL-N1005UOC
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Package / CaseSMD LED, 1.0 x 0.5 x 0.4 mm
Outline Dimensions1.0 x 0.5 x 0.4 mm; L/W/H
Luminous ColorOrange; transparent/water colloid lens
Colloid / Lens TypeWater colloid / transparent colloid; orange LED body description
RoHS ComplianceComplies with RoHS Directive; environmental protection products
Moisture Sensitivity LevelMSL 3; moisture sensitivity level stated as 3 levels
Maximum Power Dissipation75 mW; Ta=25°C
Maximum Continuous Forward Current25 mA; Ta=25°C
Peak Forward Current80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C
Maximum Reverse Voltage5 V; Ta=25°C
ESD / Antistatic Ability2000 V; Ta=25°C
Operating Temperature Range-40 to +85 °C; absolute maximum rating
Storage Temperature Range-40 to +85 °C; absolute maximum rating
Lead Soldering Temperature / Time260°C <=6 s; absolute maximum rating
Luminous Intensity80 to 180 mcd; IF=20 mA, Ta=25°C
Dominant Wavelength600 to 608 nm; IF=20 mA, Ta=25°C
Peak Wavelength605 nm typ; IF=20 mA, Ta=25°C
Forward Voltage1.8 to 2.4 V; IF=20 mA, Ta=25°C
Half Wave Width20 nm typ; IF=20 mA, Ta=25°C
Viewing Angle120° typ; 2θ1/2, IF=20 mA, Ta=25°C
Reverse Current<=1 µA; VR=5 V, Ta=25°C
Brightness Bin D280 to 120 mcd; IF=20 mA
Brightness Bin D3120 to 150 mcd; IF=20 mA
Brightness Bin D4150 to 180 mcd; IF=20 mA
Voltage Bin M17-91.8 to 1.9 V; IF=20 mA
Voltage Bin M18-11.9 to 2.0 V; IF=20 mA
Voltage Bin M18-22.0 to 2.1 V; IF=20 mA
Voltage Bin M18-32.1 to 2.2 V; IF=20 mA
Voltage Bin M18-42.2 to 2.3 V; IF=20 mA
Voltage Bin M18-52.3 to 2.4 V; IF=20 mA
Wavelength Bin HO01600 to 602.5 nm; IF=20 mA
Wavelength Bin HO02602.5 to 605 nm; IF=20 mA
Wavelength Bin HO03605 to 607.5 nm; IF=20 mA
Default Test Ambient Temperature25 ±5 °C; unless otherwise indicated
Working Life Test1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA
High Temperature and High Humidity Storage Test240 hours ±12 hours; IR reflow in-board 2 times; Ta=85±5°C, RH=90-95%
High Temperature Storage Test1000 hours; Ta=85±5°C
Low Temperature Storage Test1000 hours; Ta=-40±5°C
Cold and Hot Cycle Test100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min
Hot and Cold Impact Test100 cycles; IR reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each
Anti-tin Test260±5°C for 10±1 s, 2 times; soldering temperature T.sol
Lead Process Reflow Peak Temperature235°C +5/-0°C; time at peak 10-15 s; ramp max 3°C/s; >183°C for 60-150 s
Lead-free Reflow Peak Temperature255°C +0/-5°C; time at peak 5-10 s; ramp max 3°C/s; >217°C for 60-120 s
Weldability TestTin loading rate >=95% pad area; T.sol=235±5°C; immersion speed 25±2.5 mm/s; immersion time 2±0.5 s
Dimension Tolerance±0.25 mm; unless otherwise noted
Carrier Tape Dimensional Tolerance±0.1 mm; belt and disk dimensions
Hand Soldering Iron Power<30 W; recommended only for repair/rework
Hand Soldering Temperature<300°C; each terminal less than 3 s, one time only
Maximum Reflow Cycles2 times; reflow soldering
Recommended Maximum Welding Temperature240±15°C for 6 s; product reflow soldering recommendation
Cleaning ConditionAlcohol cleaning under 30°C for 3 min or under 50°C for 30 s; after soldering
Ultrasonic Cleaning Power<=300 W; pretest required before cleaning
Unopened Storage Life1 year; moisture-proof anti-electrostatic package with desiccant
Pre-opening Storage Condition<=30°C, <=60% RH; before opening package
Post-opening Storage Condition<=30°C, <=40% RH, use within 168 hours / 7 days; after opening package
Recommended Workshop Condition<=30°C, <=60% RH; product operation/workshop condition
Baking Condition60±5°C for 24 hours; if desiccant has faded or LEDs exceeded storage time
Datasheet Statusrequest_only

Product Overview

XL-N1005UOC is a XINGLIGHT orange chip LED with a transparent water colloid lens. The component is supplied in an SMD LED package measuring 1.0 x 0.5 x 0.4 mm, making it suited to compact board layouts where orange emission is required.

At IF=20 mA and Ta=25°C, the device is specified for 80 to 180 mcd luminous intensity, 600 to 608 nm dominant wavelength, 605 nm typical peak wavelength, 20 nm typical half wave width, and a 120° typical viewing angle. Forward voltage is specified from 1.8 to 2.4 V, with reverse current limited to <=1 µA at VR=5 V.

Assembly limits include a maximum of two reflow cycles, a recommended reflow soldering condition of 240±15°C for 6 s, and hand soldering below 300°C for less than 3 s per terminal. Storage guidance includes MSL 3 handling, unopened storage life of 1 year, and post-opening use within 168 hours at <=30°C and <=40% RH.

Key Features

  • 1.0 x 0.5 x 0.4 mm SMD LED package
  • Orange emission with transparent water colloid lens
  • 80 to 180 mcd luminous intensity at 20 mA
  • 600 to 608 nm dominant wavelength at 20 mA
  • 1.8 to 2.4 V forward voltage at 20 mA
  • 120° typical viewing angle at 20 mA
  • 25 mA maximum continuous forward current
  • MSL 3 moisture sensitivity classification
  • RoHS Directive compliance stated in datasheet
  • Post-opening use window of 168 hours

Typical Applications

  • Compact orange status indicators
  • Panel and keypad backlighting
  • Portable device indicator LEDs
  • PCB-mounted visual signaling
  • Orange channel display elements
  • Small-format lighting indicators

Procurement Notes

When requesting a quote for XL-N1005UOC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package size does XL-N1005UOC use?

XL-N1005UOC uses an SMD LED package with outline dimensions of 1.0 x 0.5 x 0.4 mm. The datasheet lists the dimension tolerance as ±0.25 mm unless otherwise noted.

What are the optical specifications at 20 mA?

At IF=20 mA and Ta=25°C, XL-N1005UOC is specified for 80 to 180 mcd luminous intensity, 600 to 608 nm dominant wavelength, 605 nm typical peak wavelength, 20 nm typical half wave width, and 120° typical viewing angle.

What current and voltage limits apply to this LED?

The absolute maximum continuous forward current is 25 mA at Ta=25°C. Peak forward current is 80 mA for pulse width <=0.1 ms and duty <=1/10. Maximum reverse voltage is 5 V.

What storage conditions are specified after opening?

After opening the package, the datasheet specifies storage at <=30°C and <=40% RH, with use within 168 hours, or 7 days. If storage time is exceeded, baking at 60±5°C for 24 hours is specified.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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