Specifications
| Type | Description |
|---|---|
| Part Number | XL-N1005UOC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD LED, 1.0 x 0.5 x 0.4 mm |
| Outline Dimensions | 1.0 x 0.5 x 0.4 mm; L/W/H |
| Luminous Color | Orange; transparent/water colloid package |
| Moisture Sensitivity Level | MSL 3 |
| Environmental Compliance | RoHS compliant |
| Maximum Power Dissipation | 75 mW at Ta=25°C |
| Maximum Continuous Forward Current | 25 mA at Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V at Ta=25°C |
| ESD Rating | 2000 V antistatic ability at Ta=25°C |
| Operating Temperature Range | -40 to +85°C |
| Storage Temperature Range | -40 to +85°C |
| Lead Soldering Temperature/Time | 260°C <=6 s |
| Luminous Intensity | 80-180 mcd at IF=20 mA, Ta=25°C |
| Dominant Wavelength | 600-608 nm at IF=20 mA, Ta=25°C |
| Peak Wavelength | Typ 605 nm at IF=20 mA, Ta=25°C |
| Forward Voltage | 1.8-2.4 V at IF=20 mA, Ta=25°C |
| Half Wave Width | Typ 20 nm at IF=20 mA, Ta=25°C |
| Viewing Angle | Typ 120°; 2θ1/2, IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA at VR=5 V, Ta=25°C |
| Brightness Bin D2 | 80-120 mcd at IF=20 mA |
| Brightness Bin D3 | 120-150 mcd at IF=20 mA |
| Brightness Bin D4 | 150-180 mcd at IF=20 mA |
| Voltage Bin M17-9 | 1.8-1.9 V at IF=20 mA |
| Voltage Bin M18-1 | 1.9-2.0 V at IF=20 mA |
| Voltage Bin M18-2 | 2.0-2.1 V at IF=20 mA |
| Voltage Bin M18-3 | 2.1-2.2 V at IF=20 mA |
| Voltage Bin M18-4 | 2.2-2.3 V at IF=20 mA |
| Voltage Bin M18-5 | 2.3-2.4 V at IF=20 mA |
| Wavelength Bin HO01 | 600-602.5 nm at IF=20 mA |
| Wavelength Bin HO02 | 602.5-605 nm at IF=20 mA |
| Wavelength Bin HO03 | 605-607.5 nm at IF=20 mA |
| Outline Dimension Tolerance | ±0.25 mm unless otherwise noted |
| Tape/Reel Dimensional Tolerance | ±0.1 mm for belt and disk dimensions |
| Hand Soldering Iron Power | <30 W for manual repair/rework soldering |
| Hand Soldering Temperature | <300°C; each terminal once only, duration <3 s |
| Maximum Reflow Cycles | 2 times |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s |
| Post-Solder Cleaning | Alcohol cleaning under 30°C for 3 min or under 50°C for 30 s |
| Ultrasonic Cleaning Power | <=300 W; pretest recommended before ultrasonic cleaning |
| Unopened Storage Condition | <=30°C, <60% RH, within 1 year |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours / 7 days |
| Recommended Workshop Condition | <=30°C, <60% RH |
| Baking Condition | 60±5°C for 24 hours if moisture absorbent has faded or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
The XL-N1005UOC is a XINGLIGHT orange SMD LED supplied in a compact 1.0 x 0.5 x 0.4 mm package. The datasheet identifies a transparent/water colloid package and specifies RoHS compliance with MSL 3 moisture sensitivity handling.
Key Features
- Orange SMD LED in 1.0 x 0.5 x 0.4 mm package
- Transparent/water colloid package construction
- 80-180 mcd luminous intensity at 20 mA
- 600-608 nm dominant wavelength range
- Typical 605 nm peak wavelength
- 1.8-2.4 V forward voltage at 20 mA
- Typical 120° viewing angle
- 25 mA maximum continuous forward current
- 80 mA peak pulsed forward current
- 5 V maximum reverse voltage
- MSL 3 moisture sensitivity level
- RoHS compliant environmental specification
Typical Applications
- Orange status indicators
- Compact PCB indicator lights
- Space-constrained signal indication
- Consumer electronics indicators
- Panel and keypad illumination
- Equipment operating-state indication
Procurement Notes
When requesting a quote for XL-N1005UOC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package size does XL-N1005UOC use?
XL-N1005UOC uses an SMD LED package with outline dimensions of 1.0 x 0.5 x 0.4 mm. The datasheet lists an outline dimension tolerance of ±0.25 mm unless otherwise noted.
What optical output is specified for this LED?
At IF=20 mA and Ta=25°C, XL-N1005UOC is specified for 80-180 mcd luminous intensity, 600-608 nm dominant wavelength, typical 605 nm peak wavelength, typical 20 nm half wave width, and typical 120° viewing angle.
What are the main electrical limits for XL-N1005UOC?
The datasheet lists 75 mW maximum power dissipation, 25 mA maximum continuous forward current, 80 mA peak forward current under specified pulse conditions, 5 V maximum reverse voltage, and <=1 µA reverse current at VR=5 V.
How should opened packages be stored before soldering?
After opening the package, the datasheet specifies storage at <=30°C and <40% RH, with soldering within 168 hours or 7 days. If storage time is exceeded, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 6, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.