Specifications
| Type | Description |
|---|---|
| Part Number | XL-TD3216PDC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Inferred Category | LED |
| Component Type | Sensor |
| Package / Case | 1206 SMD, 3.2 x 1.6 x 1.96 mm |
| Outline Dimensions | 3.2 x 1.6 x 1.96 mm; L/W/H |
| Colloid | Black colloid; package body material/color |
| Moisture Sensitivity Level | MSL 3 |
| Collector-Emitter Voltage | 30 V max; absolute maximum rating, Ta=25°C |
| Emitter-Collector Voltage | 5 V max; absolute maximum rating, Ta=25°C |
| Operating Ambient Temperature | -40°C to +85°C; Topr |
| Storage Ambient Temperature | -40°C to +85°C; Tstg |
| Reflow Soldering Condition | 260°C, 6 s; Tsol absolute maximum welding condition |
| Manual Soldering Condition | 300°C, 3 s; Tsol absolute maximum welding condition |
| Collector-Emitter Breakdown Voltage | 85 V min; ICEO=100 µA, Ee=0 mW/cm², Ta=25°C |
| Emitter-Collector Breakdown Voltage | 8.2 V min; IECO=10 µA, Ee=0 mW/cm², Ta=25°C |
| Collector-Base Breakdown Voltage | 85 V min; ICBO=100 µA, Ee=0 mW/cm², Ta=25°C |
| Collector Dark Current | 30 nA max; VCE=20 V, Ee=0 mW/cm², Ta=25°C |
| Collector Dark Current | 150 nA max; VCE=70 V, Ee=0 mW/cm², Ta=25°C |
| Collector-Emitter Saturation Voltage | 0.3 V max; IC=2 mA, IB=100 µA, Ee=1 mW/cm², Ta=25°C |
| Peak Sensitive Wavelength | 880 nm typ; Ta=25°C |
| Current Gain | 200 min, 2300 max; VCE=5 V, IC=2 mA, Ta=25°C |
| Photocurrent | 4 mA min, 6 mA max; Ee=1 mW/cm², λp=940 nm, VCE=5 V, Ta=25°C |
| Spectral Bandwidth | 700 nm min, 1100 nm max; relative sensitivity threshold 0.5, Ta=25°C |
| Rise Time | 15 µs typ; VCE=5 V, IC=1 mA, RL=1000 Ω, Ta=25°C |
| Fall Time | 15 µs typ; VCE=5 V, IC=1 mA, RL=1000 Ω, Ta=25°C |
| Photocurrent Grading Code | IC23-25 |
| Photocurrent Grade Range | 4 mA min, 6 mA max; Ee=1 mW/cm², λp=940 nm, VCE=5 V |
| Dimensional Tolerance | ±0.10 mm; unless otherwise specified |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s |
| Maximum Reflow Count | 2 times |
| Hand Soldering Iron Power | <30 W recommended |
| Hand Soldering Temperature | <300°C; each terminal once, less than 3 s |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or under 50°C for 30 s |
| Ultrasonic Cleaning Power | ≤300 W generally; pretest required before ultrasonic cleaning |
| Unopened Storage Condition | ≤30°C, <60% RH, use within 1 year |
| Opened Storage Condition | ≤30°C, <40% RH, solder within 168 hours / 7 days |
| Baking Condition | 60±5°C for 24 hours; if desiccant/package failed or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-TD3216PDC is a XINGLIGHT SMD phototransistor receiver classified in the LED category. It is supplied in a 1206 SMD package with 3.2 x 1.6 x 1.96 mm outline dimensions and a black colloid package body. The dimensional tolerance is ±0.10 mm unless otherwise specified.
The device is specified for -40°C to +85°C operating and storage ambient temperature. Absolute maximum ratings include 30 V collector-emitter voltage and 5 V emitter-collector voltage at Ta=25°C. Electrical characteristics include 85 V minimum collector-emitter and collector-base breakdown voltage, 8.2 V minimum emitter-collector breakdown voltage, and collector dark current limits of 30 nA at VCE=20 V and 150 nA at VCE=70 V.
Optical performance includes 880 nm typical peak sensitive wavelength, 700 nm to 1100 nm spectral bandwidth, and 4 mA to 6 mA photocurrent at Ee=1 mW/cm², λp=940 nm, VCE=5 V. Rise and fall times are both 15 µs typical under the stated load condition, supporting use in compact infrared receiver and optical detection circuits.
Key Features
- 1206 SMD phototransistor receiver package
- 3.2 x 1.6 x 1.96 mm outline
- Black colloid package body construction
- MSL 3 moisture sensitivity level
- -40°C to +85°C operating temperature range
- 880 nm typical peak sensitive wavelength
- 4 mA to 6 mA photocurrent grading range
- 700 nm to 1100 nm spectral sensitivity bandwidth
- 15 µs typical rise and fall times
- 30 nA maximum dark current at 20 V
Typical Applications
- Infrared receiver circuits
- Reflective object sensing
- Optical interrupter sensing
- SMD optical detector assemblies
- 940 nm emitter detection
- Compact sensor board layouts
Procurement Notes
When requesting a quote for XL-TD3216PDC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What type of component is XL-TD3216PDC?
XL-TD3216PDC is specified as a XINGLIGHT SMD phototransistor receiver in the LED category. The extracted package information identifies it as a 1206 SMD device with 3.2 x 1.6 x 1.96 mm outline dimensions.
What optical wavelength does XL-TD3216PDC respond to?
The datasheet facts list an 880 nm typical peak sensitive wavelength at Ta=25°C. The specified photocurrent range is measured with λp=940 nm, Ee=1 mW/cm², and VCE=5 V.
What is the photocurrent range for this device?
XL-TD3216PDC has a photocurrent range of 4 mA minimum to 6 mA maximum under Ee=1 mW/cm², λp=940 nm, VCE=5 V, and Ta=25°C. The photocurrent grading code is IC23-25.
What soldering limits apply to XL-TD3216PDC?
Absolute maximum welding conditions list 260°C for 6 s for reflow and 300°C for 3 s for manual soldering. The recommended maximum welding temperature is 240±5°C for 6 s, with reflow limited to two times.
How should opened packages be stored before soldering?
After opening the package, storage is specified at ≤30°C and <40% RH, with soldering within 168 hours or 7 days. If the storage time is exceeded or desiccant/package failure occurs, baking is specified at 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.