Specifications
| Type | Description |
|---|---|
| Part Number | XL-TD3216SYGC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD 3216, 3.2 x 1.6 x 1.96 mm |
| Outline Dimensions | 3.2 x 1.6 x 1.96 mm; condition: L/W/H; source page: 1 |
| Luminous Color | yellow green; condition: transparent/water colloid; source page: 1 |
| Colloid / Lens Type | water colloid / transparent colloid; source page: 1 |
| RoHS Compliance | Complied with RoHS Directive; source page: 1 |
| Moisture Sensitivity Level | MSL 3; source page: 1 |
| SMT Compatibility | Suitable for SMT automatic production; source page: 1 |
| Reflow Process Compatibility | Suitable for infrared reflow soldering process; source page: 1 |
| Maximum Power Dissipation | 50 mW; condition: Ta=25°C; source page: 3 |
| Maximum Continuous Forward Current | 20 mA; condition: Ta=25°C; source page: 3 |
| Peak Forward Current | 80 mA; condition: pulse width <=0.1 ms, duty <=1/10, Ta=25°C; source page: 3 |
| Maximum Reverse Voltage | 5 V; condition: Ta=25°C; source page: 3 |
| Antistatic Ability | 2000 V; condition: Ta=25°C; source page: 3 |
| Operating Temperature Range | -40 to +85 °C; source page: 3 |
| Storage Temperature Range | -40 to +85 °C; source page: 3 |
| Lead Soldering Temperature / Time | 260°C <=6 s; source page: 3 |
| Luminous Intensity | 135 to 400 mcd; condition: IF=20 mA, Ta=25°C; source page: 3 |
| Dominant Wavelength | 565 to 570 nm; condition: IF=20 mA, Ta=25°C; source page: 3 |
| Peak Wavelength | 570 nm typ; condition: IF=20 mA, Ta=25°C; source page: 3 |
| Forward Voltage | 1.9 to 2.3 V; condition: IF=20 mA, Ta=25°C; source page: 3 |
| Viewing Angle | 30° typ; condition: 2θ1/2, IF=20 mA, Ta=25°C; source page: 3 |
| Half Wave Width | 15 nm typ; condition: IF=20 mA, Ta=25°C; source page: 3 |
| Reverse Current | <=1 µA; condition: VR=5 V, Ta=25°C; source page: 3 |
| Brightness Grade A2 | 100 to 200 mcd; condition: IF=20 mA, brightness error ±10%; source page: 4 |
| Brightness Grade A3 | 200 to 300 mcd; condition: IF=20 mA, brightness error ±10%; source page: 4 |
| Brightness Grade A4 | 300 to 400 mcd; condition: IF=20 mA, brightness error ±10%; source page: 4 |
| Voltage Grade N11-4 | 1.9 to 2.1 V; condition: IF=20 mA, voltage error ±0.1 V; source page: 4 |
| Voltage Grade N11-5 | 2.1 to 2.3 V; condition: IF=20 mA, voltage error ±0.1 V; source page: 4 |
| Wavelength Grade HYG03 | 565 to 567.5 nm; condition: IF=20 mA, wavelength error ±1 nm; source page: 4 |
| Wavelength Grade HYG04 | 567.5 to 570 nm; condition: IF=20 mA, wavelength error ±1 nm; source page: 4 |
| Wavelength Grade HYG05 | 570 to 572.5 nm; condition: IF=20 mA, wavelength error ±1 nm; source page: 4 |
| Wavelength Grade HYG06 | 572.5 to 575 nm; condition: IF=20 mA, wavelength error ±1 nm; source page: 4 |
| Default Test Ambient Temperature | 25±5°C; condition: unless otherwise indicated; source page: 5 |
| Working Life Test | 1000 hours; condition: continuous lighting at maximum rated current at room temperature; tested at 20 mA; source page: 6 |
| High Temperature and High Humidity Storage Test | 240 hours ±2 hours; condition: Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times; source page: 6 |
| High Temperature Storage Test | 1000 hours; condition: Ta=85±5°C; source page: 6 |
| Low Temperature Storage Test | 1000 hours; condition: Ta=-40±5°C; source page: 6 |
| Cold and Hot Cycle Test | 100 cycles; condition: 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min; source page: 6 |
| Hot and Cold Impact Test | 100 cycles; condition: IR reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each; source page: 6 |
| Anti-Tin Test | 260±5°C, 10±1 s, 2 times; condition: T.sol soldering temperature; source page: 6 |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; condition: keep at peak for 10-15 s; source page: 6 |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C; condition: keep at peak for 5-10 s; source page: 6 |
| Reflow Soldering Limit | maximum 2 times; source page: 10 |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; condition: product recommendation; source page: 10 |
| Hand Soldering Iron Power | <30 W; condition: recommended for repair/rework only; source page: 10 |
| Hand Soldering Temperature | <300°C; condition: less than 3 s per terminal, one time only; source page: 10 |
| Cleaning Condition | alcohol cleaning under 30°C for 3 min or under 50°C for 30 s; condition: after soldering; source page: 11 |
| Ultrasonic Cleaning Power | <=300 W; condition: pretest required; source page: 11 |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year; condition: before opening moisture-proof anti-static package; source page: 12 |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 hours / 7 days; condition: after opening package; source page: 12 |
| Recommended Workshop Condition | <=30°C, <=60% RH; condition: operation/storage after opening recommendation; source page: 12 |
| Baking Condition | 60±5°C for 24 hours; condition: if desiccant failed or storage time exceeded; source page: 12 |
| Dimension Tolerance | ±0.25 mm; condition: unless otherwise noted; source page: 7 |
| Datasheet Status | request_only |
Product Overview
The XL-TD3216SYGC is a XINGLIGHT yellow green SMD LED built in a 3216 outline. Its package dimensions are 3.2 x 1.6 x 1.96 mm, with a transparent water colloid lens construction. The device is RoHS compliant and carries MSL 3 handling classification.
Electrical ratings at Ta=25°C include 50 mW maximum power dissipation, 20 mA maximum continuous forward current, 80 mA peak forward current under pulse conditions, 5 V maximum reverse voltage, and 2000 V antistatic ability. Optical characteristics at IF=20 mA and Ta=25°C include 135 to 400 mcd luminous intensity, 565 to 570 nm dominant wavelength, 570 nm typical peak wavelength, 15 nm typical half wave width, and 30° typical viewing angle.
For assembly, the LED is suitable for SMT automatic production and infrared reflow soldering. The datasheet specifies maximum two reflow soldering cycles, lead-free reflow peak temperature of 255°C +0/-5°C, and handling limits for cleaning, storage, baking, and hand solder repair.
Key Features
- Yellow green luminous output with transparent water colloid lens
- SMD 3216 package, 3.2 x 1.6 x 1.96 mm
- 135 to 400 mcd luminous intensity at 20 mA
- 565 to 570 nm dominant wavelength at 20 mA
- 1.9 to 2.3 V forward voltage at 20 mA
- 30° typical viewing angle under specified test conditions
- 20 mA maximum continuous forward current at 25°C
- RoHS compliant and classified as MSL 3
- Suitable for SMT automatic production and infrared reflow
- Operating temperature range from -40 to +85°C
Typical Applications
- SMT status indicators
- Yellow green panel indicators
- Compact signal lamps
- PCB-mounted visual feedback
- Reflow-assembled LED boards
- Equipment indication points
- Small-format display indicators
Procurement Notes
When requesting a quote for XL-TD3216SYGC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package is used for XL-TD3216SYGC?
XL-TD3216SYGC uses an SMD 3216 package with outline dimensions of 3.2 x 1.6 x 1.96 mm. The datasheet lists a general dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 135 to 400 mcd luminous intensity, 565 to 570 nm dominant wavelength, 570 nm typical peak wavelength, 15 nm typical half wave width, and 30° typical viewing angle.
What assembly processes does this LED support?
The datasheet states that XL-TD3216SYGC is suitable for SMT automatic production and infrared reflow soldering. Reflow soldering is limited to a maximum of two times, with separate lead and lead-free peak temperature profiles.
What storage limits apply after opening the package?
After opening the package, storage should be at <=30°C and <=40% RH, and soldering should be completed within 168 hours or 7 days. Recommended workshop conditions are <=30°C and <=60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.