Specifications
| Type | Description |
|---|---|
| Part Number | XL-TD3216UGC |
| Manufacturer | XINGLIGHT |
| Product Type | Green SMD LED |
| Category | LED |
| Package / Case | 3.2 x 1.6 x 1.96 mm SMD LED |
| Outline Dimensions | 3.2 x 1.6 x 1.96 mm (L/W/H) |
| Luminous Color | Green, transparent/water colloid |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Complied with RoHS Directive; environmental protection product |
| Maximum Power Dissipation | 70 mW at Ta=25°C |
| Maximum Continuous Forward Current | 20 mA at Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V at Ta=25°C |
| ESD Rating | 2000 V antistatic ability |
| Operating Temperature Range | -40 to +85°C |
| Storage Temperature Range | -40 to +85°C |
| Lead Soldering Temperature/Time | 260°C <=6 s |
| Luminous Intensity | 4000 to 16000 mcd at IF=20 mA, Ta=25°C |
| Dominant Wavelength | 515 to 530 nm at IF=20 mA, Ta=25°C |
| Peak Wavelength | 525 nm typ at IF=20 mA, Ta=25°C |
| Forward Voltage | 2.5 to 3.3 V at IF=20 mA, Ta=25°C |
| Viewing Angle | 30° typ, 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 30 nm typ at IF=20 mA, Ta=25°C |
| Reverse Current | <=1 μA at VR=5 V, Ta=25°C |
| Brightness Bin B7 | 4000 to 5000 mcd at IF=20 mA |
| Brightness Bin B8 | 5000 to 6000 mcd at IF=20 mA |
| Brightness Bin B9 | 6000 to 8000 mcd at IF=20 mA |
| Brightness Bin C1 | 8000 to 10000 mcd at IF=20 mA |
| Brightness Bin C2 | 10000 to 12000 mcd at IF=20 mA |
| Brightness Bin C3 | 12000 to 14000 mcd at IF=20 mA |
| Brightness Bin C4 | 14000 to 16000 mcd at IF=20 mA |
| Brightness Bin Tolerance | ±10% brightness error |
| Voltage Bin N11-7 | 2.5 to 2.7 V at IF=20 mA |
| Voltage Bin N11-8 | 2.7 to 2.9 V at IF=20 mA |
| Voltage Bin N11-9 | 2.9 to 3.1 V at IF=20 mA |
| Voltage Bin N12-1 | 3.1 to 3.3 V at IF=20 mA |
| Voltage Bin Tolerance | ±0.1 V voltage error |
| Wavelength Bin HG02 | 515 to 520 nm at IF=20 mA |
| Wavelength Bin HG03 | 520 to 525 nm at IF=20 mA |
| Wavelength Bin HG04 | 525 to 530 nm at IF=20 mA |
| Wavelength Bin Tolerance | ±1 nm wavelength error |
| General Test Ambient Temperature | 25±5°C unless otherwise indicated |
| Dimension Tolerance | ±0.25 mm unless otherwise noted |
| Hand Soldering Iron Power | <30 W, recommended for repair/rework only |
| Hand Soldering Temperature | <300°C, each terminal once, less than 3 s |
| Maximum Reflow Soldering Cycles | 2 times |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s |
| Cleaning Solvent | Alcohol, recommended after soldering |
| Cleaning Condition | Under 30°C for 3 min or under 50°C for 30 s |
| Ultrasonic Cleaning Power | <=300 W; pretest recommended |
| Unopened Storage Condition | <=30°C, <60% RH, use within 1 year |
| Opened Storage Condition | <=30°C, <40% RH, solder within 168 hours |
| Recommended Workshop Condition | <=30°C, <60% RH |
| Baking Condition | 60±5°C for 24 hours if desiccant/package failed or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
XL-TD3216UGC is a XINGLIGHT green SMD LED with 3.2 x 1.6 x 1.96 mm outline dimensions. The datasheet identifies the luminous color as green with transparent/water colloid construction, and the component is categorized as an LED for surface-mount assembly.
At Ta=25°C, the device ratings include 70 mW maximum power dissipation, 20 mA maximum continuous forward current, 80 mA peak forward current under pulse conditions, and 5 V maximum reverse voltage. Optical and electrical test conditions at IF=20 mA specify 4000 to 16000 mcd luminous intensity, 515 to 530 nm dominant wavelength, 525 nm typical peak wavelength, 2.5 to 3.3 V forward voltage, and a 30° typical viewing angle.
Assembly guidance includes MSL 3 handling, up to two reflow soldering cycles, a recommended maximum welding temperature of 240±5°C for 6 s, and repair/rework hand soldering below 300°C with an iron under 30 W. Storage guidance covers unopened, opened, workshop, and baking conditions for moisture control.
Key Features
- Green SMD LED with transparent/water colloid construction
- 3.2 x 1.6 x 1.96 mm surface-mount package
- 4000 to 16000 mcd luminous intensity at 20 mA
- 515 to 530 nm dominant green wavelength range
- 2.5 to 3.3 V forward voltage at 20 mA
- 20 mA maximum continuous forward current at Ta=25°C
- 80 mA peak forward current under specified pulse conditions
- 30° typical viewing angle at IF=20 mA
- MSL 3 moisture sensitivity level for assembly handling
- Operating and storage temperature range from -40 to +85°C
- RoHS Directive compliance stated in manufacturer datasheet
- Defined brightness, voltage, and wavelength bin tolerances
Typical Applications
- Green status indicators
- Surface-mount indicator assemblies
- Compact panel indicators
- Color-coded signal displays
- Backlight or marker positions
- PCB-mounted visual indication
- Equipment operating-state indication
Procurement Notes
When requesting a quote for XL-TD3216UGC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package size is specified for XL-TD3216UGC?
XL-TD3216UGC uses a 3.2 x 1.6 x 1.96 mm SMD LED package. The datasheet lists the outline dimensions as length, width, and height with a general dimension tolerance of ±0.25 mm unless otherwise noted.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 4000 to 16000 mcd luminous intensity, 515 to 530 nm dominant wavelength, 525 nm typical peak wavelength, 30 nm typical half wave width, and a 30° typical viewing angle.
What handling and storage limits apply after opening?
After opening the package, the datasheet specifies storage at <=30°C and <40% RH, with soldering within 168 hours. If the desiccant or package failed, or storage time was exceeded, baking at 60±5°C for 24 hours is specified.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.