Specifications
| Type | Description |
|---|---|
| Part Number | XL-TD3216UYC |
| Manufacturer | XINGLIGHT |
| Product Type | Yellow SMD LED |
| Category | LED |
| Inferred Category | LED |
| Component Type | LED |
| Package / Case | 3.2 x 1.6 x 1.96 mm SMD LED |
| Outline Dimensions | 3.2 x 1.6 x 1.96 mm (L/W/H) |
| Luminous Color | Yellow; transparent/water colloid lens |
| RoHS Compliance | Complies with RoHS Directive; environmental protection product |
| Moisture Sensitivity Level | MSL 3 |
| SMT Compatibility | Suitable for SMT automatic production; surface mount assembly |
| Reflow Compatibility | Suitable for infrared reflow soldering; IR reflow process |
| Maximum Power Dissipation | 50 mW at Ta=25°C |
| Maximum Continuous Forward Current | 20 mA at Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V at Ta=25°C |
| Antistatic Ability | 2000 V ESD rating at Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum ratings table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C absolute maximum ratings table |
| Lead Soldering Temperature/Time | 260°C <=6 s; Ta=25°C absolute maximum ratings table |
| Luminous Intensity | 400 to 1800 mcd at IF=20 mA, Ta=25°C |
| Dominant Wavelength | 585 to 595 nm at IF=20 mA, Ta=25°C |
| Peak Wavelength | 588 nm typ at IF=20 mA, Ta=25°C |
| Forward Voltage | 1.9 to 2.3 V at IF=20 mA, Ta=25°C |
| Viewing Angle | 30° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Half Wave Width | 20 nm typ at IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA at VR=5 V, Ta=25°C |
| Brightness Bin A5 | 400 to 500 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin A6 | 500 to 700 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin A7 | 700 to 900 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin A8 | 900 to 1200 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin A9 | 1200 to 1500 mcd at IF=20 mA, brightness error ±10% |
| Brightness Bin B1 | 1500 to 1800 mcd at IF=20 mA, brightness error ±10% |
| Voltage Bin N11-4 | 1.9 to 2.1 V at IF=20 mA, voltage error ±0.1 V |
| Voltage Bin N11-5 | 2.1 to 2.3 V at IF=20 mA, voltage error ±0.1 V |
| Wavelength Bin HY03 | 585 to 587.5 nm at IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HY04 | 587.5 to 590 nm at IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HY05 | 590 to 592.5 nm at IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HY06 | 592.5 to 595 nm at IF=20 mA, wavelength error ±1 nm |
| Default Test Ambient Temperature | 25 ±5 °C unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature and High Humidity Storage Test | 240 hours ±2 hours; Ta=85 ±5°C, RH=90 to 95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours; Ta=85 ±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40 ±5°C |
| Cold and Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot and Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100 ±5°C to -40 ±5°C; 20 min each |
| Anti-Tin Test | 260 ±5°C for 10 ±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C; time at peak 10 to 15 s; ramp <=3°C/s; above 183°C for 60 to 150 s; cooling <=6°C/s |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C; time at peak 5 to 10 s; ramp <=3°C/s; above 217°C for 60 to 120 s; cooling <=6°C/s |
| Solderability Test | 235 ±5°C, immersion time 2 ±0.5 s; immersion speed 25 ±2.5 mm/s; tin loading rate >=95% pad area |
| Dimensional Tolerance | ±0.25 mm unless otherwise noted |
| Hand Soldering Iron Power | <30 W; manual soldering recommended only for repair/rework |
| Hand Soldering Temperature | <300°C; each terminal less than 3 s, one time only |
| Maximum Reflow Count | 2 times; reflow soldering should not be done more than twice |
| Recommended Maximum Welding Temperature | 240 ±5°C for 6 s; product recommendation |
| Cleaning Condition | <=30°C for 3 min or <=50°C for 30 s; alcohol cleaning after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest recommended before cleaning |
| Unopened Storage Life | 1 year; sealed moisture-proof anti-electrostatic package with desiccant |
| Storage Before Opening | <=30°C, <=60% RH; use within 1 year |
| Storage After Opening | <=30°C, <=40% RH, solder within 168 hours / 7 days; recommended workshop condition <=30°C and <=60% RH |
| Baking Condition | 60 ±5°C for 24 hours; if desiccant/package fails or storage time exceeded |
| Datasheet Status | request_only |
Product Overview
The XINGLIGHT XL-TD3216UYC is a yellow surface-mount LED with a transparent/water colloid lens and 3.2 x 1.6 x 1.96 mm outline dimensions. It is categorized as an LED component and is intended for surface mount assembly where compact yellow indication is required.
Electrical and optical characteristics are specified at IF=20 mA and Ta=25°C. The device has a luminous intensity range of 400 to 1800 mcd, 585 to 595 nm dominant wavelength, 588 nm typical peak wavelength, 20 nm typical half-wave width, and 30° typical viewing angle. Forward voltage is specified from 1.9 to 2.3 V, with reverse current limited to <=1 µA at VR=5 V.
Assembly data includes SMT automatic production compatibility, infrared reflow compatibility, and a maximum of two reflow cycles. The datasheet also provides lead and lead-free reflow profiles, hand soldering limits, cleaning conditions, storage requirements, and baking guidance for moisture-controlled handling.
Key Features
- Yellow SMD LED with transparent/water colloid lens
- 3.2 x 1.6 x 1.96 mm outline dimensions
- 400 to 1800 mcd at IF=20 mA
- 585 to 595 nm dominant wavelength range
- 1.9 to 2.3 V forward voltage range
- 30° typical viewing angle at IF=20 mA
- 20 mA maximum continuous forward current
- MSL 3 moisture sensitivity level
- Suitable for SMT automatic production
- Compatible with infrared reflow soldering
- RoHS Directive compliant environmental protection product
- Two maximum reflow soldering cycles
Typical Applications
- Yellow status indication
- Surface-mount indicator assemblies
- Infrared reflow LED boards
- Compact PCB signal lights
- MSL-controlled SMT production
- Brightness-binned yellow indicators
- Voltage-binned LED assemblies
Procurement Notes
When requesting a quote for XL-TD3216UYC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package size does the XL-TD3216UYC use?
The XL-TD3216UYC uses a 3.2 x 1.6 x 1.96 mm SMD LED package. The outline dimensions are specified with a dimensional tolerance of ±0.25 mm unless otherwise noted.
What are the main optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 400 to 1800 mcd luminous intensity, 585 to 595 nm dominant wavelength, 588 nm typical peak wavelength, 20 nm typical half-wave width, and 30° typical viewing angle.
What current and voltage limits apply to this LED?
The maximum continuous forward current is 20 mA at Ta=25°C. Peak forward current is 80 mA for pulse width <=0.1 ms and duty <=1/10. Maximum reverse voltage is 5 V, and forward voltage is 1.9 to 2.3 V at 20 mA.
How should XL-TD3216UYC be handled after opening?
After opening, storage is specified at <=30°C and <=40% RH, with soldering within 168 hours or 7 days. If the desiccant or package fails or storage time is exceeded, baking is specified at 60 ±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.