Specifications
| Type | Description |
|---|---|
| Part Number | XL-TD3224SURUGC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | 3.2 x 2.7 x 2.2 mm SMD package |
| Component Type | LED |
| Inferred Category | LED |
| Outline Dimensions | 3.2 x 2.7 x 2.2 mm |
| Luminous Color | Red and green |
| Lens/Colloid | Transparent colloid |
| RoHS Compliance | Complied with RoHS Directive |
| Moisture Sensitivity Level | MSL 3 |
| SMT Compatibility | Suitable for SMT automatic production |
| Reflow Soldering Compatibility | Suitable for reflow soldering process |
| Power Dissipation Red | 50 mW |
| Power Dissipation Green | 70 mW |
| Peak Forward Current Red | 80 mA |
| Peak Forward Current Green | 80 mA |
| Forward Working Current Red | 20 mA |
| Forward Working Current Green | 20 mA |
| Reverse Voltage Red | 5 V |
| Reverse Voltage Green | 5 V |
| ESD Withstand Voltage | 2000 V |
| Operating Ambient Temperature | -40°C to +85°C |
| Storage Temperature | -40°C to +85°C |
| Reflow Soldering Limit | 260°C, 6 s |
| Manual Soldering Limit | 300°C, 3 s |
| Luminous Intensity Red | 500-900 mcd |
| Luminous Intensity Green | 2000-4000 mcd |
| Dominant Wavelength Red | 615-630 nm, typ 625 nm |
| Dominant Wavelength Green | 515-530 nm, typ 525 nm |
| Peak Wavelength Red | 620 nm typ |
| Peak Wavelength Green | 520 nm typ |
| Half Wave Width Red | 20 nm typ |
| Half Wave Width Green | 30 nm typ |
| Forward Voltage Red | 1.9-2.3 V |
| Forward Voltage Green | 2.8-3.4 V |
| Viewing Angle | 40 deg typ |
| Reverse Current Red | 1 uA max |
| Reverse Current Green | 1 uA max |
| Brightness Bin A6 | 500-700 mcd |
| Brightness Bin A7 | 700-900 mcd |
| Brightness Bin B3 | 2100-2500 mcd |
| Brightness Bin B4 | 2500-3000 mcd |
| Brightness Bin B5 | 3000-3500 mcd |
| Brightness Bin B6 | 3500-4000 mcd |
| Brightness Tolerance | ±10% |
| Voltage Bin N12-8 | 2.0-2.2 V |
| Voltage Bin N12-9 | 2.2-2.4 V |
| Voltage Bin R19-3 | 2.9-3.2 V |
| Voltage Tolerance | ±0.1 V |
| Wavelength Bin HR01 | 615-620 nm |
| Wavelength Bin HR02 | 620-625 nm |
| Wavelength Bin HR03 | 625-630 nm |
| Wavelength Bin HG02 | 515-520 nm |
| Wavelength Bin HG03 | 520-525 nm |
| Wavelength Bin HG04 | 525-530 nm |
| Wavelength Tolerance | ±1 nm |
| Default Test Ambient Temperature | 25±5°C |
| Moisture Proof Reliability Test | 260°C max reflow for 10 s, 2 reflows; preconditioning 30°C, 70% RH, 168 h |
| Lead-Free Reflow Reliability Test | 245±5°C max reflow for 5 s |
| Thermal Cycling Test | 100 cycles, -40°C 30 min to 25°C 5 min to 100°C 30 min to 25°C 5 min |
| Thermal Shock Test | 100 cycles, -35°C 15 min, 3 min conversion, 85°C 15 min |
| High Temperature Storage Test | Ta=100°C, 1000 h |
| Low Temperature Storage Test | Ta=-40°C, 1000 h |
| Normal Temperature Aging Test | Ta=25°C, IF=20 mA, 1000 h |
| Failure Criterion Forward Voltage | > U.S.L x 1.1 |
| Failure Criterion Luminous Intensity | < L.S.L x 0.7 |
| Failure Criterion Reverse Current | > U.S.L x 2.0 |
| Failure Criterion Welding Reliability | Solder paste covering pads <95% |
| Dimensional Tolerance | ±0.25 mm |
| Recommended Manual Soldering Iron Power | <30 W |
| Recommended Manual Soldering Temperature | <300°C |
| Maximum Reflow Cycles | 2 times |
| Recommended Maximum Soldering Temperature | 240±5°C for 6 s |
| Alcohol Cleaning Condition | <=30°C for 3 min or <=50°C for 30 s |
| Ultrasonic Cleaning Power | <=300 W |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 h / 7 days |
| Recommended Workshop Condition | <=30°C, <=60% RH |
| Baking Condition | 60±5°C for 24 h |
| Datasheet Status | request_only |
Product Overview
The XL-TD3224SURUGC is a XINGLIGHT red/green bi-color LED supplied in a compact 3.2 x 2.7 x 2.2 mm SMD package. The package uses transparent colloid and is specified for SMT automatic production, including reflow soldering processes.
Electrical and optical ratings are defined at Ta=25°C unless otherwise stated. At IF=20 mA, the red die provides 500-900 mcd with 615-630 nm dominant wavelength, while the green die provides 2000-4000 mcd with 515-530 nm dominant wavelength. Forward voltage is 1.9-2.3 V for red and 2.8-3.4 V for green, with a typical 40 degree viewing angle for both colors.
Assembly guidance includes a recommended reflow peak of 240±5°C for 6 s, a maximum of two reflow cycles, and manual soldering below 300°C for less than 3 s per terminal. The part is classified MSL 3 and should be managed within the stated unopened, opened, workshop, and baking conditions.
Key Features
- Red and green bi-color LED output
- 3.2 x 2.7 x 2.2 mm SMD package
- Transparent colloid package appearance
- Suitable for SMT automatic production
- Suitable for reflow soldering process
- MSL 3 moisture sensitivity classification
- 40 degree typical viewing angle at IF=20 mA
- Red luminous intensity range of 500-900 mcd
- Green luminous intensity range of 2000-4000 mcd
- RoHS Directive compliance stated in datasheet
Typical Applications
- Red and green status indicators
- Compact SMT indicator assemblies
- Panel indication circuits
- Reflow-assembled LED boards
- Dual-color signal indication
- Moisture-controlled SMT production
- Temperature-rated electronic assemblies
Procurement Notes
When requesting a quote for XL-TD3224SURUGC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What type of LED is XL-TD3224SURUGC?
XL-TD3224SURUGC is a XINGLIGHT red/green bi-color LED. The datasheet identifies it as an LED in a 3.2 x 2.7 x 2.2 mm SMD package with transparent colloid.
What are the optical ratings at 20 mA?
At IF=20 mA and Ta=25°C, red luminous intensity is 500-900 mcd and green luminous intensity is 2000-4000 mcd. Dominant wavelength is 615-630 nm for red and 515-530 nm for green.
What forward voltage ranges are specified?
At IF=20 mA and Ta=25°C, the red LED forward voltage range is 1.9-2.3 V. The green LED forward voltage range is 2.8-3.4 V under the same test condition.
Is the part suitable for SMT reflow production?
Yes. The extracted datasheet facts state that XL-TD3224SURUGC is suitable for SMT automatic production and suitable for reflow soldering. The recommended product reflow peak is 240±5°C for 6 s, with two maximum reflow cycles.
What handling conditions apply after opening the package?
After opening, the storage condition is <=30°C and <=40% RH, and the part should be soldered within 168 hours or 7 days. If storage time is exceeded, the baking condition is 60±5°C for 24 hours.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.