XL-N1005SYGC040250-80201 Yellow-green SMD LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-N1005SYGC040250-80201 Yellow-green SMD LED

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Part Number
XL-N1005SYGC040250-80201
Manufacturer
XINGLIGHT
Package
SMD 1.0 x 0.5 x 0.4 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-N1005SYGC040250-80201 from XINGLIGHT is a yellow-green SMD LED in a 1.0 x 0.5 x 0.4 mm package with water colloid / transparent colloid encapsulation. The device is specified for 50 to 80 mcd luminous intensity at IF=20 mA and Ta=25°C, with a 565 to 575 nm dominant wavelength and 570 nm typical peak wavelength. Electrical ratings include 1.8 to 2.4 V forward voltage, 25 mA maximum continuous forward current, 75 mW maximum power dissipation, and 5 V maximum reverse voltage. It supports compact PCB indication, status lighting, and yellow-green visual signaling where 120° typical viewing angle and SMD assembly are required.

Specifications

TypeDescription
Part NumberXL-N1005SYGC040250-80201
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Outline Dimensions1.0 x 0.5 x 0.4 mm; L/W/H
Luminous ColorYellow-green; water/transparent colloid
Encapsulant / ColloidWater colloid / transparent colloid; product description
Moisture Sensitivity LevelMSL 3; moisture sensitivity level stated as 3 levels
Maximum Power Dissipation75 mW; Ta=25°C
Maximum Continuous Forward Current25 mA; Ta=25°C
Peak Forward Current80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C
Maximum Reverse Voltage5 V; Ta=25°C
ESD Withstand Voltage2000 V; antistatic ability, Ta=25°C
Operating Temperature Range-40 to +85 °C; Ta=25°C rating table
Storage Temperature Range-40 to +85 °C; Ta=25°C rating table
Lead Soldering Temperature / Time260°C <=6 s; absolute maximum rating
Luminous Intensity50 to 80 mcd; IF=20 mA, Ta=25°C
Dominant Wavelength565 to 575 nm; IF=20 mA, Ta=25°C
Peak Wavelength570 nm typ; IF=20 mA, Ta=25°C
Forward Voltage1.8 to 2.4 V; IF=20 mA, Ta=25°C
Spectral Half Width20 nm typ; IF=20 mA, Ta=25°C
Viewing Angle120° typ; 2θ1/2, IF=20 mA, Ta=25°C
Reverse Current<=1 µA; VR=5 V, Ta=25°C
Brightness Bin D150 to 80 mcd; IF=20 mA
Voltage Bin M17-91.8 to 1.9 V; IF=20 mA
Voltage Bin M18-11.9 to 2.0 V; IF=20 mA
Voltage Bin M18-22.0 to 2.1 V; IF=20 mA
Voltage Bin M18-32.1 to 2.2 V; IF=20 mA
Voltage Bin M18-42.2 to 2.3 V; IF=20 mA
Voltage Bin M18-52.3 to 2.4 V; IF=20 mA
Wavelength Bin HYG03565 to 567.5 nm; IF=20 mA
Wavelength Bin HYG04567.5 to 570 nm; IF=20 mA
Wavelength Bin HYG05570 to 572.5 nm; IF=20 mA
Wavelength Bin HYG06572.5 to 575 nm; IF=20 mA
Default Test Ambient Temperature25±5°C; unless otherwise indicated
Working Life Test1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA
High Temperature High Humidity Storage Test240 hours ±2 hours; IR reflow in-board 2 times; Ta=85±5°C, RH=90-95%
High Temperature Storage Test1000 hours; Ta=85±5°C
Low Temperature Storage Test1000 hours; Ta=-40±5°C
Cold and Hot Cycle Test100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min
Hot and Cold Impact Test100 cycles; IR reflow in-board 2 times; 100±5°C for 20 min, -40±5°C for 20 min
Anti-Tin Test260±5°C, 10±1 s, 2 times; soldering temperature T.sol
Lead Process Reflow Peak Temperature235°C +5/-0°C; keep at peak for 10-15 s
Lead-Free Reflow Peak Temperature255°C +0/-5°C; keep at peak for 5-10 s
Weldability Test Temperature235±5°C; immersion speed 25±2.5 mm/s, immersion time 2±0.5 s
Weldability Tin Loading Rate>=95% pad area; weldability test
Outline Dimension Tolerance±0.25 mm; unless otherwise noted
Tape / Reel Dimension Tolerance±0.1 mm; belt and disk dimensions
Hand Soldering Iron Power<30 W recommended; hand soldering for repair/rework
Hand Soldering Temperature<300°C; each terminal less than 3 s, one time only
Maximum Reflow Cycles2 times; reflow soldering
Recommended Maximum Welding Temperature240±5°C for 6 s; product recommendation
Alcohol Cleaning Condition<=30°C for 3 min or <=50°C for 30 s; after soldering
Ultrasonic Cleaning Power<=300 W generally; pretest required before cleaning
Unopened Storage Condition<=30°C, <=60% RH, use within 1 year; before opening package
Opened Storage Condition<=30°C, <=40% RH, solder within 168 hours / 7 days; after opening package
Recommended Workshop Condition<=30°C, <=60% RH; product operation/workshop recommendation
Baking Condition60±5°C for 24 hours; if moisture absorbent faded or storage time exceeded
Datasheet Statusrequest_only

Product Overview

XL-N1005SYGC040250-80201 is a XINGLIGHT yellow-green SMD LED supplied in a compact 1.0 x 0.5 x 0.4 mm L/W/H outline. The datasheet identifies the luminous color as yellow-green and describes the encapsulant as water colloid / transparent colloid, with moisture sensitivity level MSL 3.

At IF=20 mA and Ta=25°C, the LED is specified for 50 to 80 mcd luminous intensity, 565 to 575 nm dominant wavelength, 570 nm typical peak wavelength, 20 nm typical spectral half width, and 120° typical viewing angle. Forward voltage is specified from 1.8 to 2.4 V, with voltage bins spanning 1.8 to 2.4 V and wavelength bins spanning 565 to 575 nm.

Absolute maximum ratings include 75 mW power dissipation, 25 mA continuous forward current, 80 mA peak forward current under pulsed conditions, and 5 V reverse voltage. Assembly data covers lead and lead-free reflow profiles, hand soldering limits, cleaning conditions, storage conditions, and baking guidance for moisture control.

Key Features

  • Yellow-green SMD LED in 1.0 x 0.5 x 0.4 mm package
  • Water colloid / transparent colloid encapsulation
  • MSL 3 moisture sensitivity classification
  • 50 to 80 mcd luminous intensity at 20 mA
  • 565 to 575 nm dominant wavelength range
  • 1.8 to 2.4 V forward voltage at 20 mA
  • 120° typical viewing angle at 20 mA
  • 25 mA maximum continuous forward current
  • 75 mW maximum power dissipation at 25°C
  • -40 to +85°C operating temperature range
  • 2000 V ESD withstand voltage rating
  • Lead-free reflow peak temperature of 255°C +0/-5°C

Typical Applications

  • Compact PCB status indicators
  • Yellow-green signal indication
  • Panel indicator lighting
  • Portable device indicators
  • Consumer electronics indicators
  • SMD visual status lighting

Procurement Notes

When requesting a quote for XL-N1005SYGC040250-80201, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package size does XL-N1005SYGC040250-80201 use?

XL-N1005SYGC040250-80201 uses an SMD package with outline dimensions of 1.0 x 0.5 x 0.4 mm. The listed outline dimension tolerance is ±0.25 mm unless otherwise noted.

What optical output is specified at 20 mA?

At IF=20 mA and Ta=25°C, the device is specified for 50 to 80 mcd luminous intensity, 565 to 575 nm dominant wavelength, 570 nm typical peak wavelength, and 20 nm typical spectral half width.

What are the main electrical limits for this LED?

The datasheet lists 75 mW maximum power dissipation, 25 mA maximum continuous forward current, 80 mA peak forward current under pulsed conditions, 5 V maximum reverse voltage, and 2000 V ESD withstand voltage.

How should opened packages be stored before soldering?

After opening the package, the storage condition is <=30°C and <=40% RH, with soldering within 168 hours or 7 days. If storage time is exceeded or the moisture absorbent faded, baking is specified at 60±5°C for 24 hours.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 6, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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