XL-N1005UBC Blue SMD Chip LED

Specifications

Product Overview

XL-N1005UBC is a XINGLIGHT blue SMD chip LED supplied in a 1005 surface-mount outline. The package dimensions are 1.0 x 0.5 x 0.4 mm, with an outline dimension tolerance of ±0.25 mm unless otherwise noted. The LED has a water-clear transparent colloid and is specified as MSL 3 for moisture sensitivity handling.

At IF=20 mA and Ta=25°C, the device provides 80 to 210 mcd luminous intensity, a 460 to 475 nm dominant wavelength range, 465 nm typical peak wavelength, 25 nm typical half-wave width, and 120° typical viewing angle. Forward voltage is specified from 2.6 to 3.2 V at the same current and temperature. Maximum ratings include 75 mW power dissipation, 25 mA continuous forward current, 80 mA peak forward current under pulsed conditions, 5 V reverse voltage, and 2000 V ESD capability.

Assembly guidance includes 260°C lead soldering for no more than 6 seconds, up to two reflow cycles, and a recommended maximum soldering condition of 240±5°C for 6 seconds. The part is suited to compact blue indication functions where a small SMD LED footprint and defined optical bins are required.

Key Features

• 1005 SMD LED package, 1.0 x 0.5 x 0.4 mm
• Blue luminous output with water-clear transparent colloid
• 80 to 210 mcd luminous intensity at 20 mA
• 460 to 475 nm dominant wavelength range
• 2.6 to 3.2 V forward voltage at 20 mA
• 120° typical viewing angle at 20 mA
• 25 mA maximum continuous forward current rating
• MSL 3 moisture sensitivity classification
• -40 to +85°C operating temperature range
• Brightness, voltage, and wavelength bin options specified

Typical Applications

• Compact PCB status indicators
• Blue panel indication
• Space-constrained signal lamps
• Portable electronics indicators
• Instrument cluster indicator points
• Backlight or marker LED positions
• Low-current visual status outputs

Procurement Notes

When requesting a quote for XL-N1005UBC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.