XL-TD2012SURC High Brightness Red SMD LED

XINGLIGHT LED — specifications, applications, sourcing support and RFQ.

XL-TD2012SURC High Brightness Red SMD LED

RFQ Available Sourcing Support Alternative Matching RoHS
Part Number
XL-TD2012SURC
Manufacturer
XINGLIGHT
Package
SMD 2012, 2.0 x 1.25 x 1.4 mm
Category
LED
Product Type
SMD LED

Quick Sourcing Note

XL-TD2012SURC from XINGLIGHT is a high brightness red SMD LED in a 2012 package measuring 2.0 x 1.25 x 1.4 mm. It uses transparent colloid and is intended for SMT automatic production with infrared reflow soldering. Key electrical and optical ratings include 300-1200 mcd luminous intensity, 615-630 nm dominant wavelength, 625 nm typical peak wavelength, 1.9-2.3 V forward voltage, and 30° typical viewing angle at IF=20 mA. Absolute maximum ratings include 20 mA continuous forward current, 80 mA peak forward current under pulse conditions, 50 mW power dissipation, 5 V reverse voltage, and -40 to +85 °C operating range.

Specifications

TypeDescription
Part NumberXL-TD2012SURC
ManufacturerXINGLIGHT
Product TypeSMD LED
CategoryLED
Package / CaseSMD 2012, 2.0 x 1.25 x 1.4 mm
Outline Dimensions2.0 x 1.25 x 1.4 mm; L/W/H
Luminous ColorHigh brightness red; transparent colloid
Lens/ColloidTransparent colloid; product appearance
RoHS ComplianceComplies with RoHS Directive; environmental protection product
Moisture Sensitivity LevelMSL 3
SMT CompatibilitySuitable for SMT automatic production
Reflow CompatibilitySuitable for infrared reflow soldering process
Maximum Power Dissipation50 mW; Ta=25°C
Maximum Continuous Forward Current20 mA; Ta=25°C
Peak Forward Current80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C
Maximum Reverse Voltage5 V; Ta=25°C
ESD Rating2000 V; antistatic ability, Ta=25°C
Operating Temperature Range-40 to +85 °C; Ta=25°C absolute maximum rating table
Storage Temperature Range-40 to +85 °C; Ta=25°C absolute maximum rating table
Lead Soldering Temperature/Time260°C <=6 s; absolute maximum rating
Luminous Intensity300-1200 mcd; IF=20 mA, Ta=25°C
Dominant Wavelength615-630 nm; IF=20 mA, Ta=25°C
Peak Wavelength625 nm typ; IF=20 mA, Ta=25°C
Forward Voltage1.9-2.3 V; IF=20 mA, Ta=25°C
Viewing Angle30° typ; 2θ1/2, IF=20 mA, Ta=25°C
Reverse Current<=5 µA; VR=5 V, Ta=25°C
Brightness Bin A4300-400 mcd; IF=20 mA
Brightness Bin A5400-500 mcd; IF=20 mA
Brightness Bin A6500-700 mcd; IF=20 mA
Brightness Bin A7700-900 mcd; IF=20 mA
Brightness Bin A8900-1200 mcd; IF=20 mA
Brightness Tolerance±10%; brightness grading
Voltage Bin N11-41.9-2.1 V; IF=20 mA
Voltage Bin N11-52.1-2.3 V; IF=20 mA
Voltage Tolerance±0.1 V; voltage grading
Wavelength Bin HR01615-620 nm; IF=20 mA
Wavelength Bin HR02620-625 nm; IF=20 mA
Wavelength Bin HR03625-630 nm; IF=20 mA
Wavelength Tolerance±1 nm; wavelength grading
Default Test Ambient Temperature25±5°C; unless otherwise indicated
Working Life Test1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA
High Temperature High Humidity Storage Test240±2 hours; IR reflow in-board 2 times; Ta=85±5°C, RH=90-95%
High Temperature Storage Test1000 hours; Ta=85±5°C
Low Temperature Storage Test1000 hours; Ta=-40±5°C
Cold and Hot Cycle Test100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min
Hot and Cold Impact Test100 cycles; IR reflow in-board 2 times; 100±5°C for 20 min, -40±5°C for 20 min
Anti-Tin Test260±5°C, 10±1 s, 2 times; soldering temperature T.sol
Hand Soldering Iron Power<30 W; recommended for hand soldering repair/rework
Hand Soldering Temperature<300°C; each terminal once only, less than 3 s
Recommended Maximum Welding Temperature240±15°C for 6 s; product soldering recommendation
Maximum Reflow Cycles2 times; reflow soldering
Cleaning ConditionAlcohol cleaning under 30°C for 3 min or under 50°C for 30 s; after soldering
Ultrasonic Cleaning Power<=300 W; pretest required before ultrasonic cleaning
Unopened Storage Life1 year; moisture-proof anti-electrostatic package with desiccant; <=30°C and <60% RH before opening
Opened Package Floor Life168 hours / 7 days; after opening, store at <=30°C and <40% RH
Recommended Workshop Condition<=30°C and <60% RH; operation after opening package
Baking Condition60±5°C for 24 hours; if desiccant fades, package fails, or storage time exceeded
Datasheet Statusrequest_only

Product Overview

The XL-TD2012SURC is a XINGLIGHT high brightness red SMD LED supplied in an SMD 2012 package with 2.0 x 1.25 x 1.4 mm outline dimensions. The product appearance uses transparent colloid, and the device is specified as RoHS compliant with moisture sensitivity level MSL 3.

At IF=20 mA and Ta=25°C, the LED provides 300-1200 mcd luminous intensity, 615-630 nm dominant wavelength, 625 nm typical peak wavelength, 1.9-2.3 V forward voltage, and a 30° typical viewing angle. Reverse current is specified at <=5 µA with VR=5 V.

Assembly data supports SMT automatic production and infrared reflow soldering. The datasheet lists a recommended maximum welding temperature of 240±15°C for 6 s and a maximum of two reflow cycles. Storage and handling guidance includes 1 year unopened storage life, 168 hours opened package floor life, and baking at 60±5°C for 24 hours when required.

Key Features

  • High brightness red emission with transparent colloid
  • SMD 2012 package, 2.0 x 1.25 x 1.4 mm
  • 300-1200 mcd luminous intensity at IF=20 mA
  • 615-630 nm dominant wavelength at IF=20 mA
  • 1.9-2.3 V forward voltage at IF=20 mA
  • 30° typical viewing angle at IF=20 mA
  • 20 mA maximum continuous forward current at Ta=25°C
  • 80 mA peak forward current under specified pulse conditions
  • MSL 3 moisture sensitivity level
  • Suitable for SMT automatic production and infrared reflow

Typical Applications

  • Red status indicators
  • Compact SMT indicator circuits
  • Reflow assembled PCB indicators
  • Brightness-binned LED assemblies
  • Narrow-angle visual indication
  • Red wavelength indication circuits

Procurement Notes

When requesting a quote for XL-TD2012SURC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.

FAQ

What package size does XL-TD2012SURC use?

XL-TD2012SURC uses an SMD 2012 package with outline dimensions of 2.0 x 1.25 x 1.4 mm. The datasheet lists the dimensions as length, width, and height.

What are the main optical specifications at 20 mA?

At IF=20 mA and Ta=25°C, the LED is specified for 300-1200 mcd luminous intensity, 615-630 nm dominant wavelength, 625 nm typical peak wavelength, and a 30° typical viewing angle.

What forward voltage range is specified for XL-TD2012SURC?

The forward voltage range is 1.9-2.3 V at IF=20 mA and Ta=25°C. The datasheet also provides voltage bins N11-4 at 1.9-2.1 V and N11-5 at 2.1-2.3 V.

Is this LED compatible with SMT reflow assembly?

Yes. The datasheet states that the part is suitable for SMT automatic production and suitable for an infrared reflow soldering process. The recommended maximum welding condition is 240±15°C for 6 s.

What storage handling limits apply after opening the package?

After opening, the floor life is 168 hours or 7 days when stored at <=30°C and <40% RH. The recommended workshop condition after opening is <=30°C and <60% RH.

Technical Review & Sourcing Note

Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.

This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.

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