XL-TD2012UWC High Brightness White SMD LED

Specifications

Product Overview

XL-TD2012UWC is a XINGLIGHT high brightness white SMD LED with a 2.0 x 1.25 x 1.4 mm L/W/H outline. The package uses yellow colloid and is categorized as an LED component. At IF=20 mA and Ta=25°C, the device is specified for 700 to 1800 mcd luminous intensity, 8000 to 12000 K color temperature, 2.6 to 3.4 V forward voltage, and a 30° typical viewing angle. CIE X and CIE Y coordinates are not specified in the extracted datasheet data.

Electrical and environmental limits include 70 mW maximum power dissipation, 20 mA maximum continuous forward current, 80 mA peak forward current under the stated pulse condition, 5 V maximum reverse voltage, 5 µA maximum reverse current at VR=5 V, and 2000 V antistatic ability. The operating and storage temperature ranges are both -40 to +85°C.

Assembly data includes MSL 3 handling, RoHS compliance, lead soldering at 260°C for no more than 6 s, a recommended maximum welding condition of 240±5°C for 6 s, and a maximum of two reflow cycles. Storage guidance covers unopened, opened, workshop, and baking conditions.

Key Features

• 2.0 x 1.25 x 1.4 mm SMD LED package
• High brightness white output with yellow colloid
• 700 to 1800 mcd at IF=20 mA
• 8000 to 12000 K color temperature range
• 2.6 to 3.4 V forward voltage at 20 mA
• 30° typical viewing angle at IF=20 mA
• 20 mA maximum continuous forward current
• MSL 3 moisture sensitivity level
• RoHS Directive compliant environmental product
• -40 to +85°C operating temperature range
• Two maximum reflow soldering cycles
• Opened package solder window is 168 hours

Typical Applications

• Compact white status indicators
• PCB signal indication
• Panel illumination points
• White backlight points
• Portable device indicator lighting
• Reflow-soldered SMD assemblies
• Moisture-controlled LED assembly
• Low-current white light points

Procurement Notes

When requesting a quote for XL-TD2012UWC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.

If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.

For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.