Specifications
| Type | Description |
|---|---|
| Part Number | XL-TD3216SURC |
| Manufacturer | XINGLIGHT |
| Product Type | SMD LED |
| Category | LED |
| Package / Case | SMD LED, 3.2 x 1.6 x 1.96 mm |
| Outline Dimensions | 3.2 x 1.6 x 1.96 mm; L/W/H |
| Emitting Color | High brightness red; transparent colloid/lens |
| Moisture Sensitivity Level | MSL 3 |
| RoHS Compliance | Compliant with RoHS Directive |
| Maximum Power Dissipation | 50 mW; Ta=25°C |
| Maximum Continuous Forward Current | 20 mA; Ta=25°C |
| Peak Forward Current | 80 mA; pulse width <=0.1 ms, duty <=1/10, Ta=25°C |
| Maximum Reverse Voltage | 5 V; Ta=25°C |
| ESD Rating | 2000 V; antistatic ability, Ta=25°C |
| Operating Temperature Range | -40 to +85 °C; Ta=25°C rating table |
| Storage Temperature Range | -40 to +85 °C; Ta=25°C rating table |
| Lead Soldering Temperature/Time | 260°C <=6 s; Ta=25°C rating table |
| Luminous Intensity | 900 to 2025 mcd; IF=20 mA, Ta=25°C |
| Dominant Wavelength | 615 to 625 nm; IF=20 mA, Ta=25°C |
| Peak Wavelength | 620 nm typ; IF=20 mA, Ta=25°C |
| Forward Voltage | 1.9 to 2.3 V; IF=20 mA, Ta=25°C |
| Viewing Angle | 30° typ; 2θ1/2, IF=20 mA, Ta=25°C |
| Spectral Half Width | 20 nm typ; IF=20 mA, Ta=25°C |
| Reverse Current | <=1 µA; VR=5 V, Ta=25°C |
| Brightness Bin A8 | 900 to 1200 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin A9 | 1200 to 1500 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin B1 | 1500 to 1800 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin B2 | 1800 to 2100 mcd; IF=20 mA, brightness error ±10% |
| Brightness Bin B3 | 2100 to 2500 mcd; IF=20 mA, brightness error ±10% |
| Voltage Bin N11-4 | 1.9 to 2.1 V; IF=20 mA, voltage error ±0.1 V |
| Voltage Bin N11-5 | 2.1 to 2.3 V; IF=20 mA, voltage error ±0.1 V |
| Wavelength Bin HR01 | 615 to 620 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HR02 | 620 to 625 nm; IF=20 mA, wavelength error ±1 nm |
| Wavelength Bin HR03 | 625 to 630 nm; IF=20 mA, wavelength error ±1 nm |
| Default Test Temperature | 25±5°C; unless otherwise indicated |
| Working Life Test | 1000 hours; continuous lighting at maximum rated current at room temperature; tested at 20 mA |
| High Temperature High Humidity Storage Test | 240 hours ±2 hours; Ta=85±5°C, RH=90-95%, IR reflow in-board 2 times |
| High Temperature Storage Test | 1000 hours; Ta=85±5°C |
| Low Temperature Storage Test | 1000 hours; Ta=-40±5°C |
| Cold/Hot Cycle Test | 100 cycles; 105°C 30 min, 25°C 5 min, -55°C 30 min, 25°C 5 min |
| Hot/Cold Impact Test | 100 cycles; IR reflow in-board 2 times; 100±5°C to -40±5°C; 20 min each |
| Anti-Tin Test | 260±5°C for 10±1 s, 2 times; soldering temperature T.sol |
| Lead Process Reflow Peak Temperature | 235°C +5/-0°C for 10-15 s; ramp max 3°C/s from 183°C to peak; above 183°C for 60-150 s; cooling max 6°C/s |
| Lead-Free Reflow Peak Temperature | 255°C +0/-5°C for 5-10 s; ramp max 3°C/s from 217°C to peak; above 217°C for 60-120 s; cooling max 6°C/s |
| Weldability Test | 235±5°C, immersion time 2±0.5 s; immersion speed 25±2.5 mm/s; tin loading rate >=95% pad area |
| Dimension Tolerance | ±0.25 mm; unless otherwise noted |
| Hand Soldering Temperature | <300°C; soldering iron <30 W; each terminal <3 s, one time only |
| Maximum Reflow Cycles | 2 times maximum; reflow soldering |
| Recommended Maximum Welding Temperature | 240±5°C for 6 s; product recommendation |
| Cleaning Condition | Alcohol cleaning under 30°C for 3 min or under 50°C for 30 s; after soldering |
| Ultrasonic Cleaning Power | <=300 W; pretest required before cleaning |
| Unopened Storage Condition | <=30°C, <=60% RH, use within 1 year; before opening moisture-proof anti-electrostatic package |
| Opened Storage Condition | <=30°C, <=40% RH, solder within 168 hours / 7 days; after opening package |
| Recommended Workshop Condition | <=30°C, <=60% RH; after opening package |
| Baking Condition | 60±5°C for 24 hours; if desiccant failed or LEDs exceeded storage time |
| Datasheet Source | Manufacturer technical datasheet |
| Datasheet Status | request_only |
Product Overview
XL-TD3216SURC is a XINGLIGHT high brightness red SMD LED supplied in a 3.2 x 1.6 x 1.96 mm outline. The datasheet identifies the emitting color as high brightness red with a transparent colloid/lens, making it suitable for compact red visual indication and display segments where a defined SMD footprint is required.
At IF=20 mA and Ta=25°C, the LED is specified for 900 to 2025 mcd luminous intensity, 615 to 625 nm dominant wavelength, 620 nm typical peak wavelength, 1.9 to 2.3 V forward voltage, 20 nm typical spectral half width, and 30° typical viewing angle. Absolute ratings include 20 mA continuous forward current, 80 mA peak forward current under the stated pulse condition, 50 mW power dissipation, 5 V reverse voltage, and 2000 V antistatic ability.
Assembly data includes MSL 3 moisture sensitivity, two reflow cycles maximum, lead-free reflow peak of 255°C +0/-5°C for 5-10 s, and opened-package soldering within 168 hours at <=30°C and <=40% RH.
Key Features
- High brightness red emission with transparent colloid/lens
- 3.2 x 1.6 x 1.96 mm SMD outline
- 900 to 2025 mcd luminous intensity at 20 mA
- 615 to 625 nm dominant wavelength at 20 mA
- 1.9 to 2.3 V forward voltage at 20 mA
- 30° typical viewing angle at 20 mA
- 20 mA maximum continuous forward current
- 80 mA peak forward current under pulsed condition
- MSL 3 moisture sensitivity level
- RoHS Directive compliant environmental product
Typical Applications
- Red status indicators
- Compact SMD display lighting
- Panel indication lights
- Signal and warning indicators
- PCB-mounted red visual alerts
- Narrow-angle red light points
Procurement Notes
When requesting a quote for XL-TD3216SURC, buyers should confirm the manufacturer, package or case, required quantity, target date code, compliance documents, packing method, destination country and expected delivery schedule.
If alternatives are acceptable, buyers should share the approved vendor list, required electrical or optical limits, package constraints and qualification requirements. Any alternative part should be reviewed by the buyer's engineering team before production use.
For LED and optoelectronic sourcing, brightness bin, wavelength or color temperature bin, forward voltage range, viewing angle, moisture sensitivity level and soldering process limits may affect final selection, availability and lead time.
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FAQ
What package size is specified for XL-TD3216SURC?
XL-TD3216SURC uses an SMD LED package with 3.2 x 1.6 x 1.96 mm outline dimensions. The datasheet lists the dimension tolerance as ±0.25 mm unless otherwise noted.
What are the main optical specifications at 20 mA?
At IF=20 mA and Ta=25°C, the LED is specified for 900 to 2025 mcd luminous intensity, 615 to 625 nm dominant wavelength, 620 nm typical peak wavelength, 20 nm typical spectral half width, and 30° typical viewing angle.
What forward voltage range does this red LED use?
The forward voltage is specified as 1.9 to 2.3 V at IF=20 mA and Ta=25°C. Voltage bins include N11-4 from 1.9 to 2.1 V and N11-5 from 2.1 to 2.3 V, with ±0.1 V voltage error.
What storage rules apply after opening the package?
After opening the package, storage should be <=30°C and <=40% RH, with soldering completed within 168 hours or 7 days. The recommended workshop condition after opening is <=30°C and <=60% RH.
Technical Review & Sourcing Note
Prepared by LDeepAI Component Sourcing Team. Reviewed for RFQ, documentation and alternative sourcing use. Last updated: July 4, 2026.
This page is based on manufacturer datasheet information and LDeepAI sourcing review. Specifications should be verified against the official manufacturer datasheet before final procurement or design approval. Final electrical, optical and reliability approval should be confirmed by the buyer's engineering team.